BAS116H NXP Semiconductors, BAS116H Datasheet - Page 5

• Manufacturer Part Number: BAS116H
• Description: Low leakage switching diode, encapsulated in a SOD123F small and flat leadSurface-Mounted Device (SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
8. Test information
9. Package outline
10. Packing information
BAS116H
Product data sheet
Fig 5.
V = V
(1) I
R
S
R
Reverse recovery time test circuit and waveforms
R
= 50
+ I
= 1 mA
F
Ω
×
R
S
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
Table 8.
The -xxx numbers are the last three digits of the 12NC ordering code.
[1]
Type number
BAS116H
Fig 6.
For further information and the availability of packing methods, see
I
F
D.U.T.
Package outline SOD123F
Packing methods
All information provided in this document is subject to legal disclaimers.
OSCILLOSCOPE
SOD123F
Package
mga881
SAMPLING
R
i
= 50
Dimensions in mm
Rev. 3 — 31 May 2011
Ω
3.6
3.4
Description
4 mm pitch, 8 mm tape and reel
V
2.7
2.5
R
t
10 %
r
0.70
0.55
90 %
1.7
1.5
input signal
1
2
t
p
0.55
0.35
Section
Low leakage switching diode
1.2
1.0
t
0.25
0.10
[1]
+ I
04-11-29
14.
F
Packing quantity
3000
-115
output signal
BAS116H
© NXP B.V. 2011. All rights reserved.
t rr
10000
-135
(1)
t
5 of 10