STPS10L25 STMicroelectronics, STPS10L25 Datasheet
STPS10L25
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STPS10L25 Summary of contents
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... 150 °C 0. REVERSE TO-220AC STPS10L25D Parameter Tc = 140° Sinusoidal tp=2 µs square F=1kHz tp = 100 µs square tp = 1µ 25°C STPS10L25D PAK STPS10L25G Value 0.5 10 200 1 3 5500 - 150 150 10000 A Unit ° ...
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... STPS10L25D/G THERMAL RESISTANCE Symbol R Junction to case th (j-c) STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions I * Reverse leakage current Forward voltage drop F Pulse test 380 µs, < evaluate the maximum conduction losses use the following equation : 0. 0.013 I F(AV) F (RMS) Fig. 1: Average forward power dissipation versus average forward current ...
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... Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(nF) 5.0 1.0 0 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS10L25G only) Rth(j-a) (°C/ STPS10L25D/G = 0.5 = 0.2 = 0.1 tp(s) Single pulse ...
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... STPS10L25D/G PACKAGE MECHANICAL DATA 2 D PAK FLAT ZONE NO LESS THAN 2mm FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 8.90 4/5 REF Cooling method: by conduction (method C) n 5.08 1.30 3.70 DIMENSIONS Millimeters Inches Min. ...
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... STPS10L25D STPS10L25G STPS10L25G STPS10L25G-TR STPS10L25G Epoxy meets UL94,V0 n Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics ...