ADP5033 Analog Devices, ADP5033 Datasheet - Page 6

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ADP5033

Manufacturer Part Number
ADP5033
Description
Dual 3 MHz, 800 mA Buck Regulators with Two 300 mA LDOs
Manufacturer
Analog Devices
Datasheet

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ADP5033
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
VIN1 to AGND
VIN2 to VIN1
PGND1, PGND2 to AGND
VIN3, VIN4, VOUT1, VOUT2, ENA, ENB,
VOUT3 to AGND
VOUT4 to AGND
SW1 to PGND1
SW2 to PGND2
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
For detailed information on power dissipation, see the Power
Dissipation and Thermal Considerations section.
MODE to AGND
Rating
−0.3 V to +6 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to
(VIN1 + 0.3 V)
−0.3 V to
(VIN3 + 0.3 V)
−0.3 V to
(VIN4 + 0.3 V)
−0.3 V to
(VIN1 + 0.3 V)
−0.3 V to
(VIN2 + 0.3 V)
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Rev. A | Page 6 of 28
THERMAL RESISTANCE
θ
device soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
16-Ball, 0.5 mm Pitch WLCSP
ESD CAUTION
JA
and Ψ
JB
are specified for the worst-case conditions, that is, a
θ
57
JA
Data Sheet
Ψ
14
JB
Unit
°C/W

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