SN74LVC1G139

Manufacturer Part NumberSN74LVC1G139
ManufacturerTexas Instruments
SN74LVC1G139 datasheet
 


Specifications of SN74LVC1G139

Vcc Range(v)1.65 to 5.5Output Drive(ma)-32/32
To4Technology FamilyLVC
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FEATURES
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V V
Operation
CC
Inputs Accept Voltages to 5.5 V
Max t
of 4.9 ns at 3.3 V
pd
Low Power Consumption, 10- A Max I
24-mA Output Drive at 3.3 V
I
Supports Partial-Power-Down Mode
off
Operation
DCT PACKAGE
(TOP VIEW)
A
1
8
B
2
7
Y3
3
6
GND
4
5
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This 2-to-4 line decoder is designed for 1.65-V to 5.5-V V
The SN74LVC1G139 2-line to 4-line decoder is designed to be used in high-performance memory-decoding or
data-routing applications requiring very short propagation delay times. In high-performance memory systems, this
decoder can be used to minimize the effects of system decoding. When used with high-speed memories utilizing
a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are less than
the typical access time of the memory. This means that the effective system delay introduced by the decoder is
negligible.
T
PACKAGE
A
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
–40 C to 85 C
SSOP – DCT
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SCES602B – AUGUST 2004 – REVISED DECEMBER 2005
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
CC
abc
DCU PACKAGE
(TOP VIEW)
A
V
1
8
V
CC
B
2
7
Y0
Y3
3
6
Y1
Y0
GND
4
5
Y2
Y1
Y2
operation.
CC
ORDERING INFORMATION
(1)
ORDERABLE PART NUMBER
SN74LVC1G139YEPR
Reel of 3000
SN74LVC1G139YZPR
Reel of 3000
SN74LVC1G139DCTR
Reel of 250
SN74LVC1G139DCTT
Reel of 3000
SN74LVC1G139DCUR
Reel of 250
SN74LVC1G139DCUT
SN74LVC1G139
2-TO-4 LINE DECODER
YEP OR YZP PACKAGE
(BOTTOM VIEW)
Y2
GND
4
5
CC
Y1
Y3
3
6
Y0
B
2
7
A
1
8
V
CC
TOP-SIDE MARKING
_ _ _C9_
C39_ _ _
C39_
Copyright © 2004–2005, Texas Instruments Incorporated
(2)

SN74LVC1G139 Summary of contents

  • Page 1

    ... DESCRIPTION/ORDERING INFORMATION This 2-to-4 line decoder is designed for 1.65-V to 5.5-V V The SN74LVC1G139 2-line to 4-line decoder is designed to be used in high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, this decoder can be used to minimize the effects of system decoding. When used with high-speed memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are less than the typical access time of the memory ...

  • Page 2

    ... SN74LVC1G139 2-TO-4 LINE DECODER SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using I preventing damaging current backflow through the device when it is powered down. ...

  • Page 3

    ... CC (4) The package thermal impedance is calculated in accordance with JESD 51-7. (2) (3) V < < GND DCT package DCU package YEP/YZP package SN74LVC1G139 2-TO-4 LINE DECODER SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 MIN MAX –0.5 6.5 –0.5 6.5 (2) –0.5 6.5 –0 ...

  • Page 4

    ... SN74LVC1G139 2-TO-4 LINE DECODER SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 Recommended Operating Conditions V Supply voltage CC V High-level input voltage IH V Low-level input voltage IL V Input voltage I V Output voltage O I High-level output current OH I Low-level output current Input transition rise or fall rate ...

  • Page 5

    ... 1 0.15 V (OUTPUT) MIN MAX 1.8 V TEST CC CONDITIONS TYP MHz 31 SN74LVC1G139 2-TO-4 LINE DECODER SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 (1) V MIN TYP MAX – 0.1 CC 1.65 V 1.2 2.3 V 1.9 2 2.3 4.5 V 3.8 1. 5.5 V ...

  • Page 6

    ... SN74LVC1G139 2-TO-4 LINE DECODER SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION R L From Output Under Test (see Note A) LOAD CIRCUIT V CC 1.8 V 0.15 V 2.5 V 0.2 V 3 Input V M VOLTAGE WAVEFORMS PULSE DURATION V V Input M t PLH ...

  • Page 7

    ... LOAD V OL (see Note B) t PLH Output V OH Waveform GND V OL (see Note B) . dis . SN74LVC1G139 2-TO-4 LINE DECODER SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 TEST Open PLH PHL PLZ PZL LOAD t /t GND PHZ PZH C ...

  • Page 8

    ... SN74LVC1G139DCTT ACTIVE SN74LVC1G139DCUR ACTIVE SN74LVC1G139DCUT ACTIVE SN74LVC1G139YZPR ACTIVE (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design ...

  • Page 9

    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold Customer on an annual basis. PACKAGE OPTION ADDENDUM Addendum-Page 2 ...

  • Page 10

    ... TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Type Drawing SN74LVC1G139DCUR US8 DCU SN74LVC1G139YZPR DSBGA YZP PACKAGE MATERIALS INFORMATION Pins SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 8 3000 180.0 8.4 2.25 8 3000 180.0 8.4 1.02 Pack Materials-Page 1 6-May-2011 Pin1 ...

  • Page 11

    ... Device Package Type SN74LVC1G139DCUR US8 SN74LVC1G139YZPR DSBGA PACKAGE MATERIALS INFORMATION Package Drawing Pins SPQ Length (mm) DCU 8 3000 YZP 8 3000 Pack Materials-Page 2 6-May-2011 Width (mm) Height (mm) 202.0 201.0 28.0 220.0 220.0 34.0 ...

  • Page 12

    DCT (R-PDSO-G8) 0, Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç PIN 1 INDEX AREA 1 4 3,15 2,75 0,10 0,00 NOTES: A. All linear dimensions ...

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  • Page 17

    ... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’ ...