TPS71719

Manufacturer Part NumberTPS71719
DescriptionThe TPS717xx family of low-dropout (LDO), low-power linear regulators offers very high power supply rejection (PSRR) while maintaining very low 45µA ground current in an ultra-small, five-pin SC70 package
ManufacturerTexas Instruments
TPS71719 datasheet
 


Specifications of TPS71719

Iout(max)(a)0.1Vdo(typ)(mv)170
Iq(typ)(ma)0.05Vin(min)(v)2.5
Vin(max)(v)6.5Vout Adj(min)(v)1.9
Vout Adj(max)(v)1.9Accuracy(%)3
Output Capacitor TypeCeramicFixed Output Options(v)1.9
Vout(min)(v)1.9Vout(max)(v)1.9
Pin/package5SC70Regulated Outputs(#)1
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www.ti.com..................................................................................................................................................
Under-Voltage Lock-Out (UVLO)
The TPS717xx utilizes an under-voltage lock-out
circuit to keep the output shut off until internal
circuitry is operating properly. The UVLO circuit has a
de-glitch
feature
so
that
it
undershoot transients on the input if they are less
than 50 s duration.
Minimum Load
The TPS717xx is stable and well-behaved with no
output load. Traditional PMOS LDO regulators suffer
from lower loop gain at very light output loads. The
TPS717xx employs an innovative low-current mode
circuit to increase loop gain under very light or
no-load conditions, resulting in improved output
voltage regulation performance down to zero output
current.
THERMAL INFORMATION
Thermal Protection
Thermal protection disables the output when the
junction temperature rises to approximately +160°C,
allowing the device to cool. When the junction
temperature cools to approximately +140°C the
output circuitry is again enabled. Depending on power
dissipation,
thermal
resistance,
temperature, the thermal protection circuit may cycle
on and off. This cycling limits the dissipation of the
regulator, protecting it from damage because of
overheating.
Any tendency to activate the thermal protection circuit
indicates
excessive
power
dissipation
inadequate heatsink. For reliable operation, junction
temperature should be limited to +125°C maximum.
To estimate the margin of safety in a complete design
(including
heatsink),
increase
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
Copyright © 2006–2009, Texas Instruments Incorporated
+35°C above the maximum expected ambient
condition
of
configuration
temperature of +125°C at the highest expected
ambient temperature and worst-case load.
typically
ignores
The internal protection circuitry of the TPS717xx has
been designed to protect against overload conditions.
It was not intended to replace proper heatsinking.
Continuously running the TPS717xx into thermal
shutdown will degrade device reliability.
Power Dissipation
The ability to remove heat from the die is different for
each
package
considerations in the printed circuit board (PCB)
layout. The PCB area around the device that is free
of other components moves the heat from the device
to the ambient air. Performance data for JEDEC low-
and high-K boards are given in the
Ratings
table. Using heavier copper will increase the
effectiveness in removing heat from the device. The
addition of plated through-holes to heat-dissipating
layers also improves the heatsink effectiveness.
Power dissipation depends on input voltage and load
conditions. Power dissipation (P
product of the output current times the voltage drop
across the output pass element (V
and
ambient
shown in
Equation
P
+ V
* V
D
IN
Package Mounting
Solder
pad
or
an
TPS717xx are available from the Texas Instruments
web site at www.ti.com.
the
ambient
TPS717xx
SBVS068G – FEBRUARY 2006 – REVISED APRIL 2009
your
particular
application.
This
produces
a
worst-case
junction
type,
presenting
different
Dissipation
) is equal to the
D
to V
), as
IN
OUT
4:
I
OUT
OUT
footprint
recommendations
for
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the
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