STM32F100RB

Manufacturer Part NumberSTM32F100RB
DescriptionMainstream Value line, ARM Cortex-M3 MCU with 128 Kbytes Flash, 24 MHz CPU, motor control and CEC functions
ManufacturerSTMicroelectronics
STM32F100RB datasheet
 


Specifications of STM32F100RB

Peripherals Supportedtimers, ADC, SPIs, I2Cs, USARTs and DACsConversion Range0 to 3.6 V
16-bit, 6-channel Advanced-control Timerup to 6 channels for PWM output, dead time generation and emergency stopSystick Timer24-bit downcounter
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Low & medium-density value line, advanced ARM-based 32-bit MCU
with 16 to 128 KB Flash, 12 timers, ADC, DAC & 8 comm interfaces
Features
Core: ARM 32-bit Cortex™-M3 CPU
– 24 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1)
performance
– Single-cycle multiplication and hardware
division
Memories
– 16 to 128 Kbytes of Flash memory
– 4 to 8 Kbytes of SRAM
Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR and programmable voltage
detector (PVD)
– 4-to-24 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC
– PLL for CPU clock
– 32 kHz oscillator for RTC with calibration
Low power
– Sleep, Stop and Standby modes
– V
supply for RTC and backup registers
BAT
Debug mode
– Serial wire debug (SWD) and JTAG
interfaces
DMA
– 7-channel DMA controller
– Peripherals supported: timers, ADC, SPIs,
2
I
Cs, USARTs and DACs
1 × 12-bit, 1.2 µs A/D converter (up to 16
channels)
– Conversion range: 0 to 3.6 V
– Temperature sensor
2 × 12-bit D/A converters
Up to 80 fast I/O ports
– 37/51/80 I/Os, all mappable on 16 external
interrupt vectors and almost all 5 V-tolerant
April 2011
STM32F100x4 STM32F100x6
STM32F100x8 STM32F100xB
LQFP100 14 × 14 mm
LQFP64 10 × 10 mm
LQFP48 7 × 7 mm
Up to 12 timers
– Up to three 16-bit timers, each with up to 4
IC/OC/PWM or pulse counter
– 16-bit, 6-channel advanced-control timer:
up to 6 channels for PWM output, dead
time generation and emergency stop
– One 16-bit timer, with 2 IC/OC, 1
OCN/PWM, dead-time generation and
emergency stop
– Two 16-bit timers, each with
IC/OC/OCN/PWM, dead-time generation
and emergency stop
– 2 watchdog timers (Independent and
Window)
– SysTick timer: 24-bit downcounter
– Two 16-bit basic timers to drive the DAC
Up to 8 communications interfaces
2
– Up to two I
C interfaces (SMBus/PMBus)
– Up to 3 USARTs (ISO 7816 interface, LIN,
IrDA capability, modem control)
– Up to 2 SPIs (12 Mbit/s)
– Consumer electronics control (CEC)
interface
CRC calculation unit, 96-bit unique ID
®
ECOPACK
packages
Table 1.
Device summary
Reference
STM32F100x4
STM32F100C4, STM32F100R4
STM32F100x6
STM32F100C6, STM32F100R6
STM32F100C8, STM32F100R8,
STM32F100x8
STM32F100V8
STM32F100CB, STM32F100RB,
STM32F100xB
STM32F100VB
Doc ID 16455 Rev 6
FBGA
TFBGA64 (5 × 5 mm)
Part number
1/87
www.st.com
1

STM32F100RB Summary of contents

  • Page 1

    ... Consumer electronics control (CEC) interface ■ CRC calculation unit, 96-bit unique ID ® ■ ECOPACK packages Table 1. Device summary Reference STM32F100x4 STM32F100C4, STM32F100R4 STM32F100x6 STM32F100C6, STM32F100R6 STM32F100C8, STM32F100R8, STM32F100x8 STM32F100V8 STM32F100CB, STM32F100RB, STM32F100xB STM32F100VB Doc ID 16455 Rev 6 FBGA TFBGA64 (5 × 5 mm) Part number 1/87 www.st.com 1 ...

  • Page 2

    Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 3

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 4

    Contents 7 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 8 Revision ...

  • Page 5

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 6

    List of tables Table 45. ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 7

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB List of figures Figure 1. STM32F100xx value line block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 8

    List of figures Figure 43. LQFP48 – mm, 48-pin low-profile quad flat package outline ...

  • Page 9

    ... STM32F100xx Flash programming manual. The reference and Flash programming manuals are both available from the STMicroelectronics website www.st.com. For information on the Cortex™-M3 core please refer to the Cortex™-M3 Technical Reference Manual, available from the www.arm.com website at the following address: http://infocenter ...

  • Page 10

    Description 2 Description The STM32F100xx value line family incorporates the high-performance ARM Cortex™-M3 32-bit RISC core operating MHz frequency, high-speed embedded memories (Flash memory up to 128 Kbytes and SRAM Kbytes), and an extensive ...

  • Page 11

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 2.1 Device overview The description below gives an overview of the complete range of peripherals proposed in this family. Figure 1 shows the general block diagram of the device family. Table 2. STM32F100xx features and peripheral ...

  • Page 12

    Description Figure 1. STM32F100xx value line block diagram 1. Peripherals not present in low-density value line devices alternate function on I/O port pin –40 °C to +85 °C (junction temperature up to 105 °C) ...

  • Page 13

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 2. Clock tree 4. To have an ADC conversion time of 1.2 µs, APB2 must MHz. Doc ID 16455 Rev 6 Description 13/87 ...

  • Page 14

    Description 2.2 Overview ® 2.2.1 ARM Cortex™-M3 core with embedded Flash and SRAM The ARM Cortex™-M3 processor is the latest generation of ARM processors for embedded systems. It has been developed to provide a low-cost platform that meets the needs ...

  • Page 15

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 2.2.6 External interrupt/event controller (EXTI) The external interrupt/event controller consists of 18 edge detector lines used to generate interrupt/event requests. Each line can be independently configured to select the trigger event (rising edge, falling edge, both) ...

  • Page 16

    Description than the V threshold. The interrupt service routine can then generate a warning PVD message and/or put the MCU into a safe state. The PVD is enabled by software. 2.2.11 Voltage regulator The regulator has three operation modes: main ...

  • Page 17

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Each channel is connected to dedicated hardware DMA requests, with support for software trigger on each channel. Configuration is made by software and transfer sizes between source and destination are independent. The DMA can be used ...

  • Page 18

    Description Advanced-control timer (TIM1) The advanced-control timer (TIM1) can be seen as a three-phase PWM multiplexed on 6 channels. It has complementary PWM outputs with programmable inserted dead times. It can also be seen as a complete general-purpose timer. The ...

  • Page 19

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Their counters can be frozen in debug mode. Basic timers TIM6 and TIM7 These timers are mainly used for DAC trigger generation. They can also be used as a generic 16-bit time base. Independent watchdog The ...

  • Page 20

    Description 2.2.18 Serial peripheral interface (SPI two SPIs are able to communicate Mbit/s in slave and master modes in full- duplex and simplex communication modes. The 3-bit prescaler gives 8 master mode frequencies and the ...

  • Page 21

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 2.2.23 DAC (digital-to-analog converter) The two 12-bit buffered DAC channels can be used to convert two digital signals into two analog voltage signal outputs. The chosen design structure is composed of integrated resistor strings and an ...

  • Page 22

    Pinouts and pin description 3 Pinouts and pin description Figure 3. STM32F100xx value line LQFP100 pinout VBAT PC13-TAMPER-RTC PC14-OSC32_IN PC15-OSC32_OUT VSS_5 VDD_5 OSC_IN OSC_OUT NRST VSSA VREF- VREF+ VDDA PA0-WKUP 22/87 STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB PE2 1 PE3 2 PE4 ...

  • Page 23

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 4. STM32F100xx value line LQFP64 pinout PC13-TAMPER-RTC PC15-OSC32_OUT Figure 5. STM32F100xx value line LQFP48 pinout PC13-TAMPER-RTC PC15-OSC32_OUT VBAT 1 ...

  • Page 24

    Pinouts and pin description Figure 6. STM32F100xx value line TFBGA64 ballout 1 PC14- A OSC32_IN PC15- B OSC32_OUT C OSC_IN D OSC_OUT E NRST V SSA F V REF DDA Table 4. STM32F100xx pin definitions Pins Pin ...

  • Page 25

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 4. STM32F100xx pin definitions (continued) Pins Pin name PC15 OSC32_OUT SS_5 DD_5 OSC_IN ...

  • Page 26

    Pinouts and pin description Table 4. STM32F100xx pin definitions (continued) Pins Pin name PB0 PB1 PB2 PE7 PE8 40 - ...

  • Page 27

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 4. STM32F100xx pin definitions (continued) Pins Pin name PC6 PC7 PC8 PC9 PA8 ...

  • Page 28

    ... STM32F10xxx reference manual. 12. This alternate function can be remapped by software to some other port pins (if available on the used package). For more details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual, available from the STMicroelectronics website: www.st.com. 28/87 STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB ...

  • Page 29

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 4 Memory mapping The memory map is shown in Figure 7. Memory map 0xFFFF FFFF 7 0xE010 0000 Cortex-M3 internal peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 0000 2 ...

  • Page 30

    Electrical characteristics 5 Electrical characteristics 5.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 5.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...

  • Page 31

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 8. Pin loading conditions 5.1.6 Power supply scheme Figure 10. Power supply scheme Caution: In Figure 10, the 4.7 µF capacitor must be connected to V Figure 9. STM32F10xxx pin ai14123b ...

  • Page 32

    Electrical characteristics 5.1.7 Current consumption measurement Figure 11. Current consumption measurement scheme 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 6: Current characteristics, and damage to the device. These are stress ratings only and functional ...

  • Page 33

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 6. Current characteristics Symbol I Total current into V VDD I Total current out of V VSS Output current sunk by any I/O and control pin I IO Output current source by any I/Os and ...

  • Page 34

    Electrical characteristics Table 8. General operating conditions (continued) Symbol Power dissipation °C for suffix 105 °C for suffix 7 Ambient temperature for 6 suffix version T A Ambient temperature for 7 suffix ...

  • Page 35

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB . Table 10. Embedded reset and power control block characteristics Symbol Programmable voltage V PVD detector level selection (2) V PVD hysteresis PVDhyst Power on/power down V POR/PDR reset threshold (2) V PDR hysteresis PDRhyst (2) ...

  • Page 36

    Electrical characteristics 5.3.4 Embedded reference voltage The parameters given in temperature and V Table 11. Embedded internal reference voltage Symbol V Internal reference voltage REFINT ADC sampling time when (1) T reading the internal S_vrefint reference voltage Internal reference voltage ...

  • Page 37

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 12. Maximum current consumption in Run mode, code with data processing running from Flash Symbol Parameter Supply I current in DD Run mode 1. Based on characterization, not tested in production. 2. External clock is ...

  • Page 38

    Electrical characteristics Figure 12. Maximum current consumption in Run mode versus frequency (at 3 code with data processing running from RAM, peripherals enabled Figure 13. Maximum current consumption in Run mode versus frequency (at 3 code ...

  • Page 39

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 15. Typical and maximum current consumptions in Stop and Standby modes Symbol Parameter Regulator in Run mode, Low-speed and high-speed internal RC oscillators and high- speed oscillator OFF (no independent watchdog) Supply current in Stop ...

  • Page 40

    Electrical characteristics Figure 15. Typical current consumption in Stop mode with regulator in Run mode versus temperature at V Figure 16. Typical current consumption in Stop mode with regulator in Low-power mode versus temperature at V 40/87 STM32F100x4, STM32F100x6, STM32F100x8, ...

  • Page 41

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 17. Typical current consumption in Standby mode versus temperature at V 3.6 V Typical current consumption The MCU is placed under the following conditions: ● All I/O pins are in input mode with a static ...

  • Page 42

    Electrical characteristics Table 16. Typical current consumption in Run mode, code with data processing running from Flash Symbol Parameter Supply I current in DD Run mode 1. Typical values are measures Add an additional power consumption of ...

  • Page 43

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 17. Typical current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply current Sleep mode 1. Typical values are measures Add an additional power consumption ...

  • Page 44

    Electrical characteristics Table 18. Peripheral current consumption Peripheral TIM2 TIM3 TIM4 TIM6 TIM7 DAC APB1 WWDG SPI2 USART2 USART3 I2C1 I2C2 HDMI CEC GPIO A GPIO B GPIO C GPIO D GPIO E ADC1 APB2 SPI1 USART1 TIM1 TIM15 TIM16 ...

  • Page 45

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 19. High-speed external user clock characteristics Symbol User external clock source f HSE_ext frequency OSC_IN input pin high level V HSEH voltage OSC_IN input pin low level V HSEL voltage t w(HSE) OSC_IN high or ...

  • Page 46

    Electrical characteristics Figure 18. High-speed external clock source AC timing diagram V HSEH 90% 10% V HSEL t r(HSE) External clock source Figure 19. Low-speed external clock source AC timing diagram V LSEH 90% 10% V LSEL t r(LSE) External ...

  • Page 47

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 21. HSE 4-24 MHz oscillator characteristics Symbol f Oscillator frequency OSC_IN R Feedback resistor F Recommended load capacitance C L1 versus equivalent serial ( resistance of the crystal (R i HSE driving current ...

  • Page 48

    Electrical characteristics Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical ...

  • Page 49

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 21. Typical application with a 32.768 kHz crystal Resonator with integrated capacitors 5.3.7 Internal clock source characteristics The parameters given in temperature and V High-speed internal (HSI) RC oscillator Table 23. ...

  • Page 50

    Electrical characteristics Low-speed internal (LSI) RC oscillator Table 24. LSI oscillator characteristics Symbol f Frequency LSI Δf Temperature-related frequency drift LSI(T) (3) t LSI oscillator startup time su(LSI) (3) I LSI oscillator power consumption DD(LSI ...

  • Page 51

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.3.8 PLL characteristics The parameters given in temperature and V Table 26. PLL characteristics Symbol PLL input clock f PLL_IN PLL input clock duty cycle f PLL multiplier output clock PLL_OUT t PLL lock time LOCK ...

  • Page 52

    Electrical characteristics 5.3.9 Memory characteristics Flash memory The characteristics are given at T Table 27. Flash memory characteristics Symbol t 16-bit programming time prog t Page (1 KB) erase time ERASE t Mass erase time ME I Supply current DD ...

  • Page 53

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.3.10 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (Electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is ...

  • Page 54

    Electrical characteristics Electromagnetic Interference (EMI) The electromagnetic field emitted by the device is monitored while a simple application is executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with IEC 61967-2 standard which specifies the test ...

  • Page 55

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 5.3.12 I/O current injection characteristics As a general rule, current injection to the I/O pins, due to external voltage below V above V (for standard, 3 V-capable I/O pins) should be avoided during normal product DD ...

  • Page 56

    Electrical characteristics 5.3.13 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 34. I/O static characteristics Symbol Parameter Standard I/O input low level voltage V IL (1) I/O ...

  • Page 57

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 22. Standard I/O input characteristics - CMOS port Figure 23. Standard I/O input characteristics - TTL port Doc ID 16455 Rev 6 Electrical characteristics 57/87 ...

  • Page 58

    Electrical characteristics Figure 24 tolerant I/O input characteristics - CMOS port Figure 25 tolerant I/O input characteristics - TTL port Output driving current The GPIOs (general-purpose inputs/outputs) can sink or source up to ±8 mA, and ...

  • Page 59

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Output voltage levels Unless otherwise specified, the parameters given in performed under the ambient temperature and V in Table 8. All I/Os are CMOS and TTL compliant. Table 35. Output voltage characteristics Symbol Output Low level ...

  • Page 60

    Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 36, respectively. Unless otherwise specified, the parameters given in performed under the ambient temperature and V in Table 8. Table 36. I/O AC ...

  • Page 61

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 26. I/O AC characteristics definition EXT ERNAL OUTPUT ON 50pF Maximum frequency is achieved ≤ 2/3)T and if the duty cycle is (45-55%) 5.3.14 NRST pin characteristics The ...

  • Page 62

    Electrical characteristics 5.3.15 TIMx characteristics The parameters given in Refer to Section 5.3.12: I/O current injection characteristics alternate function characteristics (output compare, input capture, external clock, PWM output). Table 38. TIMx characteristics Symbol t Timer resolution time res(TIM) Timer external ...

  • Page 63

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 2 Table 39 characteristics Symbol t SCL clock low time w(SCLL) t SCL clock high time w(SCLH) t SDA setup time su(SDA) t SDA data hold time h(SDA) t r(SDA) SDA and SCL rise ...

  • Page 64

    Electrical characteristics 2 Figure 28 bus AC waveforms and measurement circuit 1. Measurement points are done at CMOS levels: 0.3V Table 40. SCL frequency ( External pull-up resistance For speeds around 400 ...

  • Page 65

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB SPI interface characteristics Unless otherwise specified, the parameters given in performed under the ambient temperature, f conditions summarized in Refer to Section 5.3.12: I/O current injection characteristics input/output alternate function characteristics (NSS, SCK, MOSI, MISO). Table ...

  • Page 66

    Electrical characteristics Figure 29. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure ...

  • Page 67

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 31. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTUT 1. Measurement points are done at CMOS levels: ...

  • Page 68

    Electrical characteristics Table 42. ADC characteristics Symbol Parameter V Power supply DDA V Positive reference voltage REF+ Current on the V input REF I VREF pin f ADC clock frequency ADC (2) Sampling rate f S (2) f External trigger ...

  • Page 69

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB The above formula error below 1/4 of LSB. Here (from 12-bit resolution). Table 43. R AIN T (cycles) s 1.5 7.5 13.5 28.5 41.5 55.5 71.5 239.5 1. Guaranteed by design, not tested ...

  • Page 70

    Electrical characteristics add a Schottky diode (pin to ground) to standard analog pins which may potentially inject negative currents. Any positive injection current within the limits specified for I Section 5.3.12 does not affect the ADC accuracy. Figure 32. ADC ...

  • Page 71

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 34. Power supply and reference decoupling (V 1 µ available on 100-pin packages and on TFBGA64 packages. V REF+ packages only. Figure 35. Power supply and reference decoupling (V ...

  • Page 72

    Electrical characteristics 5.3.18 DAC electrical specifications Table 46. DAC characteristics Symbol Parameter V Analog supply voltage DDA V Reference supply voltage REF+ V Ground SSA (2) R Resistive load with buffer ON LOAD (1) R Impedance output with buffer OFF ...

  • Page 73

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Table 46. DAC characteristics (continued) Symbol Parameter Offset error (difference between measured value (3) Offset at Code (0x800) and the ideal value = V /2) REF+ Gain Gain error (3) error Settling time (full scale: for ...

  • Page 74

    Electrical characteristics 5.3.19 Temperature sensor characteristics Table 47. TS characteristics Symbol ( linearity with temperature L SENSE (1) Avg_Slope Average slope (1) V Voltage at 25°C 25 (2) t Startup time START (3)(2) T ADC sampling time when ...

  • Page 75

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and ...

  • Page 76

    Package characteristics Figure 37. LQFP100 mm, 100-pin low-profile quad flat package outline 100 26 Pin identification e 1. Drawing is not to scale. 2. Dimensions are in ...

  • Page 77

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 39. LQFP64 – mm, 64 pin low-profile quad flat package outline Pin 1 identification Drawing is not to scale. 2. ...

  • Page 78

    Package characteristics Figure 41. TFBGA64 - active ball array mm, 0.5 mm pitch, package outline Seating plane 1. Drawing is not to scale. Table 50. TFBGA64 - active ball array, 5 ...

  • Page 79

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Figure 42. Recommended PCB design rules for pads (0.5 mm pitch BGA) Dpad Dsm 1. Non solder mask defined (NSMD) pads are recommended mils solder paste screen printing process Pitch 0.5 mm ...

  • Page 80

    Package characteristics Figure 43. LQFP48 – mm, 48-pin low-profile quad flat package outline Seating plane ccc Pin 1 1 identification 1. Drawing is not to ...

  • Page 81

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 6.2 Thermal characteristics The maximum chip junction temperature (T Table 8: General operating conditions on page The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in °C, ● T ...

  • Page 82

    Package characteristics 6.2.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation and, to ...

  • Page 83

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Using the values obtained in – For LQFP100, 46 °C 115 °C + (46 °C/W × 134 mW) = 115 °C + 6.2 °C = 121.2 °C Jmax This is within the range of ...

  • Page 84

    Ordering information scheme 7 Ordering information scheme Table 53. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type F = General-purpose Device subfamily 100 = value line Pin count pins ...

  • Page 85

    STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB 8 Revision history Table 54. Document revision history Date Revision 12-Oct-2009 26-Feb-2010 1 Initial release. TFBGA64 package added (see Note 5 modified in Table 4: STM32F100xx pin I modified in Table 6: Current INJ(PIN) removed from ...

  • Page 86

    Revision history Table 54. Document revision history (continued) Date Revision 30-Mar-2010 06-May-2010 12-Jul-2010 04-Apr-2011 86/87 STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Revision history corrected. Updated Table 6: Current characteristics Values and note updated in Run mode, code with data processing running from ...

  • Page 87

    ... STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...