SN74LVC1G07DBVR | |
|---|---|
| Manufacturer Part Number | SN74LVC1G07DBVR |
| Description | IC BUFF/DVR NON-INVERT SOT235 |
| Manufacturer | Texas Instruments |
| Series | 74LVC |
| SN74LVC1G07DBVR datasheets |
|
Availability: In stock
International delivery:
Warranty: 60 days
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Specifications of SN74LVC1G07DBVR | |||
|---|---|---|---|
| Logic Type | Buffer/Line Driver, Non-Inverting with Open Drain | Number Of Elements | 1 |
| Number Of Bits Per Element | 1 | Current - Output High, Low | 32mA, 32mA |
| Voltage - Supply | 1.65 V ~ 5.5 V | Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount | Package / Case | SOT-23-5, SC-74A, SOT-25 |
| Logic Family | LVC | Number Of Channels Per Chip | Single |
| Polarity | Non-Inverting | Supply Voltage (max) | 5.5 V |
| Supply Voltage (min) | 1.65 V | Maximum Operating Temperature | + 85 C |
| Mounting Style | SMD/SMT | Low Level Output Current | 32 mA |
| Minimum Operating Temperature | - 40 C | Output Type | Open Drain |
| Propagation Delay Time | 4.2 ns @ 3.3 V or 3.5 ns @ 5 V | Number Of Lines (input / Output) | 1 / 1 |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Other names | 296-8485-2 |
PrevNext
SN74LVC1G07
SCES296X – FEBRUARY 2000 – REVISED DECEMBER 2010
DESCRIPTION/ORDERING INFORMATION
This single buffer/driver is designed for 1.65-V to 5.5-V V
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I
preventing damaging current backflow through the device when it is powered down.
T
PACKAGE
A
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZV (Pb-free)
SON – DRY
–40°C to 85°C
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
SOT – DSF
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRL/DRY/DSF: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
2
Submit Documentation Feedback
operation.
CC
.The I
off
ORDERING INFORMATION
ORDERABLE
(1) (2)
PART NUMBER
Reel of 3000
SN74LVC1G07YZPR
Reel of 3000
SN74LVC1G07YZVR
SN74LVC1G07DRYR
Reel of 5000
SN74LVC1G07DRYRG4
Reel of 3000
SN74LVC1G07DBVR
Reel of 250
SN74LVC1G07DBVT
Reel of 3000
SN74LVC1G07DCKR
Reel of 250
SN74LVC1G07DCKT
Reel of 4000
SN74LVC1G07DRLR
Reel
Preliminary
Product Folder Link(s):
SN74LVC1G07
www.ti.com
circuitry disables the outputs,
off
TOP-SIDE
(3)
MARKING
_ _ _CV_
_ _ _ _
CV
CV_
C07_
CV_
CV_
CV_
© 2000–2010, Texas Instruments Incorporated
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