SKiiP 1814 GB12E4-3DUL SEMIKRON, SKiiP 1814 GB12E4-3DUL Datasheet

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SKiiP 1814 GB12E4-3DUL

Manufacturer Part Number
SKiiP 1814 GB12E4-3DUL
Description
Manufacturer
SEMIKRON
Datasheet

Specifications of SKiiP 1814 GB12E4-3DUL

Family/system
SKiiP 4
Voltage (v)
1200
Current (a)
1800
Chip-type
IGBT 4 (Trench)
Case
SKiiP4
SKiiP 1814 GB12E4-3DUL
2-pack-integrated intelligent
Power System
SKiiP 1814 GB12E4-3DUL
Features
• Intelligent Power Module
• Integrated current and temperature
• Integrated DC-link measurement
• Solder free power section
• IGBT4 and CAL4F technology
• T
• Safety isolated switching and sensor
• Digital signal transmission
• 100% tested IPM
• RoHS compliant
• UL recognition in progress, file no.
Typical Applications*
• Renewable energies
• Traction
• Elevators
• Industrial drives
Remarks
For further information please refer to SKiiP®4
Technical Explanation
© by SEMIKRON
SKiiP
measurement
signals
E242581
jmax
= 175°C
®
4
S34
Absolute Maximum Ratings
Symbol
System
V
V
I
I
f
T
IGBT
V
I
I
T
Diode
V
I
I
T
Driver
V
V
dv/dt
f
Characteristics
Symbol
IGBT
V
V
r
E
R
R
t(RMS)
max (peak)
C
Cnom
F
Fnom
out
sw
CE
CC
isol
stg
CES
j
RRM
j
iH
CE(sat)
CE0
on
th(j-s)
th(j-r)
s
+ E
off
Rev. 1 – 15.12.2011
T
T
T
T
I
at terminal
at terminal
I
T
Conditions
Operating DC link voltage
DC, t = 1 s, each polarity
per AC terminal, rms, sinusoidal current
Max. peak current of power section
fundamental output frequency
storage temperature
junction temperature
junction temperature
power supply
input signal voltage (high)
secondary to primary side
switching frequency
Conditions
per IGBT switch
per IGBT switch
C
C
j
j
j
j
j
= 25 °C
= 175 °C
= 25 °C
= 175 °C
= 1800 A
= 1800 A
= 150 °C
T
T
T
T
T
T
T
T
T
T
V
V
s
s
s
s
j
j
j
j
j
j
CC
CC
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 150 °C
= 25 °C
= 70 °C
= 25 °C
= 70 °C
= 600 V
= 900 V
min.
19.2 ... 28.8
-40 ... 175
-40 ... 175
-40 ... 85
V
Values
s
4300
2700
1200
2345
1906
1800
1200
1776
1408
1800
1260
typ.
2.01
2.49
0.80
0.70
0.67
1.00
900
500
703
75
15
+ 0.3
1
0.0127
max.
0.021
2.26
2.69
0.90
0.80
0.76
1.05
kV/µs
Unit
Unit
K/W
K/W
kHz
kHz
m
m
mJ
mJ
°C
°C
°C
V
V
A
A
V
A
A
A
V
A
A
A
V
V
V
V
V
V
1

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SKiiP 1814 GB12E4-3DUL Summary of contents

Page 1

... SKiiP 1814 GB12E4-3DUL SKiiP ® 4 2-pack-integrated intelligent Power System SKiiP 1814 GB12E4-3DUL Features • Intelligent Power Module • Integrated current and temperature measurement • Integrated DC-link measurement • Solder free power section • IGBT4 and CAL4F technology • 175°C jmax • ...

Page 2

... SKiiP 1814 GB12E4-3DUL SKiiP ® 4 2-pack-integrated intelligent Power System SKiiP 1814 GB12E4-3DUL Features • Intelligent Power Module • Integrated current and temperature measurement • Integrated DC-link measurement • Solder free power section • IGBT4 and CAL4F technology • 175°C jmax • ...

Page 3

... SKiiP 1814 GB12E4-3DUL SKiiP ® 4 2-pack-integrated intelligent Power System SKiiP 1814 GB12E4-3DUL Features • Intelligent Power Module • Integrated current and temperature measurement • Integrated DC-link measurement • Solder free power section • IGBT4 and CAL4F technology • 175°C jmax • ...

Page 4

... SKiiP 1814 GB12E4-3DUL 4 Rev. 1 – 15.12.2011 © by SEMIKRON ...

Page 5

... SKiiP 1814 GB12E4-3DUL Fig. 1: Typical IGBT output characteristics Fig. 3: Typical energy losses E = f(I Fig. 5: Transient thermal impedance Zth(j-s) © by SEMIKRON Fig. 2: Typical diode output characteristics , Fig. 4: Typical energy losses Fig. 6: Transient thermal impedance Zth(j-r) Rev. 1 – 15.12.2011 , ...

Page 6

... SKiiP 1814 GB12E4-3DUL Fig. 7: Transient thermal impedance Zth(s-a) Fig. 9: Thermal resistance Rth(s-a) versus flow rate V 6 Fig. 8: Coefficients of thermal impedances Fig. 10: Pressure drop Δp versus flow rate V Rev. 1 – 15.12.2011 © by SEMIKRON ...

Page 7

... SKiiP 1814 GB12E4-3DUL Heat sink © by SEMIKRON Rev. 1 – 15.12.2011 7 ...

Page 8

... SKiiP 1814 GB12E4-3DUL This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON ...

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