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SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
FEATURES
1
•
Available in the Texas Instruments
NanoFree™ Package
•
Supports 5-V V
Operation
CC
•
Input and Open-Drain Output Accept
Voltages up to 5.5 V
•
Max t
of 4.2 ns at 3.3 V
pd
•
Low Power Consumption, 10-μA Max I
•
±24-mA Output Drive at 3.3 V
DBV PACKAGE
(TOP VIEW)
N.C.
1
A
2
GND
3
N.C. – No internal connection
See mechanical drawings for dimensions.
YZP PACKAGE
(TOP VIEW)
DNU
V
A1
A2
CC
A
B1
B2
GND
Y
C1
C2
DNU – Do not use
YZV PACKAGE
(TOP VIEW)
A
V
A1
A2
CC
GND
Y
B1
B2
Table 2. YZV PACKAGE TERMINAL
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Check for Samples:
SN74LVC1G07
•
I
Supports Partial-Power-Down Mode
off
Operation
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
CC
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
N.C.
1
5
V
5
CC
A
2
GND
3
4
Y
4
DRY PACKAGE
(TOP VIEW)
N.C.
V
NC
1
6
CC
A
N.C.
A
5
2
Y
GND
GND
GND
3
4
Table 1. YZP PACKAGE TERMINAL
A
B
C
Table 2. YZV PACKAGE TERMINAL
A
B
SN74LVC1G07
SCES296X – FEBRUARY 2000 – REVISED DECEMBER 2010
DRL PACKAGE
(TOP VIEW)
N.C.
1
5
V
V
CC
CC
A
2
GND
3
4
Y
Y
DSF PACKAGE
(TOP VIEW)
V
1
6
CC
NC
2
5
3
4
Y
ASSIGNMENTS
1
DNU
A
No ball
GND
ASSIGNMENTS (continued)
ASSIGNMENTS
1
A
GND
© 2000–2010, Texas Instruments Incorporated
2
V
CC
Y
2
V
CC
Y