TDA1517ATW NXP Semiconductors, TDA1517ATW Datasheet

TDA1517ATW

Manufacturer Part Number
TDA1517ATW
Description
Manufacturer
NXP Semiconductors
Datasheet

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Product specification
Supersedes data of 2001 Feb 14
DATA SHEET
TDA1517ATW
8 W BTL or 2 × 4 W SE power
amplifier
INTEGRATED CIRCUITS
2001 Apr 17

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TDA1517ATW Summary of contents

Page 1

... DATA SHEET TDA1517ATW 8 W BTL or 2 × power amplifier Product specification Supersedes data of 2001 Feb 14 INTEGRATED CIRCUITS 2001 Apr 17 ...

Page 2

... Reverse polarity safe • Capable of handling high energy on outputs (V • No switch-on/switch-off plop • Low thermal resistance. GENERAL DESCRIPTION The TDA1517ATW is an integrated class-AB output amplifier contained in a plastic heatsink thin shrink small outline package (HTSSOP20). The device is primarily developed for multimedia applications. P CONDITIONS THD = 10% ...

Page 3

... VA − kΩ mute switch input reference voltage 4 SGND Fig.1 Block diagram. 3 Product specification TDA1517ATW OUT1a 9 OUT1b power stage TDA1517ATW 17 MODE not 7 mute connected 14 switch 19 20 standby reference voltage 12 OUT2a 13 OUT2b power stage 10 11 MGU303 PGND1 ...

Page 4

... FUNCTIONAL DESCRIPTION The TDA1517ATW contains two identical amplifiers with differential input stages. This device can be used for Bridge-Tied Load (BTL) or Single-Ended (SE) applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mode select switch. Since this pin has a very low input current (<40 μA), a low cost supply switch can be used. With this switch the TDA1517ATW can be switched into three modes: • ...

Page 5

... Note 1. The circuit is DC adjusted at V 2001 Apr 17 CONDITIONS CONDITIONS CONDITIONS note 1 = ∞ MODE = and AC operating Product specification TDA1517ATW MIN. MAX. − 18 − 18 − 6 − 200 − 4 − 2.5 − 5 − 150 −55 +150 − ...

Page 6

... R S − on kΩ S − mute; note 6 − note 7 6 Product specification TDA1517ATW TYP. MAX. UNIT − 3.3 W − − 0.1 % − − − kHz − − ...

Page 7

... kΩ STANDBY/ MODE MUTE LOGIC V CC 8.2 15 kΩ 5 kΩ input 15 kΩ reference voltage Fig.3 BTL application block diagram. 7 TDA1517ATW 100 +OUT −OUT B 13 SHORT CIRCUIT AND TEMPERATURE PROTECTION MGU304 ...

Page 8

... SVR reduces the noise and ripple on the midrail voltage. For good THD and noise performance a low ESR capacitor is recommended. Input configuration It should be noted that the DC level of the input pins is approximately 2 coupling capacitor is therefore necessary. 8 TDA1517ATW 100 1000 μ ...

Page 9

... MODE pin rapidly on and off may cause ‘click and pop’ noise. This can be prevented by proper timing on the MODE pin. Further improvement in the BTL application can be obtained by connecting an electrolytic capacitor (e.g. 100 μF) between the SVRR pin and signal ground. 9 TDA1517ATW P 5 tot = ---------------- - ...

Page 10

... R th(j-a) R th(j- number of 35 μm copper layers 10 TDA1517ATW = 8 Ω the (ALL-) music power = 12 V and × °C + 2.0 × 134 ° amb th(j-a) ON-BOARD-COOLING COPPER DESIGN ...

Page 11

... Fig.6 Printed-circuit board layout for BTL and SE application. 2001 Apr 1517ATW 1000 μ 100 nF 220 nF IN2 Std By 100 μF/ 1000 μ sept −2000 − OUT2 + OUT1 top view component layout 11 Product specification TDA1517ATW top view top copper layout TDA IN1 MGU312 ...

Page 12

... Fig.9 SVRR as a function of frequency. 2001 Apr Ω L MGU307 handbook, halfpage ( MGU309 handbook, halfpage (kHz) 12 Product specification TDA1517ATW 10 THD (%) 1 −1 10 −2 10 −2 − Fig.8 THD as a function of frequency (V) 1 −1 10 −2 10 − ...

Page 13

... Ω Fig.11 Power dissipation as a function of P 2001 Apr 17 MGU311 handbook, halfpage ( Product specification TDA1517ATW ( Ω 8 Ω Fig. function MGU323 16 Ω ...

Page 14

... Apr 2.5 scale (1) ( 0.30 0.20 6.6 4.3 4.5 3.1 0.19 0.09 6.4 4.1 4.3 2.9 REFERENCES JEDEC JEITA MO-153 14 TDA1517ATW detail 6.6 0.75 0.65 1 0.2 0.13 6.2 0.50 EUROPEAN PROJECTION Product specification SOT527 θ ...

Page 15

... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 °C. 15 Product specification TDA1517ATW ...

Page 16

... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Apr 17 SOLDERING METHOD WAVE not suitable (2) not suitable suitable (3)(4) not recommended (5) not recommended 16 Product specification TDA1517ATW (1) REFLOW suitable suitable suitable suitable suitable ...

Page 17

... NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. 17 Product specification TDA1517ATW DEFINITION ...

Page 18

... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 18 Product specification TDA1517ATW ...

Page 19

... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. The Ordering information was modified accordingly. ...

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