BAS116H NXP Semiconductors, BAS116H Datasheet - Page 2

• Manufacturer Part Number: BAS116H
• Description: Low leakage switching diode, encapsulated in a SOD123F small and flat leadSurface-Mounted Device (SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
3. Ordering information
4. Marking
5. Limiting values
BAS116H
Product data sheet
Table 3.
Table 4.
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
Type number
BAS116H
Type number
BAS116H
Symbol
V
V
I
I
I
P
T
T
T
F
FRM
FSM
j
amb
stg
RRM
R
tot
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Pulse test: t
T
Reflow soldering is the only recommended soldering method.
Soldering point of cathode tab.
j
= 25 C prior to surge.
Ordering information
Marking codes
Limiting values
Parameter
repetitive peak reverse
voltage
reverse voltage
forward current
repetitive peak forward
current
non-repetitive peak forward
current
total power dissipation
junction temperature
ambient temperature
storage temperature
p
 300 s;   0.02.
All information provided in this document is subject to legal disclaimers.
Package
Name
-
Rev. 3 — 31 May 2011
Description
plastic surface-mounted package; 2 leads
Conditions
square wave
t
t
t
T
p
p
p
amb
= 1 s
= 1 ms
= 1 s
 25 C
Marking code
B1
[1][4]
[1][2]
Low leakage switching diode
[3]
[5]
Min
-
-
-
-
-
-
-
-
-
65
65
BAS116H
© NXP B.V. 2011. All rights reserved.
Max
85
75
215
500
4
1
0.5
375
150
+150
+150
Version
SOD123F
Unit
V
V
mA
mA
A
A
A
mW
C
C
C
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