OPA363

Manufacturer Part NumberOPA363
ManufacturerTexas Instruments
OPA363 datasheet
 


Specifications of OPA363

Number Of Channels1Total Supply Voltage(min)(+5v=5, +/-5v=10)1.8
Total Supply Voltage(max)(+5v=5, +/-5v=10)5.5Iq Per Channel(max)(ma)0.75
Gbw(typ)(mhz)7Slew Rate(typ)(v/us)5
Vio (25c)(max)(mv)0.5Offset Drift(typ)(uv/c)3
Vn At 1khz(typ)(nv/rthz)17Iib(max)(pa)10
Cmrr(min)(db)74Rail-railIn/Out
Operating Temperature Range(c)-40 to 125Pin/package6SOT-23, 8SOIC
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Orderable Device
(1)
Package Type Package
Status
OPA4364AIDG4
ACTIVE
SOIC
OPA4364AIDR
ACTIVE
SOIC
OPA4364AIDRG4
ACTIVE
SOIC
OPA4364AIPWR
ACTIVE
TSSOP
OPA4364AIPWRG4
ACTIVE
TSSOP
OPA4364AIPWT
ACTIVE
TSSOP
OPA4364AIPWTG4
ACTIVE
TSSOP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Pins
Package Qty
(2)
Eco Plan
Drawing
Ball Finish
D
14
50
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
D
14
2500
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
D
14
2500
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
PW
14
2500
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
PW
14
2500
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
PW
14
250
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
PW
14
250
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
Addendum-Page 4
PACKAGE OPTION ADDENDUM
9-Dec-2010
Lead/
(3)
Samples
MSL Peak Temp
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