LM2901DR2G ON Semiconductor, LM2901DR2G Datasheet - Page 10

• Manufacturer Part Number: LM2901DR2G
• Description: IC COMP QUAD SGL SUPPLY 14SOIC
• Manufacturer: ON Semiconductor
• Type: General Purposer

Specifications of LM2901DR2G

• Number Of Elements: 4
• Output Type: CMOS, Open-Collector, TTL
• Voltage - Supply: 3 V ~ 36 V, ±1.5 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Package: 14SOIC
• Typical Response Time: 1.3 us
• Typical Response Time Range: 0.5 to 5 us
• Typical Voltage Gain Range: 90 to 110 dB
• Number Of Channels Per Chip: 4
• Minimum Single Supply Voltage: 3 V
• Power Supply Type: Single|Dual
• Number Of Channels: 4 Channels
• Response Time: 1.3 us
• Offset Voltage (max): 7 mV
• Input Bias Current (max): 250 nA
• Supply Voltage (max): 36 V
• Supply Voltage (min): 3 V
• Supply Current (max): 2 mA
• Maximum Power Dissipation: 1000 mW
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Comparator Type: General Purpose
• No. Of Comparators: 4
• Ic Output Type: CMOS, TTL
• Supply Current: 1mA
• Supply Voltage Range: 3V To 36V
• Amplifier Case Style: SOIC
• Rohs Compliant: Yes
• Number Of Elements: 4
• Technology: Bipolar
• Input Offset Voltage: 7mV
• Input Bias Current (typ): 250nA
• Single Supply Voltage (typ): 5/9/12/15/18/24/28V
• Dual Supply Voltage (typ): ±3/±5/±9/±12/±15V
• Power Supply Requirement: Single/Dual
• Voltage Gain In Db: 100dB
• Single Supply Voltage (min): 3V
• Single Supply Voltage (max): 36V
• Dual Supply Voltage (min): ±1.5V
• Dual Supply Voltage (max): ±18V
• Power Dissipation: 1W
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Package Type: SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM2901DR2GOSTR

SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
S
0.25 (0.010)
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE H
M
7.04
7X
B
10
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_