STM32F103RC STMicroelectronics, STM32F103RC Datasheet - Page 120

no-image

STM32F103RC

Manufacturer Part Number
STM32F103RC
Description
Mainstream Performance line, ARM Cortex-M3 MCU with 256 Kbytes Flash, 72 MHz CPU, motor control, USB and CAN
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM32F103RC

Core
ARM 32-bit Cortex™-M3 CPU
Conversion Range
0 to 3.6 V
Dma
12-channel DMA controller
Supported Peripherals
timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs
Systick Timer
a 24-bit downcounter

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM32F103RC
Manufacturer:
ST
0
Part Number:
STM32F103RCT
Manufacturer:
ST
0
Part Number:
STM32F103RCT6
Manufacturer:
ST
Quantity:
4 000
Part Number:
STM32F103RCT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103RCT6
Manufacturer:
ST
0
Part Number:
STM32F103RCT6
Manufacturer:
ST
Quantity:
2 000
Part Number:
STM32F103RCT6
Manufacturer:
ST
Quantity:
1 000
Part Number:
STM32F103RCT6
Manufacturer:
ST
Quantity:
150
Part Number:
STM32F103RCT6
Manufacturer:
ST
Quantity:
20 000
Part Number:
STM32F103RCT6
Manufacturer:
ST
Quantity:
17 441
Part Number:
STM32F103RCT6
0
Company:
Part Number:
STM32F103RCT6
Quantity:
9 600
Part Number:
STM32F103RCT6(STM32F103/RCT6)
Manufacturer:
ST
0
Part Number:
STM32F103RCT7
Manufacturer:
ST
Quantity:
1 400
Package characteristics
6.2
6.2.1
120/130
Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
P
taking into account the actual V
application.
Table 73.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Symbol
I/O
Θ
JA
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
WLCSP64
max is the product of I
Package thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
J
Doc ID 14611 Rev 8
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
STM32F103xC, STM32F103xD, STM32F103xE
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
42.
/ I
OH
D
OH
),
max x Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
max + P
Value
40
30
40
46
45
50
I/O
max),
°C/W
Unit

Related parts for STM32F103RC