The UC1842/3/4/5 family of control devices provides the necessary features to implement off-line or dc-to-dc fixed frequency current mode control schemes with a minimal external parts count

UC2845

Manufacturer Part NumberUC2845
DescriptionThe UC1842/3/4/5 family of control devices provides the necessary features to implement off-line or dc-to-dc fixed frequency current mode control schemes with a minimal external parts count
ManufacturerTexas Instruments
UC2845 datasheet
 


Specifications of UC2845

TopologyBoost, Flyback, ForwardControl MethodCurrent
Duty Cycle(max)(%)50Frequency(max)(khz)450
Uvlo Thresholds On/off(v)8.4/7.6Pin/package14SOIC, 8PDIP, 8SOIC
Vin(min)(v)7.6Vin(max)(v)30
Regulated Outputs(#)1Operating Temperature Range(c)-40 to 85
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Orderable Device
(1)
Package Type Package
Status
UC3845D
ACTIVE
SOIC
UC3845D8
ACTIVE
SOIC
UC3845D8G4
ACTIVE
SOIC
UC3845D8TR
ACTIVE
SOIC
UC3845D8TRG4
ACTIVE
SOIC
UC3845DG4
ACTIVE
SOIC
UC3845DTR
ACTIVE
SOIC
UC3845DTRG4
ACTIVE
SOIC
UC3845N
ACTIVE
PDIP
UC3845NG4
ACTIVE
PDIP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Pins
Package Qty
(2)
Eco Plan
Drawing
Ball Finish
D
14
50
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
D
8
75
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
D
8
75
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
D
8
2500
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
D
8
2500
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
D
14
50
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
D
14
2500
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
D
14
2500
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
P
8
50
Green (RoHS
CU NIPDAU N / A for Pkg Type
& no Sb/Br)
P
8
50
Green (RoHS
CU NIPDAU N / A for Pkg Type
& no Sb/Br)
Addendum-Page 6
PACKAGE OPTION ADDENDUM
5-Sep-2011
Lead/
(3)
Samples
MSL Peak Temp
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