LPC2420_60 NXP Semiconductors, LPC2420_60 Datasheet - Page 25
LPC2420_60
Manufacturer Part Number
LPC2420_60
Description
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer
NXP Semiconductors
Datasheet
1.LPC2420_60.pdf
(86 pages)
- Current page: 25 of 86
- Download datasheet (497Kb)
NXP Semiconductors
Table 4.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[11] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
[12] If the RTC is not used, these pins can be left floating.
LPC2420_60
Product data sheet
Symbol
V
V
VREF
VBAT
DD(DCDC)(3V3)
DDA
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled.
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
Open-drain 5 V tolerant digital I/O pad, compatible with I
functionality. When power is switched off, this pin connected to the I
configuration applies to all functions on this pin.
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
Pad provides special analog functionality.
This pin has a built-in pull-up resistor.
This pin has no built-in pull-up and no built-in pull-down resistor.
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
Pin description
Pin
26, 86,
174
20
24
38
[7]
[7]
[7]
[7]
…continued
Ball
H4, P11,
D11
G4
K1
M3
[7]
[7]
[7]
[7]
All information provided in this document is subject to legal disclaimers.
Type
I
I
I
I
Rev. 6.1 — 22 September 2011
Description
3.3 V DC-to-DC converter supply voltage: This is the power supply
for the on-chip DC-to-DC converter.
analog 3.3 V pad supply voltage: This should be nominally the
same voltage as V
error. This voltage is used to power the ADC and DAC.
ADC reference: This should be nominally the same voltage as
V
on this pin is used as a reference for ADC and DAC.
RTC power supply: 3.3 V on this pin supplies the power to the RTC.
2
C-bus 400 kHz specification. It requires an external pull-up to provide output
DD(3V3)
but should be isolated to minimize noise and error. The level
2
C-bus is floating and does not disturb the I
DD(3V3)
Flashless 16-bit/32-bit microcontroller
but should be isolated to minimize noise and
LPC2420/2460
2
C-bus lines. Open-drain
© NXP B.V. 2011. All rights reserved.
25 of 86
Related parts for LPC2420_60
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
Flashless 16-bit/32-bit Microcontroller; Ethernet, Can, Isp/iap, Usb 2.0 Device/host/otg, External Memory Interface
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: