HEF40244BT,652 NXP Semiconductors, HEF40244BT,652 Datasheet - Page 2

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HEF40244BT,652

Manufacturer Part Number
HEF40244BT,652
Description
IC BUFF/DVR TRI-ST DUAL 20SOIC
Manufacturer
NXP Semiconductors
Series
4000Br
Datasheets

Specifications of HEF40244BT,652

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
62mA, 45mA
Voltage - Supply
4.5 V ~ 15.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Logic Family
HEF4000
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
15 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 19.5 mA
Low Level Output Current
30 mA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
10 / 8
Output Type
3-State
Propagation Delay Time
80 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3090-5
933638680652
HEF40244BTD
Philips Semiconductors
INDEX
Note
1. Corrected 26 June 1997.
January 1995
SO
SOT108-1
SOT109-1
SOT162-1
SOT163-1
SOT137-1
SOT136-1
SSOP
SOT337-1
SOT338-1
SOT339-1
SOT340-1
SOT341-1
DIP
SOT27-1
SOT38-1
SOT102-1
SOT146-1
SOT101-1
SOT117-1
SOT129-1
CDIP
SOT73-1
SOT74-1
SOT133-1
SOT152-2
SOT94-1
SOT135-1
Package information
PACKAGE VERSIONS
(1)
plastic small outline package; 14 leads; body width 3.9 mm
plastic small outline package; 16 leads; body width 3.9 mm
plastic small outline package; 16 leads; body width 7.5 mm
plastic small outline package; 20 leads; body width 7.5 mm
plastic small outline package; 24 leads; body width 7.5 mm
plastic small outline package; 28 leads; body width 7.5 mm
plastic shrink small outline package; 14 leads; body width 5.3 mm
plastic shrink small outline package; 16 leads; body width 5.3 mm
plastic shrink small outline package; 20 leads; body width 5.3 mm
plastic shrink small outline package; 24 leads; body width 5.3 mm
plastic shrink small outline package; 28 leads; body width 5.3 mm
plastic dual in-line package; 14 leads (300 mil)
plastic dual in-line package; 16 leads (300 mil); long body
plastic dual in-line package; 18 leads (300 mil)
plastic dual in-line package; 20 leads (300 mil)
plastic dual in-line package; 24 leads (600 mil)
plastic dual in-line package; 28 leads (600 mil)
plastic dual in-line package; 40 leads (600 mil)
ceramic dual in-line package; 14 leads; glass seal
ceramic dual in-line package; 16 leads; glass seal
ceramic dual in-line package; 18 leads; glass seal
ceramic dual in-line package; 20 leads; glass seal
ceramic dual in-line package; 24 leads; glass seal
ceramic dual in-line package; 28 leads; glass seal
2
DESCRIPTION
Package outlines
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