IP4302CX2_A NXP Semiconductors, IP4302CX2_A Datasheet
IP4302CX2_A
Related parts for IP4302CX2_A
IP4302CX2_A Summary of contents
Page 1
IP4302CX2/A Low profile bidirectional low capacitance ESD protection diode Rev. 1 — 28 November 2011 1. Product profile 1.1 General description The IP4302CX2 bidirectional diode which is designed to provide protection to downstream components from ElectroStatic Discharge (ESD) ...
Page 2
... The device is electrically and mechanically symmetrical. Thus no marking is needed. 3. Ordering information Table 3. Type number Package IP4302CX2/A WLCSP2 wafer level chip-size package; 2 bumps (A1-A1) IP4302CX2_A Product data sheet Quick reference data C; unless otherwise specified. Parameter Conditions breakdown voltage I ...
Page 3
... IEC 61000-4-2 model and far exceeds the specified level contact discharge). 5. Characteristics Table amb Symbol Parameter IP4302CX2_A Product data sheet Limiting values Conditions electrostatic contact discharge discharge voltage air discharge IEC 61000-4-2 level 4 contact discharge air discharge MIL-STD-883D (method 3015) HBM junction temperature ...
Page 4
... Avoid running protected conductors in parallel with unprotected conductors 5. Minimize all PCB conductive loops including power and ground loops 6. Minimize the length of the transient return path to ground 7. Avoid using shared transient return paths to a common ground point IP4302CX2_A Product data sheet −V −V − ...
Page 5
... WLCSP2: wafer level chip-size package; 2 bumps (A1-A1 European projection Fig 3. Package outline IP4302CX2/A (WLCSP2) Table 6. Dimensions for Figure 3 Symbol IP4302CX2_A Product data sheet Min Typ 0.37 0.40 0.05 0.06 0.32 0.34 - 0.14 - 0.35 0.49 0.52 0.67 0.70 - 0.4 All information provided in this document is subject to legal disclaimers. Rev. 1 — 28 November 2011 ...
Page 6
... Reflow soldering recommendation Fig 4. Table 7. Symbol T reflow(peak dT/dt IP4302CX2_A Product data sheet T (°C) T reflow(peak) 250 230 217 preheat t 1 The device is capable of withstanding at least three reflows with this profile. Pb-free solder reflow profile Characteristics Parameter peak reflow temperature ...
Page 7
... Subscriber Identity Module WLCSP Wafer-Level Chip-Scale Package 10. Revision history Table 9. Revision history Document ID Release date IP4302CX2_A v.1 20111128 IP4302CX2_A Product data sheet Low profile bidirectional ESD protection diode Data sheet status Product data sheet All information provided in this document is subject to legal disclaimers. ...
Page 8
... This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or IP4302CX2_A Product data sheet Low profile bidirectional ESD protection diode [3] Definition This document contains data from the objective specification for product development ...
Page 9
... NXP Semiconductors’ specifications such use shall be solely at customer’s 12. Contact information For more information, please visit: For sales office addresses, please send an email to: IP4302CX2_A Product data sheet Low profile bidirectional ESD protection diode own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
Page 10
... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 28 November 2011 Document identifier: IP4302CX2_A ...