LPC3130_3131 NXP Semiconductors, LPC3130_3131 Datasheet - Page 2

• Manufacturer Part Number: LPC3130_3131
• Description: The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
• Manufacturer: NXP Semiconductors

NXP Semiconductors
3. Ordering information
Table 1.
Table 2.
LPC3130_3131_1
Preliminary data sheet
Type number
LPC3130FET180 TFBGA180 plastic thin fine pitch ball grid array package, 180 balls, body 12
LPC3131FET180 TFBGA180 plastic thin fine pitch ball grid array package, 180 balls, body 12
Type number
LPC3130FET180
LPC3131FET180
Ordering information
Ordering options for LPC3130/3131
Package
Name
Core/bus
frequency
180 MHz/
90 MHz
180 MHz/
90 MHz
I
I
Operating voltage and temperature
TFBGA180 package: 12
N
N
N
N
N
N
N
N
PWM module
Random Number Generator (RNG)
General Purpose I/O (GPIO) pins
Flexible and versatile interrupt structure
JTAG interface with boundary scan and ARM debug access
Core voltage: 1.2 V
I/O voltage: 1.8 V, 2.8 V, 3.3 V
Temperature: 40 C to +85 C
Description
Total
SRAM
96 kB
192 kB Device/
High-speed
USB
Device/
Host/OTG
Host/OTG
Rev. 1 — 9 February 2009
12 mm
Low-cost, low-power ARM926EJ-S microcontrollers
10-bit
ADC
channels
4
4
2
, 0.8 mm pitch
I
I
2 each
2 each
2
2
S-bus/
C-bus
LPC3130/3131
MCI SDHC/
SDIO/
CE-ATA
yes
yes
12
12
0.8 mm SOT570-3
0.8 mm SOT570-3
© NXP B.V. 2009. All rights reserved.
Temperature
range
40 C to +85 C
40 C to +85 C
Version
2 of 68