TDA8954 NXP Semiconductors, TDA8954 Datasheet - Page 46

• Manufacturer Part Number: TDA8954
• Description: The TDA8954 is a stereo or mono high–efficiency Class D audio power amplifier in asingle IC featuring low power dissipation
• Manufacturer: NXP Semiconductors

NXP Semiconductors
21. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.4.1
8.4.1.1
8.4.1.2
8.4.2
8.4.3
8.4.4
8.4.5
8.4.6
8.5
9
10
11
12
13
13.1
13.2
13.3
14
14.1
14.2
14.3
14.3.1
14.3.2
14.4
14.5
14.6
14.7
14.8
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 16
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 18
Thermal characteristics . . . . . . . . . . . . . . . . . 18
Static characteristics. . . . . . . . . . . . . . . . . . . . 18
Dynamic characteristics . . . . . . . . . . . . . . . . . 20
Application information. . . . . . . . . . . . . . . . . . 23
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 38
Soldering of SMD packages . . . . . . . . . . . . . . 40
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pulse-width modulation frequency . . . . . . . . . . 8
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal protection . . . . . . . . . . . . . . . . . . . . . . 9
Thermal FoldBack (TFB) . . . . . . . . . . . . . . . . . 9
OverTemperature Protection (OTP) . . . . . . . . 10
OverCurrent Protection (OCP) . . . . . . . . . . . . 11
Window Protection (WP). . . . . . . . . . . . . . . . . 13
Supply voltage protection . . . . . . . . . . . . . . . . 13
Clock protection (CP) . . . . . . . . . . . . . . . . . . . 14
Overview of protection functions . . . . . . . . . . 14
Differential audio inputs . . . . . . . . . . . . . . . . . 14
Switching characteristics . . . . . . . . . . . . . . . . 20
Stereo SE configuration characteristics . . . . . 21
Mono BTL application characteristics . . . . . . . 22
Mono BTL application . . . . . . . . . . . . . . . . . . . 23
Pin MODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Estimating the output power . . . . . . . . . . . . . . 23
Single-Ended (SE) . . . . . . . . . . . . . . . . . . . . . 23
Bridge-Tied Load (BTL) . . . . . . . . . . . . . . . . . 24
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 24
Heatsink requirements . . . . . . . . . . . . . . . . . . 24
Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 26
Application schematic . . . . . . . . . . . . . . . . . . . 26
Curves measured in reference design
(demo board TDA8954J) . . . . . . . . . . . . . . . . 28
16.1
16.2
16.3
16.4
17
17.1
17.2
17.3
17.4
18
19
19.1
19.2
19.3
19.4
20
21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Soldering of through-hole mount packages. 42
Revision history . . . . . . . . . . . . . . . . . . . . . . . 44
Legal information . . . . . . . . . . . . . . . . . . . . . . 45
Contact information . . . . . . . . . . . . . . . . . . . . 45
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Introduction to soldering. . . . . . . . . . . . . . . . . 40
Wave and reflow soldering. . . . . . . . . . . . . . . 40
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 40
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 41
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Soldering by dipping or by solder wave . . . . . 42
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 42
Package related soldering information. . . . . . 43
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 45
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 45
2 × 210 W class-D power amplifier
Date of release: 24 December 2009
Document identifier: TDA8954_1
TDA8954
All rights reserved.