BAS116H NXP Semiconductors, BAS116H Datasheet - Page 6

• Manufacturer Part Number: BAS116H
• Description: Low leakage switching diode, encapsulated in a SOD123F small and flat leadSurface-Mounted Device (SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
11. Soldering
BAS116H
Product data sheet
Fig 7.
Footprint information for reflow soldering of plastic surface-mounted, 2 leads package
solder land
solder paste deposit
occupied area
Reflow soldering is the only recommended soldering method.
Reflow soldering footprint SOD123F
solder land plus solder paste
solder resist
Dimensions in mm
2.1
1.6
All information provided in this document is subject to legal disclaimers.
(2×)
(2×)
1.1
1.2
Rev. 3 — 31 May 2011
4.4
2.9
2.8
(2×)
1.1
(2×)
1.2
Low leakage switching diode
BAS116H
© NXP B.V. 2011. All rights reserved.
sod123f_fr
SOD123F
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