MAX3841 Maxim, MAX3841 Datasheet

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MAX3841

Manufacturer Part Number
MAX3841
Description
The MAX3841 is a low-power, 12
Manufacturer
Maxim
Datasheet

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The MAX3841 is a low-power, 12.5Gbps 2 × 2 cross-
point switch IC for high-speed serial data loopback,
redundancy, and switching applications. The MAX3841
current-mode logic (CML) inputs and outputs have iso-
lated V
to 1.8V, 2.5V, or 3.3V CML ICs. Fully differential signal
paths and Maxim’s second-generation SiGe technology
provide optimum signal integrity, minimizing jitter,
crosstalk, and signal skew. The MAX3841 is ideal for
serial OC-192 and 10GbE optical module, line card,
switch fabric, and similar applications.
The MAX3841 has 150mV
sensitivity, and 500mV
swing. Unused outputs can be powered down individu-
ally to conserve power. In addition to functioning as a 2
× 2 switch, the MAX3841 can be configured as a 2:1
multiplexer, 1:2 buffer, or dual 1:1 buffer. The MAX3841
is available in a 4mm × 4mm 24-pin thin QFN package,
and consumes only 215mW with both outputs enabled.
19-2905; Rev 1; 3/09
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim's website at www.maxim-ic.com.
OC-192, 10GbE Switch/Line Cards
OC-192, 10GbE Optical Modules
System Redundancy/Self Test
Clock Fanout
CC
connections to enable DC-coupled interfaces
________________________________________________________________ Maxim Integrated Products
MODULE
OPTICAL
12.5Gbps CML 2 × 2 Crosspoint Switch
10Gbps
3.3V
SERIAL
General Description
P-P
P-P
nominal differential output
2.5V
minimum differential input
SDO+
SDO-
SDI+
SDI-
LOOPBACK
Applications
2.5V
OUT1+
OUT1-
IN1+
IN1-
VCC1IN
SEL1 SEL2
VCC1OUT
2.5V
MAX3841
ENO1
3.3V
V
CC
♦ Up to 12.5Gbps Operation
♦ Less Than 10ps
♦ Less Than 0.7ps
♦ 1.8V, 2.5V, and 3.3V DC-Coupled CML I/O
♦ Independent Output Power-Down
♦ 4mm × 4mm Thin QFN Package
♦ -40°C to +85°C Operation
♦ +3.3V Core Supply
♦ 215mW Power Consumption (Excluding
+ Denotes a lead(Pb)-free/RoHS-compliant package.
* EP = Exposed pad.
Pin Configuration appears at end of data sheet.
MAX3841ETG
MAX3841ETG+
Termination Currents)
ENO2
VCC2IN
PART
1.8V
VCC2OUT
GND
OUT2+
OUT2-
IN2+
IN2-
Typical Application Circuit
1.8V
P-P
-40°C to +85°C
-40°C to +85°C
RMS
TEMP RANGE
Ordering Information
SDO+
SDO-
SDI+
SDI-
Deterministic Jitter
Random Jitter
CDR/SERDES
10Gbps
ASIC
1.8V
PIN-PACKAGE
24 Thin QFN-EP*
24 Thin QFN-EP*
Features
1

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MAX3841 Summary of contents

Page 1

... P-P swing. Unused outputs can be powered down individu- ally to conserve power. In addition to functioning × 2 switch, the MAX3841 can be configured as a 2:1 multiplexer, 1:2 buffer, or dual 1:1 buffer. The MAX3841 is available in a 4mm × 4mm 24-pin thin QFN package, and consumes only 215mW with both outputs enabled. ...

Page 2

... ENO1, ENO2) .........................................-0. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability ...

Page 3

... TEMPERATURE (°C) OUTPUT EYE DIAGRAM 23 (12.5Gbps PRBS) 60mV/div 85 14ps/div OUTPUT EYE DIAGRAM 23 (622Mbps PRBS) MAX3841 toc05 60mV/div 270ps/div PROPAGATION DELAY IN1 OUT1 85 100ps/div MAX3841 toc03 MAX3841 toc06 MAX3841 toc09 3 ...

Page 4

... EP electrical performance. Detailed Description The MAX3841 contains a pair of CML inputs that drive two 2:1 multiplexers, with separate select inputs SEL1 and SEL2, providing a 2 × 2 crosspoint data path. The outputs of the multiplexers each drive a high-perfor- mance CML output that can be disabled (powered down) using the ENO1/ENO2 inputs ...

Page 5

... Application Note 291: HFAN-01.0: Introduction to LVDS, PECL, and CML . Package and Layout Considerations OUT_+ The MAX3841 is packaged in a 4mm × 4mm 24-pin thin QFN with exposed pad. The exposed pad provides OUT_- thermal and electrical connectivity to the IC and must be soldered to a high-frequency ground plane. Use multiple vias to connect the exposed pad underneath the package to the PC board ground plane ...

Page 6

... CML 2 × 2 Crosspoint Switch Pin Configuration TOP VIEW VCC1IN 2 IN1+ 3 MAX3841 IN1- 4 VCC1IN 5 *EP SEL1 THIN QFN *THE EXPOSED PAD OF THE QFN PACKAGE MUST BE SOLDERED TO GROUND FOR PROPER THERMAL AND ELECTRICAL OPERATION. 6 _______________________________________________________________________________________ ...

Page 7

... Package Information table. Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. ...

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