TPS71719

Manufacturer Part NumberTPS71719
DescriptionThe TPS717xx family of low-dropout (LDO), low-power linear regulators offers very high power supply rejection (PSRR) while maintaining very low 45µA ground current in an ultra-small, five-pin SC70 package
ManufacturerTexas Instruments
TPS71719 datasheet
 


Specifications of TPS71719

Iout(max)(a)0.1Vdo(typ)(mv)170
Iq(typ)(ma)0.05Vin(min)(v)2.5
Vin(max)(v)6.5Vout Adj(min)(v)1.9
Vout Adj(max)(v)1.9Accuracy(%)3
Output Capacitor TypeCeramicFixed Output Options(v)1.9
Vout(min)(v)1.9Vout(max)(v)1.9
Pin/package5SC70Regulated Outputs(#)1
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Orderable Device
(1)
Package Type Package
Status
TPS71733DRVTG4
ACTIVE
SON
TPS71733DSER
ACTIVE
WSON
TPS71733DSERG4
ACTIVE
WSON
TPS71733DSET
ACTIVE
WSON
TPS71733DSETG4
ACTIVE
WSON
TPS71745DSER
ACTIVE
WSON
TPS71745DSET
ACTIVE
WSON
TPS71750DSER
ACTIVE
WSON
TPS71750DSET
ACTIVE
WSON
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Pins
Package Qty
(2)
Eco Plan
Drawing
Ball Finish
DRV
6
250
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
DSE
6
3000
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
DSE
6
3000
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
DSE
6
250
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
DSE
6
250
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
DSE
6
3000
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
DSE
6
250
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
DSE
6
3000
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
DSE
6
250
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
Addendum-Page 6
PACKAGE OPTION ADDENDUM
23-Dec-2010
Lead/
(3)
Samples
MSL Peak Temp
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