STM32F103T4 STMicroelectronics, STM32F103T4 Datasheet - Page 81

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STM32F103T4

Manufacturer Part Number
STM32F103T4
Description
Mainstream Performance line, ARM Cortex-M3 MCU with 16 Kbytes Flash, 72 MHz CPU, motor control, USB and CAN
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM32F103T4

Conversion Range
0 to 3.6 V
Peripherals Supported
timers, ADC, SPIs, I2Cs and USARTs

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STM32F103x4, STM32F103x6
6.2
6.2.1
Thermal characteristics
The maximum chip junction temperature (T
Table 9: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
P
taking into account the actual V
application.
Table 56.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Symbol
I/O
Θ
JA
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
Thermal resistance junction-ambient
TFBGA64 - 5 × 5 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 48 -7 × 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 × 6 mm / 0.5 mm pitch
max is the product of I
Package thermal characteristics
OL
× I
OL
T
INT
) + Σ((V
J
Doc ID 15060 Rev 5
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
A
– V
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
32.
/ I
OH
D
OH
),
max × Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Package characteristics
max + P
Value
65
45
55
16
18
I/O
max),
°C/W
Unit
81/87

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