STM32F103VF STMicroelectronics, STM32F103VF Datasheet - Page 114

• Manufacturer Part Number: STM32F103VF
• Description: Mainstream Performance line, ARM Cortex-M3 MCU with 768 Kbytes Flash, 72MHz CPU, motor control, USB and CAN
• Manufacturer: STMicroelectronics

Specifications of STM32F103VF

• Conversion Range: 0 to 3.6 V
• Supported Peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs
• Systick Timer: a 24-bit downcounter

Package characteristics
6.2
6.2.1
114/120
Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 72.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Symbol
I/O
Θ
JA
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
A
JA
D
INT
I/O
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in ° C/W,
max = Σ (V
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
max is the product of I
Package thermal characteristics
OL
× I
OL
INT
T
) + Σ((V
J
Doc ID 16554 Rev 3
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
and V
– V
A
DD
max + (P
I/O
OH
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
max (P
) × I
41.
/ I
OH
OH
D
),
max x Θ
D
of the I/Os at low and high level in the
max = P
STM32F103xF, STM32F103xG
JA
)
INT
max + P
Value
40
30
46
45
I/O
max),
°C/W
Unit