BSS138BKS NXP Semiconductors, BSS138BKS Datasheet - Page 13

• Manufacturer Part Number: BSS138BKS
• Description: Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Soldering
BSS138BKS
Product data sheet
Fig 19. Reflow soldering footprint for SOT363 (TSSOP6)
Fig 20. Wave soldering footprint for SOT363 (TSSOP6)
4.5
2.35
1.5
1.3
(4×)
0.6
(4×)
0.5
2.45
5.3
(4×)
(4×)
0.5
0.6
All information provided in this document is subject to legal disclaimers.
1.3
2.65
1.8
Rev. 1 — 12 August 2011
(2×)
0.6
1.5
1.5
0.4 (2×)
0.3
60 V, 320 mA dual N-channel Trench MOSFET
2.5
Dimensions in mm
direction during soldering
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
preferred transport
BSS138BKS
sot363_fr
solder lands
solder resist
occupied area
sot363_fw
© NXP B.V. 2011. All rights reserved.
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