BAS29_31_35 NXP Semiconductors, BAS29_31_35 Datasheet - Page 3

General purpose switching diodes fabricated in planartechnology, and encapsulated in small rectangular plasticSMD SOT23 packages

BAS29_31_35

Manufacturer Part Number
BAS29_31_35
Description
General purpose switching diodes fabricated in planartechnology, and encapsulated in small rectangular plasticSMD SOT23 packages
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Device mounted on an FR4 printed-circuit board.
2003 Mar 20
Per diode
V
V
I
I
I
P
I
E
T
T
SYMBOL
F
FRM
FSM
RRM
stg
j
RRM
R
tot
RRM
General purpose controlled avalanche
(double) diodes
repetitive peak reverse voltage
continuous reverse voltage
continuous forward current
repetitive peak forward current
non-repetitive peak forward current
total power dissipation
repetitive peak reverse current
repetitive peak reverse energy
storage temperature
junction temperature
PARAMETER
single diode loaded; see Fig.2;
note 1
double diode loaded; see Fig.2;
note 1
square wave; T
surge; see Fig.4
T
t
p
amb
≥ 50 µs; f ≤ 20 Hz; T
t = 1 µs
t = 100 µs
t = 1 s
= 25 °C; note 1
3
CONDITIONS
j
= 25 °C prior to
j
= 25 °C
BAS29; BAS31; BAS35
−65
MIN.
110
90
250
150
600
10
4
0.75
250
600
5
+150
150
Product data sheet
MAX.
V
V
mA
mA
mA
A
A
A
mW
mA
mJ
°C
°C
UNIT

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