74LVT245PW,112 NXP Semiconductors, 74LVT245PW,112 Datasheet
74LVT245PW,112
Specifications of 74LVT245PW,112
74LVT245PW
935175550112
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74LVT245PW,112 Summary of contents
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V octal transceiver with direction pin (3-state) Rev. 03 — 8 May 2008 1. General description The 74LVT245 is a high-performance BiCMOS product designed for V 3.3 V. This device is an octal transceiver featuring non-inverting 3-state bus ...
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... NXP Semiconductors 4. Functional diagram DIR Fig 1. Logic diagram 74LVT245_3 Product data sheet 3.3 V octal transceiver with direction pin (3-state mna174 Fig 2. IEC logic symbol Rev. 03 — 8 May 2008 74LVT245 3EN1 3EN2 mna175 © NXP B.V. 2008. All rights reserved ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning DIR 74LVT245 GND Fig 3. Pin configuration for SO20 and (T)SSOP20 5.2 Pin description Table 2. Pin description Symbol Pin DIR GND 18, 17, 16, 15, 14, 13, 12 74LVT245_3 Product data sheet 3.3 V octal transceiver with direction pin (3-state) ...
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... NXP Semiconductors 6. Functional description Table 3. Function selection Inputs OE DIR [ HIGH voltage level LOW voltage level don’t care high impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 5. Recommended operating conditions Symbol Parameter I LOW-level output current OL T ambient temperature amb t/ V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter V input clamping voltage ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter I supply current CC I additional supply current CC C input capacitance I C input/output capacitance I/O [1] All typical values are measured at V [2] Unused pins GND. CC [3] This parameter is valid for any transition time of 100 ms is permitted ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter t LOW to OFF-state propagation delay see PLZ [1] Typical values are measured at T 11. Waveforms See Table 8 for measurement points V and V are typical output voltage levels that occur with the output load. ...
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... NXP Semiconductors Table 8. Measurement points V Input 2 3.6 V GND to 2.7 V Test data is given in Table Definitions test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance External voltage for measuring switching times. EXT Fig 7. Test circuit for switching times Table 9 ...
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... NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT339-1 Fig 9. ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Release date 74LVT245_3 20080508 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 3 “Ordering information” 74LVT245_2 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 Revision history ...