NL27WZ16DFT2G ON Semiconductor, NL27WZ16DFT2G Datasheet - Page 5
NL27WZ16DFT2G
Manufacturer Part Number
NL27WZ16DFT2G
Description
IC BUFFER DUAL NON-INVERT SC88
Manufacturer
ON Semiconductor
Series
27WZr
Datasheet
1.NL27WZ16DFT2G.pdf
(6 pages)
Specifications of NL27WZ16DFT2G
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
1
Current - Output High, Low
32mA, 32mA
Voltage - Supply
1.65 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
SC-70-6, SC-88, SOT-363
Logic Family
LCX
Logical Function
Buffer
Number Of Elements
2
Number Of Channels
2
Number Of Inputs
2
Number Of Outputs
2
Operating Supply Voltage (typ)
1.8/2.5/3.3/5V
Package Type
SOT-363
Output Type
Standard
Polarity
Non-Inverting
Propagation Delay Time
10.2ns
High Level Output Current
-32mA
Low Level Output Current
32mA
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
1.65V
Quiescent Current
1uA
Technology
CMOS
Pin Count
6
Mounting
Surface Mount
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Number Of Channels Per Chip
Dual
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.65 V
Maximum Operating Temperature
85 C
Mounting Style
SMD/SMT
Input Bias Current (max)
1 uA
Maximum Power Dissipation
200 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
2 / 2
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
1.65V To 5.5V
Logic Case Style
SOT-363
No. Of Pins
6
Operating Temperature Range
-40°C To +85°C
Filter Terminals
SMD
Rohs Compliant
Yes
Breakdown Voltage
33V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NL27WZ16DFT2GOS
NL27WZ16DFT2GOS
NL27WZ16DFT2GOSTR
NL27WZ16DFT2GOS
NL27WZ16DFT2GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NL27WZ16DFT2G
Manufacturer:
ON
Quantity:
1 520
Company:
Part Number:
NL27WZ16DFT2G
Manufacturer:
ON Semiconductor
Quantity:
9 400
Part Number:
NL27WZ16DFT2G
Manufacturer:
ON/安森美
Quantity:
20 000
H
E
A1
6
1
D
5
2
e
4
3
A
−E−
b
*For additional information on our Pb−Free strategy and soldering
0.0157
6 PL
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
0.2 (0.008)
M
0.0197
0.50
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
A3
E
SC−88/SC70−6/SOT−363
M
http://onsemi.com
CASE 419B−02
L
ISSUE W
0.0748
1.9
5
C
SCALE 20:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
Y14.5M, 1982.
DIM
H
A1
A3
A
b
C
D
E
L
e
E
inches
mm
0.025
0.025
0.80
0.00
0.10
0.10
1.80
1.15
0.10
2.00
MIN
0.65
0.65
MILLIMETERS
0.65 BSC
0.20 REF
NOM
0.95
0.05
0.21
0.14
2.00
1.25
0.20
2.10
MAX
1.10
0.10
0.30
0.25
2.20
1.35
0.30
2.20
0.031
0.000
0.004
0.004
0.070
0.045
0.004
0.078
MIN
0.026 BSC
0.008 REF
INCHES
0.037
0.002
0.008
0.005
0.078
0.049
0.008
0.082
NOM
0.043
0.004
0.012
0.010
0.086
0.053
0.012
0.086
MAX