BAP1321-04 NXP Semiconductors, BAP1321-04 Datasheet
BAP1321-04
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BAP1321-04 Summary of contents
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... DATA SHEET dbook, halfpage BAP1321-04 Silicon PIN diode Product specification DISCRETE SEMICONDUCTORS M3D088 2001 Apr 17 ...
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... Apr 17 PINNING PIN ok, 4 columns 3 Top view Marking code: 6Fp. Fig.1 Simplified outline (SOT23) and symbol. CONDITIONS 90 Product specification BAP1321-04 DESCRIPTION anode cathode common connection MAM107 MIN. MAX. UNIT 100 mA ...
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... 100 mA 1800 MHz 100 mA 2450 MHz F when switched from 100 ; measured 100 mA 100 MHz F PARAMETER 3 Product specification BAP1321-04 TYP. MAX. UNIT 0.95 1.1 V 100 nA 0.42 pF 0.375 0.45 pF 0.275 0.325 pF 3.4 5.0 ...
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... I F (mA MHz; T Fig.3 MLD589 handbook, halfpage (GHz) Diode zero biased and inserted in series with a 50 stripline circuit. T amb Fig.5 4 Product specification BAP1321-04 500 C d (fF) 400 300 200 100 C. j Diode capacitance as a function of reverse voltage ...
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... OUTLINE VERSION IEC SOT23 2001 Apr scale 3.0 1.4 2.5 1.9 0.95 2.8 1.2 2.1 REFERENCES JEDEC JEITA TO-236AB 5 Product specification BAP1321- detail 0.45 0.55 0.2 0.1 0.15 0.45 EUROPEAN PROJECTION SOT23 ISSUE DATE 04-11-04 06-03-16 ...
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... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 6 Product specification BAP1321-04 DEFINITION ...
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... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 7 Product specification BAP1321-04 ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...