STM32L152QD STMicroelectronics, STM32L152QD Datasheet

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STM32L152QD

Manufacturer Part Number
STM32L152QD
Description
Ultra-low-power ARM Cortex-M3 MCU with 384 Kbytes Flash, 32 MHz CPU, LCD, USB, 3xOp-amp
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM32L152QD

Operating Power Supply Range
1.65 V to 3.6 V (without BOR) or 1.8 V to 3.6 V
7 Modes
Sleep, Low-power run (11 μA at 32 kHz) , Low-power sleep (4.4 μA), Stop with RTC, Stop (650 nA), Standby with RTC, Standby (300 nA)
Ultralow Leakage Per I/o
50 nA max
Fast Wakeup Time From Stop
8 μs
Core
ARM 32-bit Cortex™-M3 CPU
Dma
12-channel DMA controller
11 Timers
one 32-bit and six 16-bit general-purpose timers, two 16-bit basic timers, two watchdog timers (independent and window)

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Features
February 2012
Operating conditions
– Operating power supply range: 1.65 V to
Low power features
– 7 modes: Sleep, Low-power run (11 µA at
– Dynamic core voltage scaling down to
– Ultralow leakage per I/O: 50 nA max
– Fast wakeup time from Stop: 8 µs
– Three wakeup pins
Core: ARM 32-bit Cortex
– 32 MHz maximum frequency,
– Memory protection unit
Reset and supply management
– Low power, ultrasafe BOR (brownout reset)
– Ultralow power POR/PDR
– Programmable voltage detector (PVD)
Clock management
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 16 MHz factory-trimmed RC
– Internal 37 kHz low consumption RC
– Internal multispeed low power RC, 65 kHz
– PLL for CPU clock and USB (48 MHz)
Memories
– 384 Kbytes of Flash memory with ECC,
– 12 Kbytes of data EEPROM with ECC
– NVM in 2 banks enabling Read While Write
– 48 Kbytes of RAM
– Flexible static memory controller that
3.6 V (without BOR) or 1.8 V to 3.6 V
32 kHz) , Low-power sleep (4.4 µA), Stop
with RTC, Stop (650 nA), Standby with
RTC, Standby (300 nA)
233 µA/MHz
33.3 DMIPS peak (Dhrystone 2.1)
to 4.2 MHz
split into two banks allowing Read While
Write
supports SRAM, PSRAM and NOR Flash
RTC, LCD, USB, analog functions, 10 serial ports, memory I/F
Ultralow power ARM-based 32-bit MCU with 384 KB Flash,
-M3 CPU
Doc ID 022027 Rev 2
Table 1.
STM32L151xx
STM32L152xx
Reference
Low power calendar RTC
– Alarm, periodic wakeup from Stop/Standby
Up to 116 fast I/Os (102 of which are 5 V-
tolerant)
DMA: 12-channel DMA controller
LCD 8 × 40 or 4 × 44 with step-up converter
3 operational amplifiers
12-bit ADC up to 1 Msps and 40 channels
– Operational amplifier output, temperature
– Operates down to 1.8 V
Two 12-bit DACs with output buffers
Two ultralow power comparators
– Window mode and wakeup capability
11 timers: one 32-bit and six 16-bit general-
purpose timers, two 16-bit basic timers, two
watchdog timers (independent and window)
Up to 12 communication interfaces
– Up to two I2C interfaces (SMBus/PMBus)
– Up to five USARTs
– Up to three SPIs (16 Mbit/s), two with I2S
– USB 2.0 full-speed interface
– SDIO interface
Up to 36 capacitive sensing channels
supporting touch, proximity, linear and rotary
sensors
32-bit CRC calculation unit, 96-bit unique ID
sensor and internal voltage reference
LQFP144 20 × 20 mm
LQFP100 14 × 14 mm
LQFP64 10 × 10 mm
Device summary
STM32L151QD STM32L151RD
STM32L151VD STM32L151ZD
STM32L152QD STM32L152RD
STM32L152VD STM32L152ZD
STM32L151xD
STM32L152xD
Part number
UFBGA132 7 × 7 mm
www.st.com
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Related parts for STM32L152QD

STM32L152QD Summary of contents

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... Table 1. Reference STM32L151xx STM32L152xx Doc ID 022027 Rev 2 STM32L151xD STM32L152xD LQFP144 20 × LQFP100 14 × LQFP64 10 × UFBGA132 7 × sensor and internal voltage reference Device summary Part number STM32L151QD STM32L151RD STM32L151VD STM32L151ZD STM32L152QD STM32L152RD STM32L152VD STM32L152ZD 1/121 www.st.com 1 ...

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Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32L151xD, STM32L152xD 3.17.1 3.17.2 3.17.3 3.17.4 3.17.5 3.18 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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Contents 6.3.7 6.3.8 6.3.9 6.3.10 6.3.11 6.3.12 6.3.13 6.3.14 6.3.15 6.3.16 6.3.17 6.3.18 6.3.19 6.3.20 6.3.21 6.3.22 7 Package characteristics . . . . . . . . . . . . . . . . . . . . ...

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STM32L151xD, STM32L152xD List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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List of tables Table 49. I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32L151xD, STM32L152xD List of figures Figure 1. Ultralow power STM32L15xxD block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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Introduction 1 Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32L151xD and STM32L152xD ultralow power ARM Cortex™-based microcontrollers product line. The ultralow power STM32L15xxD family includes devices in 4 different package types: from 64 pins ...

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STM32L151xD, STM32L152xD 2 Description The ultralow power STM32L15xxD incorporates the connectivity power of the universal serial bus (USB) with the high-performance ARM Cortex a 32 MHz frequency, a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 384 ...

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Description 2.1 Device overview Table 2. Ultralow power STM32L15xxD device features and peripheral counts Peripheral Flash - Kbytes Data EEPROM RAM - Kbytes FSMC Timers Communication interfaces GPIOs Operation amplifiers 12-bit synchronized ADC Number of channels 12-bit DAC Number of ...

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... STMicroelectronics microcontrollers ultralow power strategy which also includes STM8L101xx and STM8L15xx devices. The STM8L and STM32L families allow a continuum of performance, peripherals, system architecture and features. They are all based on STMicroelectronics 0.13 µm ultralow leakage process. Note: The ultralow power STM32L and general-purpose STM32Fxxxx families are pin-to-pin compatible ...

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Functional overview 3 Functional overview Figure 1. Ultralow power STM32L15xxD block diagram 12/121 STM32L151xD, STM32L152xD Doc ID 022027 Rev 2 ...

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STM32L151xD, STM32L152xD 1. Legend: AF: alternate function ADC: analog-to-digital converter BOR: brown out reset DMA: direct memory access DAC: digital-to-analog converter I²C: inter-integrated circuit multimaster interface 3.1 Low power modes The ultralow power STM32L15xxD supports dynamic voltage scaling to optimize ...

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Functional overview ● Stop mode without RTC The Stop mode achieves the lowest power consumption while retaining the RAM and register contents. All clocks are stopped, the PLL, MSI RC, HSI and LSI RC, LSE and HSE crystal oscillators are ...

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STM32L151xD, STM32L152xD Nested vectored interrupt controller (NVIC) The ultralow power STM32L15xxD embeds a nested vectored interrupt controller able to handle maskable interrupt channels (not including the 16 interrupt lines of Cortex™-M3) and 16 priority levels. ● Closely ...

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Functional overview Five BOR thresholds are available through option bytes, starting from 1 reduce the power consumption in Stop mode possible to automatically switch off the internal reference voltage ( below ...

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STM32L151xD, STM32L152xD 3.4 Clock management The clock controller distributes the clocks coming from different oscillators to the core and the peripherals. It also manages clock gating for low power modes and ensures clock robustness. It features: ● Clock prescaler: to ...

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Functional overview Figure 2. Clock tree 2. For the USB function to be available, both HSE and PLL must be enabled, with the CPU running at either 24 MHz or 32 MHz. 18/121 STM32L151xD, STM32L152xD Doc ID 022027 Rev 2 ...

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STM32L151xD, STM32L152xD 3.5 Low power real-time clock and backup registers The real-time clock (RTC independent BCD timer/counter. Dedicated registers contain the sub-second, second, minute, hour (12/24 hour), week day, date, month, year, in BCD (binary-coded decimal) format. Correction ...

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Functional overview 3.7 Memories The STM32L15xxD devices have the following features: ● 48 Kbyte of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead to any ...

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STM32L151xD, STM32L152xD 3.10 LCD (liquid crystal display) The LCD drives common terminals and 44 segment terminals to drive up to 320 pixels. ● Internal step-up converter to guarantee functionality and contrast control irrespective This ...

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Functional overview 3.12 DAC (digital-to-analog converter) The two 12-bit buffered DAC channels can be used to convert two digital signals into two analog voltage signal outputs. The chosen design structure is composed of integrated resistor strings and an amplifier in ...

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STM32L151xD, STM32L152xD 3.15 System configuration controller and routing interface The system configuration controller provides the capability to remap some alternate functions on different I/O ports. The highly flexible routing interface allows the application firmware to control the routing of different ...

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Functional overview 3.17.1 General-purpose timers (TIM2, TIM3, TIM4, TIM5, TIM9, TIM10 and TIM11) There are six synchronizable general-purpose timers embedded in the STM32L15xxD devices (see Table 3 TIM2, TIM3, TIM4, TIM5 TIM2, TIM3, TIM4 are based on 16-bit auto-reload up/down ...

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STM32L151xD, STM32L152xD 3.17.5 Window watchdog (WWDG) The window watchdog is based on a 7-bit downcounter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs clocked from ...

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Functional overview 3.18.5 SDIO An SD/SDIO/MMC host interface is available, that supports MultiMediaCard System Specification Version 4.2 in three different databus modes: 1-bit (default), 4-bit and 8-bit. The interface allows data transfer MHz in 8-bit mode, ...

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STM32L151xD, STM32L152xD Embedded Trace Macrocell™ The ARM Embedded Trace Macrocell provides a greater visibility of the instruction and ® data flow inside the CPU core by streaming compressed data at a very high rate from the STM32L15xxD through a small ...

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Pin descriptions 4 Pin descriptions Table 4. STM32L15xQD BGA132 7 x7 ballout PE3 PE1 PB8 B PE4 PE2 PB9 PC13- C PE5 PE0 WKUP2 PC14- PE6- D OSC32 V SS_3 WKUP3 _IN PC15- E OSC32 VLCD ...

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STM32L151xD, STM32L152xD Figure 3. STM32L15xZDLQFP144 pinout Doc ID 022027 Rev 2 Pin descriptions 29/121 ...

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Pin descriptions Figure 4. STM32L15xVD LQFP100 pinout PE2 PE3 PE4 PE5 PE6-WKUP3 V LCD PC13-WKUP2 PC14-OSC32_IN PC15-OSC32_OUT VSS_5 VDD_5 PH0-OSC_IN PH1-OSC_OUT NRST PC0 PC1 PC2 PC3 VSSA VREF- VREF+ VDDA PA0-WKUP1 PA1 PA2 Figure 5. STM32L15xRD LQFP64 pinout PC14-OSC32_IN PC15-OSC32_OUT ...

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STM32L151xD, STM32L152xD Table 5. STM32L15xxD pin definitions Pins Pin name PE2 PE3 PE4 PE5 PE6 WKUP3 ( ...

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Pin descriptions Table 5. STM32L15xxD pin definitions (continued) Pins Pin name REF REF DDA PA0-WKUP1 PA1 36 ...

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STM32L151xD, STM32L152xD Table 5. STM32L15xxD pin definitions (continued) Pins Pin name PF13 PF14 PF15 PG0 PG1 ...

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Pin descriptions Table 5. STM32L15xxD pin definitions (continued) Pins Pin name 86 H10 62 - PD15 87 G10 - - PG2 PG3 89 F10 - - PG4 PG5 ...

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STM32L151xD, STM32L152xD Table 5. STM32L15xxD pin definitions (continued) Pins Pin name 115 PD1 116 PD2 117 PD3 118 PD4 119 PD5 120 ...

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Pin descriptions input output supply tolerant. 3. Function availability depends on the chosen device. 4. Applicable to STM32L152xD devices only. In STM32L151xD devices, this pin should be connected ...

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Table 6. Alternate function input/output AFIO0 AFIO1 AFIO2 AFIO3 Port name TIM9/ SYSTEM TIM2 TIM3/4/5 10/11 BOOT0 BOOT0 NRST NRST WKUP1/ PA0- TAMPER2 TIM2_CH1_ ETR TIM5_CH1 WKUP1 PA1 TIM2_CH2 TIM5_CH2 PA2 TIM2_CH3 TIM5_CH3 TIM9_CH1 PA3 TIM2_CH4 TIM5_CH4 TIM9_CH2 PA4 PA5 ...

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Table 6. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name TIM9/ SYSTEM TIM2 TIM3/4/5 10/11 PA11 PA12 PA13 JTMS-SWDIO PA14 JTCK-SWCLK PA15 JTDI TIM2_CH1_ETR PB0 TIM3_CH3 PB1 TIM3_CH4 PB2 BOOT1 PB3 JTDO TIM2_CH2 PB4 JTRST TIM3_CH1 PB5 TIM3_CH2 ...

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Table 6. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name TIM9/ SYSTEM TIM2 TIM3/4/5 10/11 PB10 TIM2_CH3 PB11 TIM2_CH4 TIM10_ PB12 CH1 TIM9_ PB13 CH1 TIM9_ PB14 CH2 TIM11_ PB15 RTC 50/60 Hz CH1 PC0 PC1 PC2 PC3 ...

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Table 6. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name TIM9/ SYSTEM TIM2 TIM3/4/5 10/11 PC7 TIM3_CH2 PC8 TIM3_CH3 PC9 TIM3_CH4 PC10 PC11 PC12 WKUP2/ TAMPER1/ PC13- TIMESTAMP/ WKUP2 ALARM_OUT/ 512Hz PC14 OSC32_I OSC32_IN N PC15 OSC32_ OSC32_OUT ...

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Table 6. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name TIM9/ SYSTEM TIM2 TIM3/4/5 10/11 PD3 PD4 PD5 PD6 PD7 TIM9_CH2 PD8 PD9 PD10 PD11 PD12 TIM4_CH1 PD13 TIM4_CH2 PD14 TIM4_CH3 PD15 TIM4_CH4 TIM10_ PE0 TIM4_ETR CH1 TIM11_ ...

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Table 6. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name TIM9/ SYSTEM TIM2 TIM3/4/5 10/11 PE2 TRACECK TIM3_ETR PE3 TRACED0 TIM3_CH1 PE4 TRACED1 TIM3_CH2 PE5 TRACED2 TIM9_CH1 WKUP3/ PE6- TAMPER3 / TIM9_CH2 WKUP3 TRACED3 PE7 PE8 PE9 TIM2_CH1_ETR ...

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Table 6. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name TIM9/ SYSTEM TIM2 TIM3/4/5 10/11 PF1 PF2 PF3 PF4 PF5 TIM5_CH1 PF6 _ETR PF7 TIM5_CH2 PF8 TIM5_CH3 PF9 TIM5_CH4 PF10 PF11 PF12 PF13 PF14 PF15 Digital alternate function ...

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Table 6. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name TIM9/ SYSTEM TIM2 TIM3/4/5 10/11 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PG8 PG9 PG10 PG11 PG12 PG13 PG14 Digital alternate function number AFIO4 AFIO5 AFIO6 AFIO7 ...

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Table 6. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name TIM9/ SYSTEM TIM2 TIM3/4/5 10/11 PG15 PH0OSC _ OSC_IN IN PH1OSC OSC_OUT _OUT PH2 Digital alternate function number AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 .. AFIO10 AFIO11 AFIO12 .. ...

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Memory mapping 5 Memory mapping Figure 6. Memory map 46/121 STM32L151xD, STM32L152xD Doc ID 022027 Rev 2 ...

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STM32L151xD, STM32L152xD 6 Electrical characteristics 6.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...

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Electrical characteristics 6.1.6 Power supply scheme Figure 9. Power supply scheme N × 100 × 4.7 µ µ µF Caution: In this figure, the 4.7 µF capacitor must be ...

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STM32L151xD, STM32L152xD 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 8: Current characteristics, and damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. ...

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Electrical characteristics Table 9. Thermal characteristics Symbol T STG T J 6.3 Operating conditions 6.3.1 General operating conditions Table 10. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock ...

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STM32L151xD, STM32L152xD Table 11. Functionalities depending on the operating power supply range Operating power DAC and ADC supply range operation V = 1.65 to 1.8 V Not functional DD Conversion V = 1.8 to 2.0 V time up to 500 ...

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Electrical characteristics Table 12. Embedded reset and power control block characteristics (continued) Symbol Parameter Power on/power down reset V POR/PDR threshold V Brown-out reset threshold 0 BOR0 V Brown-out reset threshold 1 BOR1 V Brown-out reset threshold 2 BOR2 V ...

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STM32L151xD, STM32L152xD 6.3.3 Embedded internal reference voltage The parameters given in specified. Table 13. Embedded internal reference voltage Symbol Parameter (1) V Internal reference voltage REFINT out Internal reference current I REFINT consumption T Internal reference startup time VREFINT V ...

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Electrical characteristics 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory ...

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STM32L151xD, STM32L152xD Table 15. Current consumption in Run mode, code with data processing running from RAM Symbol Parameter HSE MHz, included HSE above 16 MHz (PLL ON) Supply current I in ...

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Electrical characteristics Table 16. Current consumption in Sleep mode Symbol Parameter HSE HCLK MHz, included HSE HCLK Supply above 16 MHz current in (PLL ON) Sleep mode, code executed from RAM, ...

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STM32L151xD, STM32L152xD 1. Based on characterization, not tested in production, unless otherwise specified. 2. Oscillator bypassed (HSEBYP = 1 in RCC_CR register) 3. Tested in production. Table 17. Current consumption in Low power run mode Symbol Parameter All peripherals OFF, ...

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Electrical characteristics Table 18. Current consumption in Low power sleep mode Symbol Parameter Supply current Low power (LP Sleep) sleep mode Max allowed I max current in DD (LP Sleep) Low power Sleep mode 1. Based on ...

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STM32L151xD, STM32L152xD Table 19. Typical and maximum current consumptions in Stop mode Symbol Parameter I DD Supply current in (Stop Stop mode with with RTC enabled RTC) Supply current Stop mode ( (Stop) RTC disabled) Conditions LCD ...

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Electrical characteristics Table 19. Typical and maximum current consumptions in Stop mode (continued) Symbol Parameter I DD Supply current (WU during wakeup from from Stop mode Stop) 1. Based on characterization, not tested in production, unless otherwise specified 2. LCD ...

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STM32L151xD, STM32L152xD Wakeup time from low-power mode The wakeup times given in the following table are measured with the MSI RC oscillator. The clock source used to wake up the device depends on the current operating mode: ● Sleep mode: ...

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Electrical characteristics On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in the following table. The MCU is placed under the following conditions: ● all I/O pins are in input mode with a static value at ...

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STM32L151xD, STM32L152xD Table 22. Peripheral current consumption Peripheral SYSCFG & RI TIM9 TIM10 APB2 TIM11 ADC SPI1 USART1 GPIOA GPIOB GPIOC GPIOD AHB GPIOE GPIOF CRC FLASH DMA1 All enabled I DD (RTC (LCD) ( (ADC) ...

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Electrical characteristics 4. Data based on a differential I conversion Including supply current of internal reference voltage. 6.3.5 External clock source characteristics High-speed external user clock generated from an external source Table 23. High-speed external user ...

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STM32L151xD, STM32L152xD Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under ambient temperature and supply voltage conditions summarized in Table ...

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Electrical characteristics Figure 12. High-speed external clock source AC timing diagram High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with MHz crystal/ceramic resonator oscillator. All the information given ...

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STM32L151xD, STM32L152xD Table 25. HSE 1-24 MHz oscillator characteristics Symbol f Oscillator frequency OSC_IN R Feedback resistor F Recommended load capacitance versus C equivalent serial resistance of the crystal (R I HSE driving current HSE HSE oscillator power I DD(HSE) ...

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Electrical characteristics Figure 13. HSE oscillator circuit diagram 1. R value depends on the crystal characteristics. EXT Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. ...

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STM32L151xD, STM32L152xD Note: For C and recommended to use high-quality ceramic capacitors in the range selected to match the requirements of the crystal or resonator (see C and C ...

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Electrical characteristics 6.3.6 Internal clock source characteristics The parameters given in temperature and V High-speed internal (HSI) RC oscillator Table 27. HSI oscillator characteristics Symbol Parameter f Frequency HSI HSI user-trimmed (1)(2) TRIM resolution Accuracy of the (2) ACC factory-calibrated ...

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STM32L151xD, STM32L152xD Multi-speed internal (MSI) RC oscillator Table 29. MSI oscillator characteristics Symbol Frequency after factory calibration, done at f MSI V DD ACC Frequency error after factory calibration MSI MSI oscillator frequency drift (1) D TEMP(MSI) 0 °C ≤ ...

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Electrical characteristics Table 29. MSI oscillator characteristics (continued) Symbol t MSI oscillator startup time SU(MSI) (2) t MSI oscillator stabilization time STAB(MSI) f MSI oscillator frequency overshoot OVER(MSI) 1. This is a deviation for an individual part, once the initial ...

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STM32L151xD, STM32L152xD 6.3.7 PLL characteristics The parameters given in temperature and V Table 30. PLL characteristics Symbol PLL input clock f PLL_IN PLL input clock duty cycle f PLL output clock PLL_OUT Worst case PLL lock time t PLL input ...

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Electrical characteristics Flash memory Table 32. Flash memory characteristics Symbol Parameter Operating voltage V DD Read / Write / Erase Programming time for t prog word or half-page Average current during the whole programming / erase operation I DD Maximum ...

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STM32L151xD, STM32L152xD 6.3.9 FSMC characteristics Asynchronous waveforms and timings Figure 15 through Table 37 provide the corresponding timings. The results shown in these tables are obtained with the following FSMC configuration: ● AddressSetupTime = 0 ● AddressHoldTime = 1 ● ...

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Electrical characteristics Table 34. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings Symbol t FSMC_NE low time w(NE) t FSMC_NEx low to FSMC_NOE low v(NOE_NE) t FSMC_NOE low time w(NOE) t FSMC_NOE high to FSMC_NE high hold time h(NE_NOE) t FSMC_NEx low to ...

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STM32L151xD, STM32L152xD Table 35. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings Symbol t FSMC_NE low time w(NE) t FSMC_NEx low to FSMC_NWE low v(NWE_NE) t FSMC_NWE low time w(NWE) t FSMC_NWE high to FSMC_NE high hold time h(NE_NWE) t FSMC_NEx low to ...

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Electrical characteristics Table 36. Asynchronous multiplexed PSRAM/NOR read timings Symbol t FSMC_NE low time w(NE) t FSMC_NEx low to FSMC_NOE low v(NOE_NE) t FSMC_NOE low time w(NOE) t FSMC_NOE high to FSMC_NE high hold time h(NE_NOE) t FSMC_NEx low to ...

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STM32L151xD, STM32L152xD Table 37. Asynchronous multiplexed PSRAM/NOR write timings Symbol t FSMC_NE low time w(NE) t FSMC_NEx low to FSMC_NWE low v(NWE_NE) t FSMC_NWE low time w(NWE) t FSMC_NWE high to FSMC_NE high hold time h(NE_NWE) t FSMC_NEx low to ...

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Electrical characteristics Synchronous waveforms and timings Figure 19 through Table 41 provide the corresponding timings. The results shown in these tables are obtained with the following FSMC configuration: ● BurstAccessMode = FSMC_BurstAccessMode_Enable; ● MemoryType = FSMC_MemoryType_CRAM; ● WriteBurst = FSMC_WriteBurst_Enable; ...

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STM32L151xD, STM32L152xD Table 38. Synchronous multiplexed NOR/PSRAM read timings Symbol t FSMC_CLK period w(CLK) t FSMC_CLK low to FSMC_NEx low (x = 0...2) d(CLKL-NExL) t FSMC_CLK low to FSMC_NEx high (x = 0...2) d(CLKL-NExH) t FSMC_CLK low to FSMC_NADV low ...

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Electrical characteristics Figure 20. Synchronous multiplexed PSRAM write timings 82/121 STM32L151xD, STM32L152xD Doc ID 022027 Rev 2 ...

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STM32L151xD, STM32L152xD Table 39. Synchronous multiplexed PSRAM write timings Symbol t w(CLK) t d(CLKL-NExL) t d(CLKL-NExH) t d(CLKL-NADVL) t d(CLKL-NADVH) t d(CLKL-AV) t d(CLKL-AIV) t d(CLKL-NWEL) t d(CLKL-NWEH) t d(CLKL-ADV) t d(CLKL-ADIV) t d(CLKL-Data) t su(NWAITV-CLKH) t h(CLKH-NWAITV) t d(CLKL-NBLH) ...

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Electrical characteristics Figure 21. Synchronous non-multiplexed NOR/PSRAM read timings Table 40. Synchronous non-multiplexed NOR/PSRAM read timings Symbol t FSMC_CLK period w(CLK) t FSMC_CLK low to FSMC_NEx low (x = 0...2) d(CLKL-NExL) t FSMC_CLK low to FSMC_NEx high (x = 0...2) ...

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STM32L151xD, STM32L152xD Figure 22. Synchronous non-multiplexed PSRAM write timings Table 41. Synchronous non-multiplexed PSRAM write timings Symbol t w(CLK) t d(CLKL-NExL) t d(CLKL-NExH) t d(CLKL-NADVL) t d(CLKL-NADVH) t d(CLKL-AV) t d(CLKL-AIV) t d(CLKL-NWEL) t d(CLKL-NWEH) t d(CLKL-Data) t su(NWAITV-CLKH) t ...

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Electrical characteristics 6.3.10 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by ...

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STM32L151xD, STM32L152xD Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the oscillator pins for 1 second. To complete these trials, ESD ...

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Electrical characteristics Static latch-up Two complementary static tests are required on six parts to assess the latch-up performance: ● A supply overvoltage is applied to each power supply pin ● A current injection is applied to each input, output and ...

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STM32L151xD, STM32L152xD 6.3.13 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 47. I/O static characteristics Symbol Parameter V Input low level voltage IL Standard I/O input high ...

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Electrical characteristics 8. The max. value may be exceeded if negative current is injected on adjacent pins. 9. Pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This MOS/NMOS contribution to the series ...

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STM32L151xD, STM32L152xD Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 49, respectively. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 10. Table 49. I/O AC characteristics OSPEEDRx ...

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Electrical characteristics Figure 23. I/O AC characteristics definition External Output on 50pF Maximum frequency is achieved if (t 6.3.14 NRST pin characteristics The NRST pin input driver uses CMOS technology. Unless otherwise specified, the parameters given in performed under ambient ...

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STM32L151xD, STM32L152xD Figure 24. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V Table 50. Otherwise the reset ...

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Electrical characteristics 6.3.16 Communications interfaces interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table The STM32L151xD and STM32L152xD product line I 2 the standard I C communication protocol with ...

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STM32L151xD, STM32L152xD 2 Figure 25 bus AC waveforms and measurement circuit 1. Measurement points are done at CMOS levels: 0.3V Table 53. SCL frequency ( External pull-up resistance For speeds around 200 ...

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Electrical characteristics SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under ambient temperature, f conditions summarized in Refer to Section 6.3.12: I/O current injection characteristics input/output alternate function characteristics (NSS, SCK, ...

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STM32L151xD, STM32L152xD Figure 26. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure ...

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Electrical characteristics Figure 28. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTPUT 1. Measurement points are done at CMOS levels: 0.3V USB ...

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STM32L151xD, STM32L152xD Table 56. USB DC electrical characteristics Symbol Input levels V USB operating voltage DD (2) V Differential input sensitivity DI (2) V Differential common mode range Includes V CM (2) V Single ended receiver threshold SE Output levels ...

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Electrical characteristics 6.3.17 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 58. ADC clock frequency Symbol Parameter ADC clock f ADC frequency Table 59. ADC characteristics Symbol V Power supply DDA V Positive reference voltage REF+ V ...

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STM32L151xD, STM32L152xD Table 59. ADC characteristics (continued) Symbol t Sampling time S Total conversion time t CONV (including sampling time) Internal sample and hold C ADC capacitor External trigger frequency f TRIG Regular sequencer External trigger frequency f TRIG Injected ...

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Electrical characteristics (1)(2) Table 60. ADC accuracy Symbol Parameter ET Total unadjusted error EO Offset error EG Gain error ED Differential linearity error EL Integral linearity error ENOB Effective number of bits Signal-to-noise and SINAD distorsion ratio SNR Signal-to-noise ratio ...

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STM32L151xD, STM32L152xD Figure 30. ADC accuracy characteristics [1LSB IDEAL 4095 4094 4093 SSA Figure 31. Typical connection diagram using the ADC 1. Refer to Table 59 2. ...

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Electrical characteristics Figure 32. Maximum dynamic current consumption on V conversion Sampling (n cycles) ADC clock I ref+ 700µA 300µA Table 61. R max for f AIN ADC Ts Ts (cycles) (µs) 2.4 V < V DDA 4 0.25 Not ...

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STM32L151xD, STM32L152xD Figure 33. Power supply and reference decoupling ( and V REF+ REF– Figure 34. Power supply and reference decoupling ( and V REF+ REF– inputs are available only on 100-pin packages. inputs are available ...

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Electrical characteristics 6.3.18 DAC electrical specifications Data guaranteed by design, not tested in production, unless otherwise specified. Table 62. DAC characteristics Symbol Parameter V Analog supply voltage DDA V Reference supply voltage REF+ V Lower reference voltage REF- Current consumption ...

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STM32L151xD, STM32L152xD Table 62. DAC characteristics (continued) Symbol Parameter Offset error temperature (1) dOffset/dT coefficient (code 0x800) (1) (7) Gain Gain error Gain error temperature (1) dGain/dT coefficient (1) TUE Total unadjusted error Settling time (full scale: for a 12-bit ...

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Electrical characteristics 5. Difference between the value measured at Code (0x800) and the ideal value = V 6. Difference between the value measured at Code (0x001) and the ideal value. Difference between ideal slope of the transfer function and measured ...

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STM32L151xD, STM32L152xD Table 63. Operational amplifier characteristics (continued) Symbol Parameter GBW Bandwidth SR Slew rate AO Open loop gain R Resistive load LOAD C Capacitive load LOAD High saturation VOH SAT voltage Low saturation VOL SAT voltage ϕm Phase margin ...

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Electrical characteristics 6.3.20 Temperature sensor characteristics Table 64. TS characteristics Symbol ( SENSE (1) Avg_Slope Average slope V Voltage at 110°C ±5°C 110 (3) I Current consumption DDA (TEMP) (3) t Startup time START ADC sampling time ...

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STM32L151xD, STM32L152xD Table 66. Comparator 2 characteristics Symbol V Analog supply voltage DDA V Comparator 2 input voltage range IN t Comparator startup time START t Propagation delay d slow t Propagation delay d fast V Comparator offset error offset ...

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Electrical characteristics 6.3.22 LCD controller (STM32L152xD only) The STM32L152xD embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V connected to the V Table 67. LCD controller characteristics Symbol V LCD external voltage LCD ...

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STM32L151xD, STM32L152xD 7 Package characteristics 7.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status ...

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Package characteristics Figure 36. LQFP144 mm, 144-pin low-profile quad flat package outline Seating plane ccc 108 109 144 Pin 1 1 identification 1. Drawing is not to scale. ...

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STM32L151xD, STM32L152xD Figure 38. LQFP100 mm, 100-pin low-profile quad flat package outline 100 26 Pin identification e 1. Drawing is not to scale. Dimensions are in millimeters. ...

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Package characteristics Figure 40. LQFP64 mm, 64-pin low-profile quad flat package outline Drawing is not to scale. Dimensions are in millimeters. Table 70. LQFP64 mm, 64-pin low-profile quad flat ...

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STM32L151xD, STM32L152xD Figure 42. UFBGA132 mm, 132-ball ultra thin, fine-pitch ball grid array package outline Side view 1. Primary datum C and seating plane are defined by the spherical crowns of the solder balls. 2. Dimension is ...

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Package characteristics 7.2 Thermal characteristics The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in ° C, ● Θ is the package junction-to-ambient thermal resistance, in ° C/W, ● JA ● ...

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STM32L151xD, STM32L152xD 8 Ordering information scheme Table 73. STM32L15xxD ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type L = Low power Device subfamily 151: Devices without LCD 152: Devices with LCD Pin count R = ...

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Revision history 9 Revision history Table 74. Document revision history Date 03-Oct-2011 03-Feb-2012 120/121 Revision 1 Initial release. Status of the document changed (datasheet instead of preliminary data). Updated low power features on page 1. Removed references to devices with ...

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... STM32L151xD, STM32L152xD Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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