LM2903NG ON Semiconductor, LM2903NG Datasheet - Page 10

• Manufacturer Part Number: LM2903NG
• Description: IC COMP DUAL OFFSET LV 8DIP
• Manufacturer: ON Semiconductor
• Type: General Purposer

Specifications of LM2903NG

• Number Of Elements: 2
• Output Type: CMOS, DTL, ECL, MOS, Open-Collector, TTL
• Voltage - Supply: 2 V ~ 36 V, ±1 V ~ 18 V
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Number Of Channels: 2 Channels
• Response Time: 1.5 us
• Offset Voltage (max): 7 mV
• Input Bias Current (max): 250 nA
• Supply Voltage (max): 36 V
• Supply Voltage (min): 2 V
• Supply Current (max): 1 mA
• Maximum Power Dissipation: 570 mW
• Maximum Operating Temperature: + 105 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Amplifier Type: Comparator
• Current, Input Bias: 25 nA
• Current, Input Offset: ±5 nA
• Current, Supply: 0.4 mA
• Number Of Amplifiers: Dual
• Package Type: PDIP-8
• Power Dissipation: 570 mW
• Temperature, Operating, Range: -40 to +105 °C
• Voltage, Gain: 200 V/mV
• Voltage, Input Offset: ±2 mV
• Voltage, Supply: ±1 to ±18 VDC
• Comparator Type: Precision
• No. Of Comparators: 2
• Ic Output Type: CMOS, MOS, TTL, DTL, ECL
• Supply Current: 400µA
• Supply Voltage Range: ± 1V To ± 18V
• Amplifier Case Style: DIP
• Rohs Compliant: Yes
• Output Compatibility: CMOS, DTL, ECL, MOS, TTL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM2903NGOS

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−T−
0.038 (0.0015)
SEATING
PLANE
PIN 1 ID
H
E
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D D
A1
A
b
*For additional information on our Pb−Free strategy and soldering
E
8 PL
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.08 (0.003)
c
8X
0.041
1.04
6X
M
0.0256
0.65
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
0.126
PACKAGE DIMENSIONS
3.20
SOLDERING FOOTPRINT*
USA/Canada
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Phone: 81−3−5773−3850
T
B
http://onsemi.com
S
CASE 846A−02
DM SUFFIX
A
ISSUE G
L
Micro8
S
10
0.015
0.38
8X
0.167
NOTES:
SCALE 8:1
4.24
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
DIM
H
A1
A
D
E
b
c
e
L
E
0.208
5.28
0.05
0.25
0.13
2.90
2.90
0.40
4.75
inches
MIN
−−
mm
MILLIMETERS
0.65 BSC
NOM
0.08
0.33
0.18
3.00
3.00
0.55
4.90
−−
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
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MAX
0.15
0.40
0.23
3.10
3.10
0.70
5.05
1.10
0.002
0.010
0.005
0.114
0.114
0.016
0.187
MIN
−−
0.026 BSC
INCHES
0.003
0.013
0.007
0.118
0.118
0.021
0.193
NOM
−−
LM393/D
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
MAX