MM74HCT244N Fairchild Semiconductor, MM74HCT244N Datasheet

IC BUFF/DVR TRI-ST DUAL 20DIP

MM74HCT244N

Manufacturer Part Number
MM74HCT244N
Description
IC BUFF/DVR TRI-ST DUAL 20DIP
Manufacturer
Fairchild Semiconductor
Series
74HCTr
Datasheet

Specifications of MM74HCT244N

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
7.2mA, 7.2mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Logic Family
74HCT
Number Of Channels Per Chip
Octal
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
85 C
Mounting Style
Through Hole
High Level Output Current
- 7.2 mA
Input Bias Current (max)
4 uA
Low Level Output Current
7.2 mA
Maximum Power Dissipation
600 mW
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
28 ns @ 5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MM74HCT244N
Manufacturer:
NS/国半
Quantity:
20 000
© 2005 Fairchild Semiconductor Corporation
MM74HCT240WM
MM74HCT240SJ
MM74HCT240MTC
MM74HCT240N
MM74HCT244WM
MM74HCT244SJ
MM74HCT244MTC
MM74HCT244N
MM74HCT240 • MM74HCT244
Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer
General Description
The MM74HCT240 and MM74HCT244 3-STATE buffers
utilize advanced silicon-gate CMOS technology and are
general purpose high speed inverting and non-inverting
buffers. They possess high drive current outputs which
enable high speed operation even when driving large bus
capacitances. These circuits achieve speeds comparable
to low power Schottky devices, while retaining the low
power consumption of CMOS. All three devices are TTL
input compatible and have a fanout of 15 LS-TTL equiva-
lent inputs.
MM74HCT devices are intended to interface between TTL
and NMOS components and standard CMOS devices.
These parts are also plug-in replacements for LS-TTL
devices and can be used to reduce power consumption in
existing designs.
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagrams
Pin Assignments for DIP, SOIC, SOP and TSSOP
Order Number
Package Number
MM74HCT240
Top View
MTC20
MTC20
M20B
M20D
M20B
M20D
N20A
N20A
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
DS005365
The MM74HCT240 is an inverting buffer and the
MM74HCT244 is a non-inverting buffer. Each device has
two active low enables (1G and 2G), and each enable inde-
pendently controls 4 buffers.
All inputs are protected from damage due to static dis-
charge by diodes to V
Features
TTL input compatible
Typical propagation delay: 14 ns
3-STATE outputs for connection to system buses
Low quiescent current: 80
High output drive current: 6 mA (min)
Package Description
CC
MM74HCT244
Top View
and Ground.
P
A
February 1984
Revised May 2005
www.fairchildsemi.com

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MM74HCT244N Summary of contents

Page 1

... Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT244N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. ...

Page 2

Truth Tables MM74HCT240 HIGH Level L LOW Level Z Logic Diagrams MM74HCT240 www.fairchildsemi.com MM74HCT244 ...

Page 3

Absolute Maximum Ratings (Note 2) Supply Voltage ( Input Voltage ( Output Voltage (V ) OUT Clamp Diode Current ( Output Current, per pin (I ) ...

Page 4

AC Electrical Characteristics 5.0V, t MM74HCT240, MM74HCT244 Symbol Parameter Maximum Output PHL PLH Propagation Delay Maximum Output PZL PZH Enable Time Maximum Output PLZ PHZ Disable Time AC ...

Page 5

Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B 5 www.fairchildsemi.com ...

Page 6

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide www.fairchildsemi.com Package Number M20D 6 ...

Page 7

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 7 www.fairchildsemi.com ...

Page 8

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right ...

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