TDA8953 NXP Semiconductors, TDA8953 Datasheet
TDA8953
Available stocks
Related parts for TDA8953
TDA8953 Summary of contents
Page 1
... Rev. 01 — 24 December 2009 1. General description The TDA8953 is a stereo or mono high-efficiency Class D audio power amplifier in a single IC featuring low power dissipation designed to deliver × 210 W into a 4 Ω load in a stereo Single-Ended (SE) application × 420 W into an 8 Ω load in a mono Bridge-Tied Load (BTL) application. It combines the benefits of Class D efficiency (≈ ...
Page 2
... 680 nF (see Ω; THD + Figure 13 − measurement; see Section 14.3. DSon Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier Min Typ Max Unit [1] 12.5 41 42.5 V −12.5 −41 −42 ...
Page 3
... MODE MODE 2 (19) SGND mute 5 (22) IN2P INPUT 4 (21) STAGE IN2M 1 (18) 12 (6) VSSA n.c. Pin numbers in brackets refer to type number TDA8953J. Fig 1. Block diagram TDA8953_1 Product data sheet STABI PROT 18 (12) 13 (7) PWM SWITCH1 CONTROL MODULATOR AND HANDSHAKE STABI TEMPERATURE SENSOR ...
Page 4
... Product data sheet 1 VSSA 2 SGND 3 VDDA 4 IN2M 5 IN2P 6 MODE 7 OSC 8 IN1P 9 IN1M 10 n.c. 11 OSCREF 12 n.c. 010aaa617 Fig 3. Pin configuration TDA8953J Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier OSC 1 2 IN1P 3 IN1M n.c. 4 OSCREF 5 n. PROT 8 VDDP1 BOOT1 9 OUT1 10 VSSP1 11 TDA8953J ...
Page 5
... VSSA 8. Functional description 8.1 General The TDA8953 is a two-channel audio power amplifier that uses Class D technology. For each channel, the audio input signal is converted into a digital Pulse Width Modulation (PWM) signal using an analog input stage and a PWM modulator; see the output power transistors, the digital PWM signal is fed to a control and handshake block and to high- and low-side driver circuits ...
Page 6
... Each of the two audio channels contains a PWM modulator, an analog feedback loop and a differential input stage. The TDA8953 also contains circuits common to both channels such as the oscillator, all reference sources, the mode interface and a digital timing manager ...
Page 7
... V (SGND) 100 ⁄ 1 pulse down. 4 Table 9), but not earlier than 150 ms after switching to Mute. To start-up Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier Figure 5. audio output modulated PWM operating time > 350 ms audio output modulated PWM operating time > ...
Page 8
... Protection The following protection circuits are incorporated into the TDA8953: • Thermal protection: – Thermal FoldBack (TFB) – ...
Page 9
... How the device reacts to a fault condition depends on which protection circuit has been activated. 8.3.1 Thermal protection The TDA8953 employes an advanced thermal protection strategy. A TFB function gradually reduces the output power within a defined temperature range. If the temperature continues to rise, OTP is activated to shut the device down completely. ...
Page 10
... Behavior of TFB and OTP 8.3.2 OverCurrent Protection (OCP) In order to guarantee the robustness of the TDA8953, the maximum output current delivered at the output stages is limited. OCP is built in for each output power switch. OCP is activated when the current in one of the power transistors exceeds the OCP threshold (I load ...
Page 11
... Window Protection (WP) Window Protection (WP) checks the conditions at the output terminals of the power stage and is activated: • During the start-up sequence, when the TDA8953 is switching from Standby to Mute. TDA8953_1 Product data sheet will also prevent the amplifier switching off due to transient PROT ...
Page 12
... NXP Semiconductors Start-up will be interrupted if a short-circuit is detected between one of the output terminals and one of the supply pins. The TDA8953 will wait until the short-circuit to the supply lines has been removed before resuming start-up. The short circuit will not generate large currents because the short-circuit check is carried out before the power stages are enabled. • ...
Page 13
... Mono BTL operation: the inputs must be connected in anti-parallel. The output of one channel is inverted and the speaker load is connected between the two outputs of the TDA8953. In practice (because of the OCP threshold) the maximum output power in the BTL configuration can be boosted to twice the maximum output power available in the single-ended configuration ...
Page 14
... NXP Semiconductors Fig 10. TDA8953_1 Product data sheet IN1P IN1M V in IN2P IN2M Input configuration for mono BTL application Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier OUT1 SGND OUT2 power stage mbl466 © NXP B.V. 2009. All rights reserved ...
Page 15
... ( (5) 13 (7) 2 kΩ (22, 2) SGND 2 kΩ (21, 3) Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 150 μA open: external clock closed: internal clock 010aaa589 2 Ω 010aaa590 50 μA current limiting OCP 28 μA 1.5 mA ...
Page 16
... STABI 20 13 VSSP2 21 14 OUT2 22 15 BOOT2 23 16 VDDP2 [1] Pin numbers in brackets are for the TDA8953J TDA8953_1 Product data sheet [1] Equivalent circuit 6 (23) SGND (20) 2 (19 (18) Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 50 kΩ ...
Page 17
... SGND Human Body Model (HBM) Charged Device Model (CDM) on pins OUT1 and OUT2 Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to case Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier Min Max Unit - ...
Page 18
... Operating mode without TFB input SE; Mute mode SE; Operating mode BTL; Mute mode BTL; Operating mode Mute and Operating modes; with respect to VSSA Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier Min Typ Max Unit [1] 12.5 41 42.5 V −12.5 −41 − ...
Page 19
... SSA DDA Figure Slope is directly related to the time constant of the RC network on the MODE pin V O(offset)(on O(offset)(mute) 0 0.8 2.2 3.0 Behavior of mode selection pin MODE Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier Min Typ Max - 145 - - 153 - - 154 - . 11. 4.2 5.5 6 ...
Page 20
... Conditions R = 30.0 kΩ OSC HIGH-level [1] [2] from SGND + SGND + 5 V (500 kHz minimum, 1000 kHz maximum) will result in a PWM track Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier Min Typ Max 290 335 365 250 - 450 SGND + 4.5 ...
Page 21
... (RMS) i(CM Ω SE Ω SE Ω BTL measurement; see Section DSon Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier ° [ unless otherwise specified. amb Min Typ Max Unit = 85 °C [ Ω - 160 Ω ...
Page 22
... Operating mode; inputs shorted Mute mode kHz (RMS (RMS) i(CM) measurement; see Section DSon Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier ° [ unless otherwise specified. amb Min Typ Max Unit [2] = 680 Ω - ...
Page 23
... DSon hs : output power at the onset of clipping : high-side R of power stage output DMOS (temperature dependent) DSon should be less than 12 A o(peak) Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 2 ) × ( × ) – – 0 min ...
Page 24
... The noise generated by the internal oscillator is supply voltage dependent. An external low-noise oscillator is recommended for low-noise applications running at high supply voltages. 14.5 Heatsink requirements An external heatsink must be connected to the TDA8953. Equation 5 of TFB and total thermal resistance from junction to ambient. TDA8953_1 Product data sheet ...
Page 25
... NXP Semiconductors – Power dissipation (P) is determined by the efficiency of the TDA8953. (1) R (2) R (3) R (4) R (5) R Fig 12. Derating curves for power dissipation as a function of maximum ambient temperature In the following example, a heatsink calculation is made for an 4 Ω SE application with a ±30 V supply: The audio signal has a crest factor of 10 (the ratio between peak power and average power (20 dB) ...
Page 26
... Amplifier malfunction due to the pumping effect can trigger UVP, OVP or UBP. The most effective way to avoid pumping effects is to connect the TDA8953 in a mono full-bridge configuration. In the case of stereo single-ended applications advised to connect the inputs in anti-phase (see be adapted ...
Page 27
... HFE > 80 operating mode control C VDDP1 C VP1 C VSSP1 R OSC 30 kΩ 100 nF 100 nF 100 OUT1 10 BOOT1 9 TDA8953J BOOT2 15 OUT2 VDDP2 C VP2 C VSSP2 C PROT (1) C STAB 100 nF 100 nF 100 nF 470 ...
Page 28
... NXP Semiconductors 14.8 Curves measured in reference design (demo board TDA8953J) 10 THD+N (%) −1 10 − (1) f (2) f (3) f Fig 14. THD + function of output power, SE configuration with 2 × 4 Ω load 10 THD+N (%) −1 10 − (1) f (2) f (3) f Fig 15. THD + function of output power, SE configuration with 2 × 3 Ω load ...
Page 29
... SE configuration osc = 100 W. o Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 010aaa600 (2) ( (W) 010aaa655 (3) ( (Hz) © NXP B.V. 2009. All rights reserved. ...
Page 30
... BTL configuration osc = 100 W. o Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 010aaa656 (3) ( (Hz) 010aaa629 (3) ( (Hz) © ...
Page 31
... DD SS osc −39 325 kHz (external 650 kHz oscillator), 2 × 3 Ω SE configuration osc Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 010aaa604 (Hz 010aaa605 (Hz) © NXP B.V. 2009. All rights reserved. ...
Page 32
... SS ( 100 = 1 kHz 325 kHz (external 650 kHz oscillator). i osc = Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 010aaa606 (1) (2) ( (W/channel − − −41 V. 010aaa607 (2) (3) 150 200 ...
Page 33
... Product data sheet 0 12.5 17.5 22 kHz 325 kHz (external 650 kHz oscillator). i osc 0 12.5 17.5 22 kHz 325 kHz (external 650 kHz oscillator). i osc Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 010aaa608 (1) (2) (3) (4) 27.5 32.5 37.5 Vp ±(V) 010aaa609 (1) (2) 27.5 32.5 37.5 Vp ±(V) © NXP B.V. 2009. All rights reserved. ...
Page 34
... μ 680 nF (1) ( − (p-p), 2 × 4 Ω SE configuration ripple Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 010aaa610 (1) (2) ( (Hz) = 100 mV − − − ...
Page 35
... V (p-p), 2 × 4 Ω SE configuration ripple − 100 mV osc Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 010aaa612 (Hz) SS 010aaa657 (V) MODE = 325 kHz (external 650 kHz oscillator), f © NXP B.V. 2009. All rights reserved. ...
Page 36
... osc − 325 kHz (external 650 kHz oscillator osc Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 010aaa614 (Hz (RMS). i 010aaa615 (Hz (RMS) ...
Page 37
... osc 0 0 100 200 = − 325 kHz (external 650 kHz oscillator, 2 × 4 Ω SE configuration = osc Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier 010aaa630 (1) 300 400 500 T (sec) 010aaa631 (3) (1) (4) (2) 300 400 ...
Page 38
... 12.2 10.15 6.2 1. 2.54 1.27 5.08 11.8 9.85 5.8 1.65 REFERENCES JEDEC JEITA Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier view B: mounting base side ...
Page 39
... scale (2) ( 16.0 13.0 1.1 11.1 6.2 2.9 1 15.8 12.6 0.9 10.9 5.8 2.5 REFERENCES JEDEC JEITA Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier detail 14.5 1.1 1.7 0.25 0.25 0.03 0.07 13.9 0.8 1.5 EUROPEAN ISSUE DATE ...
Page 40
... Solder bath specifications, including temperature and impurities TDA8953_1 Product data sheet 2 × 210 W class-D power amplifier Rev. 01 — 24 December 2009 TDA8953 © NXP B.V. 2009. All rights reserved ...
Page 41
... Lead-free process (from J-STD-020C) Package reflow temperature (°C) 3 Volume (mm ) < 350 260 260 250 Figure 36. Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier Figure 36) than a SnPb process, thus ≥ 350 220 220 350 to 2 000 > 2 000 260 260 250 ...
Page 42
... TDA8953_1 Product data sheet 2 × 210 W class-D power amplifier maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature Rev. 01 — 24 December 2009 TDA8953 peak temperature time 001aac844 © NXP B.V. 2009. All rights reserved ...
Page 43
... For PMFP packages hot bar soldering or manual soldering is suitable. TDA8953_1 Product data sheet Suitability of through-hole mount IC packages for dipping and wave soldering Soldering method Dipping - suitable - Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier ). If the stg(max) Wave suitable [1] suitable not suitable © NXP B.V. 2009. All rights reserved. ...
Page 44
... NXP Semiconductors 18. Revision history Table 16. Revision history Document ID Release date TDA8953_1 20091224 TDA8953_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier Supersedes - © NXP B.V. 2009. All rights reserved ...
Page 45
... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 01 — 24 December 2009 TDA8953 2 × 210 W class-D power amplifier © NXP B.V. 2009. All rights reserved ...
Page 46
... Single-Ended (SE 14.3.2 Bridge-Tied Load (BTL 14.4 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 24 14.5 Heatsink requirements . . . . . . . . . . . . . . . . . . 24 14.6 Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 26 14.7 Application schematic . . . . . . . . . . . . . . . . . . . 26 14.8 Curves measured in reference design (demo board TDA8953J Package outline . . . . . . . . . . . . . . . . . . . . . . . . 38 16 Soldering of SMD packages . . . . . . . . . . . . . . 40 16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 40 2 × 210 W class-D power amplifier 16.2 Wave and reflow soldering 16.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 40 16.4 Reflow soldering ...