LM3914

Manufacturer Part NumberLM3914
ManufacturerTexas Instruments
LM3914 datasheet
 


Specifications of LM3914

Output Channels10Led Voltage(max)(v)17
Pin/package18PDIP, 20PLCCRegulated Outputs(#)10
Iout(max)(a)0.03Led ConfigurationParallel
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LM3914 MDC MWC Dot/Bar Display Driver
Die/Wafer Characteristics
Fabrication Attributes
Physical Die Identification
Die Step
Physical Attributes
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
SIGNAL NAME
PAD# NUMBER
LED NO.1
1
V-
2
V-
3
V+
4
DIV LOW END
5
SIG INPUT
6
DIV HIGH END
7
REF OUTPUT
8
REF ADJ
9
MODE SEL
10
LED NO.10
11
LED NO.9
12
LED NO.8
13
NC
14
LED NO.7
15
NC
16
LED NO.6
17
00797035
Die Layout (D - Step)
3914
Bond Pad Opening Size (min)
D
Bond Pad Metalization
Passivation
150mm
Back Side Metal
2591µm x 2438µm
Back Side Connection
102.0mils x
96.0mils
330µm Nominal
175µm Nominal
Die Bond Pad Coordinate Locations (D - Step)
X/Y COORDINATES
X
Y
-1086
732
-1086
343
-1040
171
-1052
-206
-1086
-377
-903
-1154
-745
-1160
224
-1126
1086
-1154
1057
-475
1057
869
1086
1052
846
1160
537
1154
343
1154
171
1154
0
1154
19
General Die Information
94µm x 105µm
ALUMINUM
VOM NITRIDE
Bare Back
Floating
PAD SIZE
X
Y
105
x
105
105
x
105
105
x
105
105
x
105
105
x
105
101
x
105
105
x
94
105
x
94
105
x
105
94
x
105
94
x
128
105
x
105
105
x
94
105
x
105
105
x
105
82
x
105
105
x
105
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