FDMS8888 Fairchild Semiconductor, FDMS8888 Datasheet

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FDMS8888

Manufacturer Part Number
FDMS8888
Description
The FDMS8888 has been designed to minimixe losses in power conversion application
Manufacturer
Fairchild Semiconductor
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FDMS8888
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Company:
Part Number:
FDMS8888
Quantity:
6 000
©2011 Fairchild Semiconductor Corporation
FDMS8888 Rev.C
FDMS8888
N-Channel PowerTrench
30 V, 21 A, 9.5 m
Features
MOSFET Maximum Ratings
Thermal Characteristics
Package Marking and Ordering Information
V
V
I
E
P
T
R
R
D
DS
GS
AS
D
J
Max r
Max r
Advanced Package and Silicon combination
for low r
MSL1 robust package design
RoHS Compliant
, T
JC
JA
Symbol
Device Marking
STG
DS(on)
DS(on)
8888
DS(on)
= 9.5 m at V
= 14.5 m at V
Top
and high efficiency
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous (Package limited)
Single Pulse Avalanche Energy
Power Dissipation
Power Dissipation
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
GS
GS
Power 56
= 10 V, I
FDMS8888
-Continuous
= 4.5 V, I
-Continuous (Silicon limited)
-Pulsed
Device
D
D
= 13.5 A
D
= 10.9 A
D
T
®
A
D
= 25 °C unless otherwise noted
MOSFET
NNNN
D
Parameter
Bottom
Package
Power 56
S
S
1
S
T
T
T
T
T
Pin 1
General Description
The
conversion application. Advancements in both silicon
package technologies have been combined to offer the lowest
r
Applications
G
C
C
A
C
A
DS(on)
= 25 °C
= 25 °C
= 25 °C
= 25 °C
Synchronous Buck for Notebook Vcore and Server
Notebook Battery Pack
Load Switch
= 25 °C
FDMS8888
while maintaining excellent switching performance.
Reel Size
has been designed to minimize losses in
13 ’’
(Note 1a)
(Note 1a)
(Note 1a)
D
D
D
D
(Note 3)
6
8
5
7
Tape Width
12 mm
-55 to +150
Ratings
13.5
±20
2.5
3.3
30
21
51
80
42
50
54
www.fairchildsemi.com
4
3
2
1
3000 units
Quantity
July 2011
G
S
S
S
power
Units
°C/W
mJ
°C
W
V
V
A
and

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FDMS8888 Summary of contents

Page 1

... R Thermal Resistance, Junction to Case JC R Thermal Resistance, Junction to Ambient JA Package Marking and Ordering Information Device Marking Device FDMS8888 8888 ©2011 Fairchild Semiconductor Corporation FDMS8888 Rev.C NNNN ® MOSFET General Description = 13.5 A The FDMS8888 D conversion application. Advancements in both silicon = 10 package technologies have been combined to offer the lowest r while maintaining excellent switching performance ...

Page 2

... JA the user's board design. 2. Pulse Test: Pulse Width < 300 s, Duty cycle < 2.0%. ° 3. Starting 0.3 mH ©2011 Fairchild Semiconductor Corporation FDMS8888 Rev °C unless otherwise noted J Test Conditions I = 250 250 A, referenced to 25 °C ...

Page 3

... Figure 3. Normalized On Resistance vs Junction Temperature 80 PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 150 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics ©2011 Fairchild Semiconductor Corporation FDMS8888 Rev °C unless otherwise noted J 4.0 3 2.5 2.0 1.5 1 0.5 2.0 2.5 3 ...

Page 4

... T = MAX RATED 125 C 0.01 0.01 0 DRAIN to SOURCE VOLTAGE (V) DS Figure 11. Forward Bias Safe Operating Area ©2011 Fairchild Semiconductor Corporation FDMS8888 Rev °C unless otherwise noted J 2000 1000 100 100 ...

Page 5

... Typical Characteristics 2 1 DUTY CYCLE-DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.1 0.02 0.01 SINGLE PULSE 0.01 R 0.003 - Figure 13. ©2011 Fairchild Semiconductor Corporation FDMS8888 Rev °C unless otherwise noted 125 C RECTANGULAR PULSE DURATION (sec) Junction-to-Ambient Transient Thermal Response Curve NOTES: ...

Page 6

... Dimensional Outline and Pad Layout ©2011 Fairchild Semiconductor Corporation FDMS8888 Rev.C 6 www.fairchildsemi.com ...

Page 7

... Definition of Terms Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production ©2011 Fairchild Semiconductor Corporation FDMS8888 Rev.C ® * PDP SPM™ Power-SPM™ ® PowerTrench PowerXS™ SM Programmable Active Droop™ ® QFET QS™ ...

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