BAV70_SER NXP Semiconductors, BAV70_SER Datasheet

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BAV70_SER

Manufacturer Part Number
BAV70_SER
Description
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)plastic packages
Manufacturer
NXP Semiconductors
Datasheet
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
Table 1.
I
I
I
I
I
Table 2.
[1]
Type number Package
BAV70
BAV70M
BAV70S
BAV70T
BAV70W
Symbol
Per diode
I
V
t
R
rr
R
BAV70 series
High-speed switching diodes
Rev. 07 — 27 November 2007
High switching speed: t
Low leakage current
Small SMD plastic packages
High-speed switching
General-purpose switching
When switched from I
Product overview
Quick reference data
Parameter
reverse current
reverse voltage
reverse recovery time
NXP
SOT23
SOT883
SOT363
SOT416
SOT323
F
= 10 mA to I
JEITA
-
SC-101
SC-88
SC-75
SC-70
rr
4 ns
R
= 10 mA; R
JEDEC
TO-236AB small
-
-
-
-
Conditions
V
R
= 80 V
L
= 100 ; measured at I
I
I
Low capacitance: C
Reverse voltage: V
Package
configuration
leadless ultra
small
very small
ultra small
very small
[1]
Min
-
-
-
R
= 1 mA.
Configuration
dual common cathode
dual common cathode
quadruple common
cathode/common cathode
dual common cathode
dual common cathode
Typ
-
-
-
Product data sheet
R
d
100 V
1.5 pF
Max
0.5
100
4
Unit
V
ns
A

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BAV70_SER Summary of contents

Page 1

BAV70 series High-speed switching diodes Rev. 07 — 27 November 2007 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number Package BAV70 BAV70M BAV70S BAV70T BAV70W 1.2 Features ...

Page 2

... Ordering information Table 4. Type number BAV70 BAV70M BAV70S BAV70T BAV70W BAV70_SER_7 Product data sheet Pinning Description anode (diode 1) anode (diode 2) common cathode anode (diode 1) anode (diode 2) common cathode anode (diode 1) anode (diode 2) common cathode (diode 3 and diode 4) anode (diode 3) ...

Page 3

... Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM BAV70_SER_7 Product data sheet Marking codes Limiting values Parameter Conditions repetitive peak reverse voltage reverse voltage forward current BAV70 T amb BAV70M T ...

Page 4

... Table 7. Symbol Per diode R th(j-a) R th(j-t) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. BAV70_SER_7 Product data sheet Limiting values …continued Parameter Conditions total power dissipation BAV70 T amb BAV70M T amb ...

Page 5

... C unless otherwise specified. amb Symbol Per diode [1] Pulse test: t [2] When switched from I [3] When switched from I BAV70_SER_7 Product data sheet Characteristics Parameter Conditions forward voltage 150 mA F reverse current V ...

Page 6

... T = 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAV70_SER_7 Product data sheet 006aab107 I FSM 1.0 1.4 V (V) F Fig 2. Non-repetitive peak forward current as a 006aab108 60 80 100 V (V) R Fig 4. Diode capacitance as a function of reverse Rev. 07 — ...

Page 7

... Oscilloscope: rise time Fig 5. Reverse recovery time test circuit and waveforms 450 D.U.T. Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms BAV70_SER_7 Product data sheet SAMPLING OSCILLOSCOPE mga881 = 0.6 ns; reverse voltage pulse duration t ...

Page 8

... Dimensions in mm Fig 7. Package outline BAV70 (SOT23/TO-236AB) 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 9. Package outline BAV70S (SOT363/SC-88) Fig 11. Package outline BAV70W (SOT323/SC-70) BAV70_SER_7 Product data sheet 1.1 0.9 0.45 0.15 2 0.48 0.15 0.38 0.09 04-11-04 Dimensions in mm Fig 8. Package outline BAV70M (SOT883/SC-101) 1.1 0.8 0.45 4 0.15 1.75 1.45 3 0.3 0.25 0.2 0.10 06-03-16 Dimensions in mm Fig 10. Package outline BAV70T (SOT416/SC-75) 2 ...

Page 9

... For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 11. Soldering Fig 12. Reflow soldering footprint BAV70 (SOT23/TO-236AB) BAV70_SER_7 Product data sheet Packing methods Description SOT23 4 mm pitch tape and reel SOT883 2 mm pitch tape and reel SOT363 4 mm pitch tape and reel ...

Page 10

... NXP Semiconductors 4.60 Fig 13. Wave soldering footprint BAV70 (SOT23/TO-236AB) Fig 14. Reflow soldering footprint BAV70M (SOT883/SC-101) BAV70_SER_7 Product data sheet 3.40 1.20 (2x) 2 4.00 1.20 3 2.80 4. 0.05 ( 0.90 0. solder lands solder paste Reflow soldering is the only recommended soldering method. Rev. 07 — 27 November 2007 ...

Page 11

... NXP Semiconductors Fig 15. Reflow soldering footprint BAV70S (SOT363/SC-88) Dimensions in mm Fig 16. Wave soldering footprint BAV70S (SOT363/SC-88) BAV70_SER_7 Product data sheet 2.35 solder lands 0.50 solder paste (4 ) solder resist 0.50 occupied area (4 ) Dimensions in mm 5.25 4.50 solder lands 1.15 3.75 solder resist occupied area transport direction during soldering Rev. 07 — ...

Page 12

... NXP Semiconductors Fig 17. Reflow soldering footprint BAV70T (SOT416/SC-75) Fig 18. Reflow soldering footprint BAV70W (SOT323/SC-70) Fig 19. Wave soldering footprint BAV70W (SOT323/SC-70) BAV70_SER_7 Product data sheet 2.0 0.85 0.6 (3x) Dimensions in mm 2.65 0.75 1.325 1. 0.60 2. 2.40 4.60 4.00 1. 3.65 2.10 1 preferred transport direction during soldering Rev. 07 — 27 November 2007 ...

Page 13

... BAV70_6 20020403 BAV70S_2 19971021 BAV70T_3 20040204 BAV70W_6 20020405 BAV70_SER_7 Product data sheet Data sheet status Product data sheet description”: amended overview”: added data”: added values”: for BAV70, BAV70S and BAV70W change of V values”: for BAV70, BAV70S and BAV70W change of V “ ...

Page 14

... Contact information For additional information, please visit: For sales office addresses, send an email to: BAV70_SER_7 Product data sheet [3] Definition This document contains data from the objective specification for product development. ...

Page 15

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 27 November 2007 Document identifier: BAV70_SER_7 ...

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