STPS3L60 STMicroelectronics, STPS3L60 Datasheet
STPS3L60
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STPS3L60 Summary of contents
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... June 2009 Power Schottky rectifier A K DO-201AD STPS3L60 A K SMB STPS3L60U Table 1. Device summary I F(AV) V RRM T j (max (max) Doc ID 7505 Rev 6 STPS3L60 A K DO-15 STPS3L60Q A K SMBflat STPS3L60UF 150 °C 0.61 V 1/11 www.st.com 11 ...
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... T L (DO-15) = 127 °C δ (SMBflat Sinusoidal µ ° (2) Parameter SMBflat SMB DO-201AD Lead length = 10 mm DO-15 Doc ID 7505 Rev 6 STPS3L60 Value Unit 100 A 2000 W - 150 °C 150 °C 10000 V/µs Value Unit 10 20 ° ...
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... STPS3L60 Table 4. Static electrical characteristics Symbol Parameter (1) I Reverse leakage current R (1) V Forward voltage drop F = 380 µs, δ < Pulse test : evaluate the conduction losses use the following equation : F(AV) Figure 1. Average forward power dissipation versus average forward current ...
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... Rth(j-a)=Rth(j-l) Rth(j-a)=100°C/W T (°C) amb 100 Normalized avalanche power derating versus junction temperature ( (25 °C) T (° 100 Non repetitive surge peak forward current versus overload duration (maximum values) (DO-15) t(s) t δ =0.5 1.E-02 1.E-01 STPS3L60 125 150 125 150 Ta=25 °C Ta=50 °C Ta=100 °C 1.E+00 ...
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... STPS3L60 Figure 9. Non repetitive surge peak forward current versus overload duration (maximum values) (SMB δ =0.5 0 1.E-03 1.E-02 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-201AD th(j-a) th(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Single pulse 0.0 1.E-01 1.E+00 1.E+01 Figure 13. Relative variation of thermal ...
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... Tj=100°C (Typical values) (Typical values) Tj=100°C Tj=100°C (Maximum values) (Maximum values) Tj=25°C (Maximum values) V (V) FM 0.1 0.2 0.3 0.4 0.5 0.6 0.7 ambient versus copper surface under each lead (SMBflat) (°C/W) Expoxy printed circuit FR4, copper thickness = 35 µm S(Cu)(cm²) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 STPS3L60 F=1MHz Vosc=30mV Tj=25°C 100 0.8 0.9 1.0 SMB-Flat 4.0 4.5 5.0 ...
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... STPS3L60 2 Package information ● Epoxy meets UL94,V0 In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Figure 21. DO-15 plastic dimensions ...
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... SMB dimensions Figure 23. SMB footprint, dimensions in mm (inches) 8/11 Ref 1.62 2.60 1.62 (0.064) (0.102) (0.064) 5.84 (0.300) Doc ID 7505 Rev 6 STPS3L60 Dimensions Millimeters Inches Min. Max. Min. Max. 1.90 2.45 0.075 0.096 0.05 0.20 0.002 0.008 1.95 2.20 0.077 0.087 0.15 0.40 0.006 0.016 3.30 3.95 0.130 0.156 5 ...
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... STPS3L60 Table 6. SMBflat dimensions Figure 24. SMBflat footprint dimensions a. SMB footprint may also be used. Ref (a) 5.84 (0.230) 1.20 3.44 1.20 (0.047) (0.136) (0.047) millimeters (inches) Doc ID 7505 Rev 6 Package information Dimensions Millimeters Inches Min. Typ. Max. ...
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... STPS3L60Q STPS3L60QRL STPS3L60U STPS3L60UF 4 Revision history Table 8. Document revision history Date July-2003 12-Jun-2009 10/11 Marking Package STPS3L60 DO-201AD STPS3L60 DO-201AD STPS3L60 DO-15 STPS3L60 DO-15 G36 SMB FG36 SMBflat Revision 5A Previous issue Reformatted to current standards. Added SMBflat package. 6 Added ECOPACK statement. Added cathode band graphics. ...
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... STPS3L60 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...