STM32L151VB STMicroelectronics, STM32L151VB Datasheet

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STM32L151VB

Manufacturer Part Number
STM32L151VB
Description
Ultra-low-power ARM Cortex-M3 MCU with 128 Kbytes Flash, 32 MHz CPU, LCD, USB
Manufacturer
STMicroelectronics
Datasheet

Specifications of STM32L151VB

Operating Power Supply Range
1.65 V to 3.6 V (without BOR) or 1.8 V to 3.6 V (with BOR option)
Temperature Range
–40 to 85 °C
4 Modes
Sleep, Low-power run (9 μA at 32 kHz), Low-power sleep (4.4 μA),Stop with RTC (1.45 μA), Stop (570 nA), Standby (300 nA)
Ultralow Leakage Per I/o
50 nA
Fast Wakeup From Stop
8 μs
Core
ARM 32-bit Cortex™-M3 CPU
Dma
7-channel DMA controller, supporting timers, ADC, SPIs, I2Cs and USARTs

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Features
January 2012
RTC, LCD, USB, USART, I2C, SPI, timers, ADC, DAC, comparators
Operating conditions
– Operating power supply range: 1.65 V to
– Temperature range: –40 to 85 °C
Low power features
– 4 modes: Sleep, Low-power run (9 µA at
– Dynamic core voltage scaling down to
– Ultralow leakage per I/O: 50 nA
– Fast wakeup from Stop: 8 µs
– Three wakeup pins
Core: ARM 32-bit Cortex
– 32 MHz maximum frequency,
– Memory protection unit
Reset and supply management
– Low power, ultrasafe BOR (brownout reset)
– Ultralow power POR/PDR
– Programmable voltage detector (PVD)
Clock management
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 16 MHz factory-trimmed RC
– Internal 37 kHz low consumption RC
– Internal multispeed low power RC, 65 kHz
– PLL for CPU clock and USB (48 MHz)
Low power calendar RTC
– Alarm, periodic wakeup from Stop/Standby
Memories
– Up to 128 Kbyte of Flash memory with ECC
– 4 Kbyte of data EEPROM with ECC
Ultralow power ARM-based 32-bit MCU with up to 128 KB Flash,
3.6 V (without BOR) or 1.8 V to 3.6 V (with
BOR option)
32 kHz), Low-power sleep (4.4 µA),
Stop with RTC (1.45 µA), Stop (570 nA),
Standby (300 nA)
233 µA/MHz
33.3 DMIPS peak (Dhrystone 2.1)
with 5 selectable thresholds
to 4.2 MHz with consumption down to
1.5 µA
-M3 CPU
Doc ID 17659 Rev 6
Table 1.
STM32L151xx
STM32L152xx
Reference
LQFP100 14 × 14 mm
LQFP64 10 × 10 mm
LQFP48 7 × 7 mm
– Up to 16 Kbyte of RAM
Up to 83 fast I/Os (73 of which are 5 V-tolerant)
all mappable on 16 external interrupt vectors
Development support
– Serial wire debug, JTAG and trace
DMA: 7-channel DMA controller, supporting
timers, ADC, SPIs, I
LCD 8 × 40 or 4 × 44 with step-up converter
12-bit ADC up to 1 Msps/24 channels
– Temperature sensor and internal voltage
– Operates down to 1.8 V
2 × 12-bit DACs with output buffers
2 ultralow power comparators
– Window mode and wakeup capability
10 timers:
– 6 × 16-bit general-purpose timers, each
– 2 × 16-bit basic timers
– 2 × watchdog timers (independent and
Up to 8 communication interfaces
– Up to 2 × I
– Up to 3 × USARTs (ISO 7816 interface,
– Up to 2 × SPIs (16 Mbit/s)
– USB 2.0 full speed interface
CRC calculation unit, 96-bit unique ID
reference
with up to 4 IC/OC/PWM channels
window)
LIN, IrDA capability, modem control)
Device summary
STM32L151CB, STM32L151C8, STM32L151C6,
STM32L151RB, STM32L151R8, STM32L151R6,
STM32L151VB, STM32L151V8
STM32L152CB, STM32L152C8, STM32L152C6,
STM32L152RB, STM32L152R8, STM32L152R6,
STM32L152VB, STM32L152V8
2
C interfaces (SMBus/PMBus)
BGA100 7 × 7 mm
BGA64 5 × 5 mm
STM32L151xx
STM32L152xx
2
Cs and USARTs
Part number
UFQFPN48
7 × 7 mm
www.st.com
1/109
1

Related parts for STM32L151VB

STM32L151VB Summary of contents

Page 1

... Cs and USARTs reference with IC/OC/PWM channels window interfaces (SMBus/PMBus) LIN, IrDA capability, modem control) Device summary Part number STM32L151CB, STM32L151C8, STM32L151C6, STM32L151RB, STM32L151R8, STM32L151R6, STM32L151VB, STM32L151V8 STM32L152CB, STM32L152C8, STM32L152C6, STM32L152RB, STM32L152R8, STM32L152R6, STM32L152VB, STM32L152V8 UFQFPN48 7 × 1/109 www.st.com 1 ...

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Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32L151xx, STM32L152xx 3.14.5 3.15 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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Contents 6.3.14 6.3.15 6.3.16 6.3.17 6.3.18 6.3.19 6.3.20 7 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32L151xx, STM32L152xx List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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List of tables Table 49. ADC clock frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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STM32L151xx, STM32L152xx List of figures Figure 1. Ultralow power STM32L15xxx block diagram ...

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Introduction 1 Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32L151xx and STM32L152xx ultralow power ARM Cortex™-based microcontrollers product line. The ultralow power STM32L15xxx family includes devices in 3 different package types: from 48 pins ...

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STM32L151xx, STM32L152xx 2 Description The ultralow power STM32L15xxx incorporates the connectivity power of the universal serial bus (USB) with the high-performance ARM Cortex a 32 MHz frequency, a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 ...

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Description 2.1 Device overview Table 2. Ultralow power STM32L15xxx device features and peripheral counts Peripheral Flash - Kbytes RAM - Kbytes General- purpose Timers Basic SPI Communication interfaces USART USB GPIOs 12-bit synchronized ADC Number of channels ...

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... STMicroelectronics microcontrollers ultralow power strategy which also includes STM8L101xx and STM8L15xx devices. The STM8L and STM32L families allow a continuum of performance, peripherals, system architecture and features. They are all based on STMicroelectronics 0.13 µm ultralow leakage process. Note: The ultralow power STM32L and general-purpose STM32Fxxxx families are pin-to-pin compatible ...

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Functional overview 3 Functional overview Figure 1 shows the block diagrams. Figure 1. Ultralow power STM32L15xxx block diagram alternate function on I/O port pin. 12/109 Doc ID 17659 Rev 6 STM32L151xx, STM32L152xx ...

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STM32L151xx, STM32L152xx 3.1 Low power modes The ultralow power STM32L15xxx supports dynamic voltage scaling to optimize its power consumption in run mode. The voltage from the internal low-drop regulator that supplies the logic can be adjusted according to the system’s ...

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Functional overview ● Standby mode (with or without RTC) The Standby mode is used to achieve the lowest power consumption. The internal voltage regulator is switched off so that the entire V PLL, MSI RC, HSI RC and HSE crystal ...

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STM32L151xx, STM32L152xx 3.3 Reset and supply management 3.3.1 Power supply schemes ● 1.65 to 3.6 V: external power supply for I/Os and the internal regulator. DD Provided externally through V ● SSA DDA and PLL ...

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Functional overview 3.3.4 Boot modes At startup, boot pins are used to select one of three boot options: ● Boot from Flash memory ● Boot from System Memory ● Boot from embedded RAM The boot loader is located in System ...

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STM32L151xx, STM32L152xx ● Clock security system (CSS): this feature can be enabled by software HSE clock failure occurs, the master clock is automatically switched to HSI and a software interrupt is generated if enabled. ● Clock-out capability (MCO: ...

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Functional overview 3.5 Low power real-time clock and backup registers The real-time clock (RTC independent BCD timer/counter. Dedicated registers contain the second, minute, hour (12/24 hour), week day, date, month, year, in BCD (binary-coded decimal) format. Correction for ...

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STM32L151xx, STM32L152xx 3.7 Memories The STM32L15xxx devices have the following features: ● Kbyte of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead ...

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Functional overview 3.10 ADC (analog-to-digital converter) A 12-bit analog-to-digital converters is embedded into STM32L15xxx devices with external channels, performing conversions in single-shot or scan mode. In scan mode, automatic conversion is performed on a selected group of ...

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STM32L151xx, STM32L152xx 3.12 Ultralow power comparators and reference voltage The STM32L15xxx embeds two comparators sharing the same current bias and reference voltage. The reference voltage can be internal or external (coming from an I/O). ● one comparator with fixed threshold ...

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Functional overview 3.14.1 General-purpose timers (TIM2, TIM3, TIM4, TIM9, TIM10 and TIM11) There are six synchronizable general-purpose timers embedded in the STM32L15xxx devices (see Table 3 TIM2, TIM3, TIM4 These timers are based on a 16-bit auto-reload up/downcounter and a ...

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STM32L151xx, STM32L152xx 3.14.5 Window watchdog (WWDG) The window watchdog is based on a 7-bit downcounter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs clocked from ...

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Functional overview 3.16 CRC (cyclic redundancy check) calculation unit The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial. Among other applications, CRC-based techniques are used ...

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STM32L151xx, STM32L152xx 4 Pin descriptions Figure 3. STM32L15xxx UFBGA100 ballout 1 PE3 A B PE4 C PC13 RTC_AF1 WKUP2 D PC14 OSC32_IN E PC15 OSC32_OUT F PH0 OSC_IN G PH1 OSC_OUT H PC0 J VSSA K VREF- L VREF+ M ...

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Pin descriptions Figure 4. STM32L15xxx TFBGA64 ballout 1 PC14- A OSC32_IN PC15- B OSC32_OUT PH0- C OSC_IN PH1- D OSC_OUT E NRST V SSA F V REF DDA 26/109 PC13- PB9 PB4 - RTC_AF1 ...

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STM32L151xx, STM32L152xx Figure 5. STM32L15xxx LQFP100 pinout PE6-WKUP3 PC13-RTC_AF1-WKUP2 PC14-OSC32_IN PC15-OSC32_OUT PH0-OSC_IN PH1-OSC_OUT PA0-WKUP1 PE2 1 PE3 2 PE4 3 PE5 LCD VSS_5 10 VDD_5 NRST 14 PC0 15 PC1 ...

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Pin descriptions Figure 6. STM32L15xxx LQFP64 pinout PC13-RTC_AF1-WKUP2 PC15-OSC32_OUT Figure 7. STM32L15xxx LQFP48 pinout PC13 - 28/109 LCD 2 PC14-OSC32_IN 3 4 ...

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STM32L151xx, STM32L152xx Figure 8. STM32L15xxx UFQFPN48 pinout Doc ID 17659 Rev 6 Pin descriptions 29/109 ...

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Pin descriptions Table 4. STM32L15xxx pin definitions Pins Pin name PE2 PE3 PE4 PE5 PE6 ( ...

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STM32L151xx, STM32L152xx Table 4. STM32L15xxx pin definitions (continued) Pins Pin name PA1 PA2 PA3 SS_4 ...

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Pin descriptions Table 4. STM32L15xxx pin definitions (continued) Pins Pin name L10 21 PB10 L11 22 PB11 F12 23 V SS_1 G12 24 V DD_1 ...

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STM32L151xx, STM32L152xx Table 4. STM32L15xxx pin definitions (continued) Pins Pin name C11 - PH2 F11 35 V SS_2 G11 36 V DD_2 A10 37 PA14 ...

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Pin descriptions Table 4. STM32L15xxx pin definitions (continued) Pins Pin name PE1 SS_3 DD_3 input output, S ...

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Table 5. Alternate function input/output AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 BOOT0 BOOT0 NRST NRST TIM2_CH1_ PA0-WKUP1 WKUP1 ETR PA1 TIM2_CH2 PA2 TIM2_CH3 TIM9_CH1 PA3 TIM2_CH4 TIM9_CH2 PA4 TIM2_CH1_ PA5 ETR PA6 TIM3_CH1 TIM10_CH1 PA7 TIM3_CH2 ...

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Table 5. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 TIM2_CH1_ PA15 JTDI ETR PB0 TIM3_CH3 PB1 TIM3_CH4 PB2 BOOT1 PB3 JTDO TIM2_CH2 PB4 JTRST TIM3_CH1 PB5 TIM3_CH2 PB6 TIM4_CH1 PB7 TIM4_CH2 TIM10_CH1 PB8 ...

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Table 5. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 PC1 PC2 PC3 PC4 PC5 PC6 TIM3_CH1 PC7 TIM3_CH2 PC8 TIM3_CH3 PC9 TIM3_CH4 PC10 PC11 PC12 PC13- RTC_AF1 / RTC_AF1 WKUP2 PC14- OSC32_IN OSC32_IN ...

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Table 5. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 PD2 TIM3_ETR PD3 PD4 PD5 PD6 PD7 TIM9_CH2 PD8 PD9 PD10 PD11 PD12 TIM4_CH1 PD13 TIM4_CH2 PD14 TIM4_CH3 PD15 TIM4_CH4 PE0 TIM4_ETR TIM10_CH1 PE1 ...

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Table 5. Alternate function input/output (continued) AFIO0 AFIO1 AFIO2 AFIO3 Port name SYSTEM TIM2 TIM3/4 TIM9/10/11 PE4 TRACED1 TIM3_CH2 PE5 TRACED2 TIM9_CH1* TRACED3 / PE6 TIM9_CH2* WKUP3 PE7 PE8 TIM2_CH1_ PE9 ETR PE10 TIM2_CH2 PE11 TIM2_CH3 PE12 TIM2_CH4 PE13 PE14 ...

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Memory mapping 5 Memory mapping The memory map is shown in the following figure.Figure 9.Memory map 0xFFFF FFFF 7 0xE010 0000 Cortex- M3 Internal Peripherals 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 0000 2 ...

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STM32L151xx, STM32L152xx 6 Electrical characteristics 6.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...

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Electrical characteristics 6.1.6 Power supply scheme Figure 12. Power supply scheme 11 × 100 × 4.7 µ µ µF Caution: In this figure, the 4.7 µF capacitor must be ...

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STM32L151xx, STM32L152xx 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 7: Current characteristics, and damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. ...

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Electrical characteristics Table 8. Thermal characteristics Symbol T STG T J 6.3 Operating conditions 6.3.1 General operating conditions Table 9. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock ...

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STM32L151xx, STM32L152xx Table 10. Functionalities depending on the operating power supply range Operating power DAC and ADC supply range operation V = 1.65 to 1.8 V Not functional DD Conversion V = 1.8 to 2.0 V time up to 500 ...

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Electrical characteristics 6.3.2 Embedded reset and power control block characteristics The parameters given in the following table are derived from the tests performed under the ambient temperature condition summarized in Table 11. Embedded reset and power control block characteristics Symbol ...

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STM32L151xx, STM32L152xx Table 11. Embedded reset and power control block characteristics (continued) Symbol Parameter V PVD threshold 6 PVD6 V Hysteresis voltage hyst 1. Guaranteed by characterisation, not tested in production. Conditions Falling edge Rising edge BOR0 threshold All BOR ...

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Electrical characteristics 6.3.3 Embedded internal reference voltage The parameters given in specified. Table 12. Embedded internal reference voltage Symbol Parameter (1) V Internal reference voltage REFINT out Internal reference current I REFINT consumption T Internal reference startup time VREFINT V ...

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STM32L151xx, STM32L152xx 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory ...

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Electrical characteristics Table 14. Current consumption in Run mode, code with data processing running from RAM Symbol Parameter HSE MHz, included HSE above 8 MHz (PLL ON) Supply current in Run ...

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STM32L151xx, STM32L152xx Table 15. Current consumption in Sleep mode Symbol Parameter HSE = 16 MHz (PLL ON for f >16 MHz) Supply current in Sleep mode, code executed from RAM, Flash switched HSI clock source OFF (16 MHz) MSI clock, ...

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Electrical characteristics 1. Based on characterization, not tested in production, unless otherwise specified. 2. Oscillator bypassed (HSEBYP = 1 in RCC_CR register) 3. Tested in production Table 16. Current consumption in Low power run mode Symbol Parameter All peripherals OFF, ...

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STM32L151xx, STM32L152xx Table 17. Current consumption in Low power sleep mode Symbol Parameter Supply current in I (LP DD Low power Sleep) sleep mode Max allowed I Max current in DD (LP Sleep) Low power Sleep mode 1. Based on ...

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Electrical characteristics Table 18. Typical and maximum current consumptions in Stop mode Symbol Parameter Supply current (Stop Stop mode with with RTC) RTC enabled Supply current in I Stop mode ( DD (Stop) RTC disabled) 54/109 Conditions ...

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STM32L151xx, STM32L152xx Table 18. Typical and maximum current consumptions in Stop mode Symbol Parameter RMS (root mean square) supply I current during DD (WU wakeup time from Stop) when exiting from Stop mode 1. Based on characterization, not tested in ...

Page 56

Electrical characteristics Wakeup time from Low power mode The wakeup times given in the following table are measured with the MSI RC oscillator. The clock source used to wake up the device depends on the current operating mode: ● Sleep ...

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STM32L151xx, STM32L152xx On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in the following table. The MCU is placed under the following conditions: ● all I/O pins are in input mode with a static value at ...

Page 58

Electrical characteristics Table 21. Peripheral current consumption Peripheral SYSCFG & RI TIM9 TIM10 APB2 TIM11 ADC SPI1 USART1 GPIOA GPIOB GPIOC GPIOD AHB GPIOE GPIOH CRC FLASH DMA1 All enabled I DD (RTC (LCD) ( (ADC) ...

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STM32L151xx, STM32L152xx 4. Data based on a differential I conversion Including supply current of internal reference voltage. 6.3.5 External clock source characteristics High-speed external user clock generated from an external source Table 22. High-speed external user ...

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Electrical characteristics Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under ambient temperature and supply voltage conditions summarized in Table ...

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STM32L151xx, STM32L152xx Figure 15. High-speed external clock source AC timing diagram High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with MHz crystal/ceramic resonator oscillator. All the information given ...

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Electrical characteristics Table 24. HSE 1-24 MHz oscillator characteristics Symbol f Oscillator frequency OSC_IN R Feedback resistor F Recommended load capacitance versus C equivalent serial resistance of the crystal (R I HSE driving current HSE HSE oscillator power I DD(HSE) ...

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STM32L151xx, STM32L152xx Figure 16. HSE oscillator circuit diagram 1. R value depends on the crystal characteristics. EXT Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. ...

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Electrical characteristics Note: For C and recommended to use high-quality ceramic capacitors in the range selected to match the requirements of the crystal or resonator (see C and C ...

Page 65

STM32L151xx, STM32L152xx 6.3.6 Internal clock source characteristics The parameters given in temperature and V High-speed internal (HSI) RC oscillator Table 26. HSI oscillator characteristics Symbol Parameter f Frequency HSI HSI user-trimmed (1)(2) TRIM resolution Accuracy of the (2) ACC factory-calibrated ...

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Electrical characteristics Multi-speed internal (MSI) RC oscillator Table 28. MSI oscillator characteristics Symbol Frequency after factory calibration, done at f MSI V DD ACC Frequency error after factory calibration MSI MSI oscillator frequency drift (1) D TEMP(MSI) 0 °C ≤ ...

Page 67

STM32L151xx, STM32L152xx Table 28. MSI oscillator characteristics (continued) Symbol (2) t MSI oscillator stabilization time STAB(MSI) f MSI oscillator frequency overshoot OVER(MSI) 1. This is a deviation for an individual part, once the initial frequency has been measured. 2. Based ...

Page 68

Electrical characteristics 6.3.8 Memory characteristics The characteristics are given at T RAM memory Table 30. RAM and hardware registers Symbol Parameter VRM Data retention mode 1. Minimum supply voltage without losing data stored in RAM (in Stop mode or under ...

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STM32L151xx, STM32L152xx Table 32. Flash memory endurance and data retention Symbol Cycling (erase / write ) Program memory (2) N CYC Cycling (erase / write ) EEPROM data memory Data retention (program memory) after 10 kcycles at T Data retention ...

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Electrical characteristics Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the ...

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STM32L151xx, STM32L152xx 6.3.10 Absolute maximum ratings (electrical sensitivity) Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in terms of electrical sensitivity. Electrostatic discharge (ESD) Electrostatic discharges (a ...

Page 72

Electrical characteristics Functional susceptibility to I/O current injection While a simple application is executed on the device, the device is stressed by injecting current into the I/O pins programmed in floating input mode. While current is injected into the I/O ...

Page 73

STM32L151xx, STM32L152xx 6.3.12 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under conditions summarized in Table 38. I/O static characteristics Symbol Parameter V Input low level voltage IL Standard I/O input high level voltage ...

Page 74

Electrical characteristics 9. Pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This MOS/NMOS contribution to the series resistance is minimum (~10% order) Output driving current The GPIOs (general purpose input/outputs) can sink ...

Page 75

STM32L151xx, STM32L152xx Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 40, respectively. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 9. Table 40. I/O AC characteristics OSPEEDRx ...

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Electrical characteristics Figure 18. I/O AC characteristics definition 6.3.13 NRST pin characteristics The NRST pin input driver uses CMOS technology. Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 9. Table 41. NRST pin characteristics ...

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STM32L151xx, STM32L152xx Figure 19. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V Table 41. Otherwise the reset ...

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Electrical characteristics 6.3.15 Communications interfaces interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table 2 The line I C interface meets the requirements of the standard I with the ...

Page 79

STM32L151xx, STM32L152xx 2 Figure 20 bus AC waveforms and measurement circuit 1. Measurement points are done at CMOS levels: 0.3V Table 44. SCL frequency ( External pull-up resistance For speeds around 200 ...

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Electrical characteristics SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under ambient temperature, f conditions summarized in Refer to Section 6.3.11: I/O current injection characteristics input/output alternate function characteristics (NSS, SCK, ...

Page 81

STM32L151xx, STM32L152xx Figure 21. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure ...

Page 82

Electrical characteristics Figure 23. SPI timing diagram - master mode High NSS input CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t su(MI) MISO INP UT MOSI OUTPUT 1. Measurement points are done at CMOS levels: 0.3V USB ...

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STM32L151xx, STM32L152xx Table 47. USB DC electrical characteristics Symbol Input levels V USB operating voltage DD (4) V Differential input sensitivity DI (4) V Differential common mode range Includes V CM (4) V Single ended receiver threshold SE Output levels ...

Page 84

Electrical characteristics 6.3.16 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 49. ADC clock frequency Symbol Parameter ADC clock f ADC frequency Table 50. ADC characteristics Symbol V Power supply DDA V Positive reference voltage REF+ V ...

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STM32L151xx, STM32L152xx Table 50. ADC characteristics (continued) Symbol t Sampling time S Total conversion time t CONV (including sampling time) Internal sample and hold C ADC capacitor External trigger frequency f TRIG Regular sequencer External trigger frequency f TRIG Injected ...

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Electrical characteristics (1)(2) Table 51. ADC accuracy Symbol Parameter ET Total unadjusted error EO Offset error EG Gain error ED Differential linearity error EL Integral linearity error ENOB Effective number of bits Signal-to-noise and SINAD distorsion ratio SNR Signal-to-noise ratio ...

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STM32L151xx, STM32L152xx Figure 25. ADC accuracy characteristics [1LSB IDEAL 4095 4094 4093 SSA Figure 26. Typical connection diagram using the ADC 1. Refer to Table 50 2. ...

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Electrical characteristics Figure 27. Maximum dynamic current consumption on V conversion Sampling (n cycles) ADC clock I ref+ 700µA 300µA Table 52. R max for f AIN ADC Ts Ts (cycles) (µs) 2.4 V < V DDA 4 0.25 Not ...

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STM32L151xx, STM32L152xx Figure 28. Power supply and reference decoupling ( and V REF+ REF– Figure 29. Power supply and reference decoupling ( and V REF+ REF– inputs are available only on 100-pin packages. inputs are available ...

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Electrical characteristics 6.3.17 DAC electrical specifications Data guaranteed by design, not tested in production, unless otherwise specified. Table 53. DAC characteristics Symbol Parameter V Analog supply voltage DDA V Reference supply voltage REF+ V Lower reference voltage REF- Current consumption ...

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STM32L151xx, STM32L152xx Table 53. DAC characteristics (continued) Symbol Parameter Offset error temperature (1) dOffset/dT coefficient (code 0x800) (1) (7) Gain Gain error Gain error temperature (1) dGain/dT coefficient (1) TUE Total unadjusted error Settling time (full scale: for a 12-bit ...

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Electrical characteristics 4. Difference between measured value at Code i and the value at Code line drawn between Code 0 and last Code 4095. 5. Difference between the value measured at Code (0x800) and the ideal value ...

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STM32L151xx, STM32L152xx 6.3.19 Comparator Table 55. Comparator 1 characteristics Symbol V Analog supply voltage DDA R R 400K 400K R R 10K 10K Comparator 1 input V IN voltage range t Comparator startup time START td Propagation delay Voffset Comparator ...

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Electrical characteristics Table 56. Comparator 2 characteristics Symbol V Analog supply voltage DDA V Comparator 2 input voltage range IN t Comparator startup time START t Propagation delay d slow t Propagation delay d fast V Comparator offset error offset ...

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STM32L151xx, STM32L152xx 6.3.20 LCD controller (STM32L152xx only) The STM32L152xx embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V to the V pin to decouple this converter. LCD Table 57. LCD controller characteristics Symbol ...

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Package characteristics 7 Package characteristics 7.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specification s, grade definitions and product ...

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STM32L151xx, STM32L152xx Figure 31. UFQFPN48 mm, 0.5 mm pitch, package (1)(2)(3) outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There ...

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Package characteristics Figure 33. TFBGA64 - active ball array mm, 0.5 mm pitch, package outline Seating plane 1. Drawing is not to scale. Table 59. TFBGA64 - active ball array, 5 ...

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STM32L151xx, STM32L152xx Figure 34. Recommended PCB design rules for pads (0.5 mm pitch BGA) Dpad Dsm 1. Non solder mask defined (NSMD) pads are recommended mils solder paste screen printing process Pitch 0 pad ...

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Package characteristics Figure 35. UFBGA100 - ultra fine pitch ball grid array mm, 0.50 mm pitch, package outline A1 ball pad corner 1.75 1. Drawing is not to scale. Table 60. UFBGA100 - ultra fine pitch ball ...

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STM32L151xx, STM32L152xx Figure 36. LQFP100 mm, 100-pin low-profile quad flat package outline 100 26 Pin identification e 1. Drawing is not to scale. 2. Dimensions are in ...

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Package characteristics Figure 38. LQFP64 mm, 64-pin low-profile quad flat package outline Drawing is not to scale. 2. Dimensions are in millimeters. Table 62. LQFP64 mm, 64-pin low-profile quad ...

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STM32L151xx, STM32L152xx Figure 40. LQFP48 mm, 48-pin low-profile quad flat package outline Seating plane ccc Pin 1 1 identification 1. Drawing is not to scale. ...

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Package characteristics 7.2 Thermal characteristics The maximum chip-junction temperature, T using the following equation: Where: max is the maximum ambient temperature in ° C, ● Θ is the package junction-to-ambient thermal resistance, in ° C/W, ● JA ● ...

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STM32L151xx, STM32L152xx 8 Ordering information scheme Table 65. Ordering information scheme Example: Device family STM32 = ARM-based 32-bit microcontroller Product type L = Low power Device subfamily 151: Devices without LCD 152: Devices with LCD Pin count ...

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Revision history 9 Revision history on Table 66. Document revision history Date Revision 02-Jul-2010 01-Oct-2010 16-Dec-2010 25-Feb-2011 106/109 1 Initial release. Removed 5 V tolerance (FT) from PA3, PB0 and PC3 in STM32L15xxx pin definitions on page 30 Updated Table ...

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STM32L151xx, STM32L152xx Table 66. Document revision history (continued) Date Revision 25-Feb-2011 Updated Table 19: Typical and maximum current consumptions in Standby mode on page 55 from Stop). Table 20: Typical and maximum timings in Low power modes on page 56: ...

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Revision history Table 66. Document revision history (continued) Date Revision 17-June-2011 25-Jan-2012 108/109 Modified 1st page (low power features) Added STM32L15xC6 and STM32L15xR6 devices (32 Kbytes of Flash memory). Modified Section 3.6: GPIOs (general-purpose inputs/outputs page 18 Modified ...

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... STM32L151xx, STM32L152xx Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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