STM32F102RB

Manufacturer Part NumberSTM32F102RB
DescriptionMainstream USB Access line, ARM Cortex-M3 MCU with 128 Kbytes Flash, 48 MHz CPU, USB FS
ManufacturerSTMicroelectronics
STM32F102RB datasheet
 


Specifications of STM32F102RB

CoreARM 32-bit Cortex™-M3 CPUPeripherals Supportedtimers, ADC, SPIs, I2Cs and USARTs
Conversion Range0 to 3.6 VSystick Timer24-bit downcounter
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Medium-density USB access line, ARM-based 32-bit MCU with 64/128KB
Flash, USB FS interface, 6 timers, ADC & 8 communication interfaces
Features
Core: ARM 32-bit Cortex™-M3 CPU
– 48 MHz maximum frequency,
1.25 DMIPS/MHz (Dhrystone 2.1)
performance at 0 WS memory access
– Single-cycle multiplication and hardware
division
Memories
– 64 or 128 Kbytes of Flash memory
– 10 or 16 Kbytes of SRAM
Clock, reset and supply management
– 2.0 to 3.6 V application supply and I/Os
– POR, PDR and programmable voltage
detector (PVD)
– 4-to-16 MHz crystal oscillator
– Internal 8 MHz factory-trimmed RC
– Internal 40 kHz RC
– PLL for CPU clock
– 32 kHz oscillator for RTC with calibration
Low power
– Sleep, Stop and Standby modes
– V
supply for RTC and backup registers
BAT
Debug mode
– Serial wire debug (SWD) and JTAG
interfaces
DMA
– 7-channel DMA controller
– Peripherals supported: timers, ADC, SPIs,
2
I
Cs and USARTs
1 × 12-bit, 1.2 µs A/D converter (up to 16
channels)
– Conversion range: 0 to 3.6 V
– Temperature sensor
Up to 51 fast I/O ports
– 37/51 IOs all mappable on 16 external
interrupt vectors and almost all 5 V-tolerant
September 2009
LQFP64
10 × 10 mm
Up to 6 timers
– Three 16-bit timers, each with up to 4
IC/OC/PWM or pulse counter
– 2 watchdog timers (Independent and
Window)
– SysTick timer: 24-bit downcounter
Up to 8 communication interfaces
2
– Up to 2 x I
C interfaces (SMBus/PMBus)
– Up to 3 USARTs (ISO 7816 interface, LIN,
IrDA capability, modem control)
– Up to 2 SPIs (12 Mbit/s)
– USB 2.0 full speed interface
CRC calculation unit, 96-bit unique ID
®
ECOPACK
packages
Table 1.
Device summary
Reference
STM32F102x8
STM32F102C8, STM32F102R8
STM32F102xB
STM32F102CB, STM32F102RB
Doc ID 15056 Rev 3
STM32F102x8
STM32F102xB
LQFP48
7 × 7 mm
Part number
1/69
www.st.com
1

STM32F102RB Summary of contents

  • Page 1

    ... SPIs (12 Mbit/s) – USB 2.0 full speed interface ■ CRC calculation unit, 96-bit unique ID ® ■ ECOPACK packages Table 1. Device summary Reference STM32F102x8 STM32F102C8, STM32F102R8 STM32F102xB STM32F102CB, STM32F102RB Doc ID 15056 Rev 3 STM32F102x8 STM32F102xB LQFP48 7 × Part number 1/69 www.st.com 1 ...

  • Page 2

    Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 3

    STM32F102x8, STM32F102xB 5.3.13 5.3.14 5.3.15 5.3.16 5.3.17 6 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 4

    List of tables List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 5

    STM32F102x8, STM32F102xB Table 45. R max for f AIN ADC Table 46. ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . ...

  • Page 6

    List of figures List of figures Figure 1. STM32F102xx medium-density USB access line block diagram . . . . . . . . . . . . . . . . . . . . 10 Figure 2. Clock tree ...

  • Page 7

    ... This datasheet provides the ordering information and mechanical device characteristics of the STM32F102x4 and STM32F102x6 medium-density USB access line microcontrollers. For more details on the whole STMicroelectronics STM32F102xx family, please refer to Section 2.2: Full compatibility throughout the The medium-density STM32F102xx datasheet should be read in conjunction with the low-, medium- and high-density STM32F10xxx reference manual ...

  • Page 8

    Description 2 Description The STM32F102xx medium-density USB access line incorporates the high-performance ARM Cortex™-M3 32-bit RISC core operating MHz frequency, high-speed embedded memories (Flash memory 128 Kbytes and SRAM Kbytes), ...

  • Page 9

    STM32F102x8, STM32F102xB 2.1 Device overview Table 2. STM32F102x8 and STM32F102xB medium-density USB access line features and peripheral counts Peripheral Flash - Kbytes SRAM - Kbytes Timers Communication interfaces 12-bit synchronized ADC number of channels GPIOs CPU frequency Operating voltage Operating ...

  • Page 10

    Description Figure 1. STM32F102xx medium-density USB access line block diagram TRACECLK TRACED[0: JNTRST JTDI JTCK/SWCLK JTMS/SWDIO JTDO as AF NRST VDDA VSSA 51AF PA[ 15:1] PB[ 15:0] PC[15:0] PD[2:0] MOSI,MISO, SCK,NSS as AF RX,TX, CTS, RTS, Smart Card ...

  • Page 11

    STM32F102x8, STM32F102xB Figure 2. Clock tree OSC_OUT 4-16 MHz HSE OSC OSC_IN OSC32_IN LSE OSC 32.768 kHz OSC32_OUT Main Clock Output MCO 1. For the USB function to be available, both HSE and PLL must be enabled, with the CPU ...

  • Page 12

    Description 2.2 Full compatibility throughout the family The STM32F102xx is a complete family whose members are fully pin-to-pin, software and feature compatible. In the reference manual, the STM32F102x4 and STM32F102x6 are referred to as low-density devices and the STM32F102x8 and ...

  • Page 13

    STM32F102x8, STM32F102xB CRC (cyclic redundancy check) calculation unit The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial. Among other applications, CRC-based techniques are used to ...

  • Page 14

    Description Boot modes At startup, boot pins are used to select one of five boot options: ● Boot from User Flash ● Boot from System Memory ● Boot from embedded SRAM The boot loader is located in System Memory. It ...

  • Page 15

    STM32F102x8, STM32F102xB Low-power modes The STM32F102xx medium-density USB access line supports three low-power modes to achieve the best compromise between low power consumption, short startup time and available wakeup sources: ● Sleep mode In Sleep mode, only the CPU is ...

  • Page 16

    Description register to generate an alarm. A 20-bit prescaler is used for the time base clock and is by default configured to generate a time base of 1 second from a clock at 32.768 kHz. Independent watchdog The independent watchdog ...

  • Page 17

    STM32F102x8, STM32F102xB Universal synchronous/asynchronous receiver transmitter (USART) The available USART interfaces communicate 2.25 Mbit/s. They provide hardware management of the CTS and RTS signals, support IrDA SIR ENDEC, are ISO 7816 compliant and have LIN Master/Slave capability. ...

  • Page 18

    Pinouts and pin description 3 Pinouts and pin description Figure 3. STM32F102xx medium-density USB access line LQFP48 pinout PC13-TAMPER-RTC PC15-OSC32_OUT Figure 4. STM32F102xx medium-density USB access line LQFP64 pinout PC13-TAMPER-RTC PC15-OSC32_OUT 18/ ...

  • Page 19

    STM32F102x8, STM32F102xB Table 4. Medium-density STM32F102xx pin definitions Pins Pin name BAT 2 2 PC13-TAMPER-RTC 3 3 PC14-OSC32_IN 4 4 PC15-OSC32_OUT 5 5 PD0 6 6 PD1 7 7 NRST - 8 PC0 - 9 PC1 - ...

  • Page 20

    Pinouts and pin description Table 4. Medium-density STM32F102xx pin definitions (continued) Pins Pin name 21 29 PB10 22 30 PB11 SS_1 DD_1 25 33 PB12 26 34 PB13 27 35 PB14 28 36 PB15 ...

  • Page 21

    ... The use of PD0 and PD1 in output mode is limited as they can only be used at 50 MHz in output mode. 8. This alternate function can be remapped by software to some other port pins (if available on the used package). For more details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual, available from the STMicroelectronics website: www.st.com. Main (3) ...

  • Page 22

    Memory mapping 4 Memory mapping The memory map is shown in Figure 5. Memory map 0xFFFF FFFF 7 0xE010 0000 Cortex-M3 internal peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 0000 2 Peripherals 0x4000 ...

  • Page 23

    STM32F102x8, STM32F102xB 5 Electrical characteristics 5.1 Parameter conditions Unless otherwise specified, all voltages are referred to V 5.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...

  • Page 24

    Electrical characteristics Figure 6. Pin loading conditions 5.1.6 Power supply scheme Figure 8. Power supply scheme 1.8-3 × 100 × 4.7 µ µF Caution: In ...

  • Page 25

    STM32F102x8, STM32F102xB 5.1.7 Current consumption measurement Figure 9. Current consumption measurement scheme 5.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 6: Current characteristics, and damage to the device. These are stress ratings only and functional ...

  • Page 26

    Electrical characteristics Table 6. Current characteristics Symbol I Total current into V VDD I Total current out of V VSS Output current sunk by any I/O and control pin I IO Output current source by any I/Os and control pin ...

  • Page 27

    STM32F102x8, STM32F102xB 5.3 Operating conditions 5.3.1 General operating conditions Table 8. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock frequency PCLK2 V Standard operating voltage DD Analog operating ...

  • Page 28

    Electrical characteristics 5.3.3 Embedded reset and power control block characteristics The parameters given in temperature and V . Table 10. Embedded reset and power control block characteristics Symbol Programmable voltage V PVD detector level selection (2) V PVD hysteresis PVDhyst ...

  • Page 29

    STM32F102x8, STM32F102xB Table 11. Embedded internal reference voltage Symbol V Internal reference voltage REFINT ADC sampling time when reading (1) T S_vrefint the internal reference voltage Internal reference voltage spread (2) V RERINT over the temperature range (2) T Temperature ...

  • Page 30

    Electrical characteristics Table 12. Maximum current consumption in Run mode, code with data processing running from Flash Symbol Parameter Supply current Run mode 1. Based on characterization results, not tested in production. 2. External clock is 8 ...

  • Page 31

    STM32F102x8, STM32F102xB Figure 10. Typical current consumption in Run mode versus temperature (at 3 code with data processing running from RAM, peripherals enabled Figure 11. Typical current consumption in Run mode ...

  • Page 32

    Electrical characteristics Table 14. Maximum current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply current Sleep mode 1. Based on characterization, tested in production External clock is 8 MHz ...

  • Page 33

    STM32F102x8, STM32F102xB Figure 12. Typical current consumption values BAT 2.5 2 1.5 1 0.5 0 Figure 13. Typical current consumption in Stop mode with regulator in Run mode versus temperature at V 140 120 100 80 60 ...

  • Page 34

    Electrical characteristics Figure 14. Typical current consumption in Stop mode with regulator in Low-power mode versus temperature at V 140 120 100 -40 Figure 15. Typical current consumption in Standby mode versus temperature at V ...

  • Page 35

    STM32F102x8, STM32F102xB Typical current consumption The MCU is placed under the following conditions: ● All I/O pins are in input mode with a static value at V ● All peripherals are disabled except explicitly mentioned ● The ...

  • Page 36

    Electrical characteristics Table 17. Typical current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply IDD current in Sleep mode 1. Typical values are measures Add an additional power consumption of 0.8 mA ...

  • Page 37

    STM32F102x8, STM32F102xB On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in under the following conditions: ● all I/O pins are in input mode with a static value at V ● all peripherals are disabled unless ...

  • Page 38

    Electrical characteristics 5.3.6 External clock source characteristics High-speed external user clock generated from an external source The characteristics given in external clock source, and under ambient temperature and supply voltage conditions summarized in Table Table 19. High-speed external user clock ...

  • Page 39

    STM32F102x8, STM32F102xB Figure 16. High-speed external clock source AC timing diagram V HSEH 90% 10% V HSEL t r(HSE) External clock source Figure 17. Low-speed external clock source AC timing diagram V LSEH 90% 10% V LSEL t r(LSE) External ...

  • Page 40

    Electrical characteristics High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with MHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained ...

  • Page 41

    STM32F102x8, STM32F102xB Figure 18. Typical application with an 8 MHz crystal integrated capacitors 1. R value depends on the crystal characteristics. EXT Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a ...

  • Page 42

    Electrical characteristics Caution: To avoid exceeding the maximum value use a resonator with a load capacitance C capacitance of 12.5 pF. Example: if you choose a resonator with a load capacitance of C then ...

  • Page 43

    STM32F102x8, STM32F102xB low-speed internal (LSI) RC oscillator Table 24. LSI oscillator characteristics Symbol f Frequency LSI (3) t LSI oscillator startup time su(LSI) (3) I LSI oscillator power consumption DD(LSI) =  °C unless otherwise specified ...

  • Page 44

    Electrical characteristics Table 26. PLL characteristics (continued) Symbol t PLL lock time LOCK Jitter Cycle-to-cycle jitter 1. Based on characterization, not tested in production. 2. Take care of using the appropriate multiplier factors have PLL input clock ...

  • Page 45

    STM32F102x8, STM32F102xB Functional EMS (Electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: ...

  • Page 46

    Electrical characteristics Table 30. EMI characteristics Symbol Parameter S Peak level EMI 5.3.11 Absolute maximum ratings (electrical sensitivity) Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in ...

  • Page 47

    STM32F102x8, STM32F102xB 5.3.12 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 33. I/O static characteristics Symbol V Input low level voltage IL Standard IO input high level ...

  • Page 48

    Electrical characteristics Output driving current The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink +20 mA (with a relaxed V In the user application, the number of I/O pins which can drive current must ...

  • Page 49

    STM32F102x8, STM32F102xB Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 35, respectively. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 8. Table 35. I/O AC characteristics MODEx ...

  • Page 50

    Electrical characteristics Figure 20. I/O AC characteristics definition EXT ERNAL OUTPUT ON 50pF Maximum frequency is achieved 2/3)T and if the duty cycle is (45-55%) 5.3.13 NRST pin characteristics The NRST pin input ...

  • Page 51

    STM32F102x8, STM32F102xB 5.3.14 TIM timer characteristics The parameters given in Refer to Section 5.3.12: I/O port characteristics function characteristics (output compare, input capture, external clock, PWM output). Table 37. TIMx Symbol t Timer resolution time res(TIM) Timer external clock f ...

  • Page 52

    Electrical characteristics 2 Table 38 characteristics Symbol t SCL clock low time w(SCLL) t SCL clock high time w(SCLH) t SDA setup time su(SDA) t SDA data hold time h(SDA) t r(SDA) SDA and SCL rise time t ...

  • Page 53

    STM32F102x8, STM32F102xB 2 Figure 22 bus AC waveforms and measurement circuit I²C bus S TART SDA t f(SDA) t h(STA) SCL t w(SCKH) 1. Measurement points are done at CMOS levels: 0.3V Table 39. SCL frequency (f 1. ...

  • Page 54

    Electrical characteristics SPI interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table Refer to Section 5.3.12: I/O port characteristics function characteristics (NSS, SCK, MOSI, MISO). Table 40. SPI characteristics Symbol f SCK ...

  • Page 55

    STM32F102x8, STM32F102xB Figure 23. SPI timing diagram - slave mode and CPHA=0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure 24. SPI ...

  • Page 56

    Electrical characteristics Figure 25. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTUT 1. Measurement points are done at CMOS levels: 0.3V USB ...

  • Page 57

    STM32F102x8, STM32F102xB Table 42. USB DC electrical characteristics Symbol V USB operating voltage DD (4) V Differential input sensitivity Input DI levels (4) V Differential common mode range CM (4) V Single ended receiver threshold SE V Static output level ...

  • Page 58

    Electrical characteristics Table 44. ADC characteristics Symbol V Power supply DDA f ADC clock frequency ADC (1) Sampling rate f S (1) External trigger frequency f TRIG V Conversion voltage range AIN (1) R External input impedance AIN (1) Sampling ...

  • Page 59

    STM32F102x8, STM32F102xB Table 45. R AIN T (cycles) s 1.5 7.5 13.5 28.5 41.5 55.5 71.5 239.5 1. Data guaranteed by design, not tested in production. Table 46. ADC accuracy - limited test conditions Symbol ET Total unadjusted error EO ...

  • Page 60

    Electrical characteristics Figure 27. ADC accuracy characteristics [1LSB = IDEAL 4095 4094 4093 SSA Figure 28. Typical connection diagram using the ADC R AIN (1) V AIN ...

  • Page 61

    STM32F102x8, STM32F102xB General PCB design guidelines Power supply decoupling should be performed as shown in should be ceramic (good quality). They should be placed as close as possible to the chip. Figure 29. Power supply and reference decoupling 5.3.17 Temperature ...

  • Page 62

    Package characteristics 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...

  • Page 63

    STM32F102x8, STM32F102xB Figure 30. LQFP64 – mm, 64 pin low-profile quad flat package outline Drawing is not to scale. 2. Dimensions are in millimeters. Table 49. LQFP64 – mm, ...

  • Page 64

    Package characteristics Figure 32. LQFP48 – mm, 48-pin low-profile quad flat package outline Seating plane ccc Pin 1 1 identification 1. Drawing is not to ...

  • Page 65

    STM32F102x8, STM32F102xB 6.2 Thermal characteristics The maximum chip junction temperature (T Table 8: General operating conditions on page The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in C, ●  ...

  • Page 66

    Package characteristics 6.3.1 Evaluating the maximum junction temperature for an application When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum ...

  • Page 67

    STM32F102x8, STM32F102xB 7 Ordering information scheme Table 52. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type F = general-purpose Device subfamily 102 = USB access line, USB 2.0 full-speed interface Pin count ...

  • Page 68

    Revision history 8 Revision history Table 53. Document revision history Date Revision 23-Sep-2008 23-Apr-2009 22-Sep-2009 68/69 1 Initial release. I/O information clarified on page density USB access line block diagram modified. In Table 4: Medium-density STM32F102xx pin PB14, PB15, PB3/TRACESWO ...

  • Page 69

    ... STM32F102x8, STM32F102xB Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...