BAS16-02W Infineon Technologies, BAS16-02W Datasheet

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BAS16-02W

Manufacturer Part Number
BAS16-02W
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of BAS16-02W

Packages
SCD80
Configuration
Single
Vr (max)
80.0 V
If (max)
200.0 mA
Ir (max)
100.0 nA
Trr (max)
4.0 ns

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS16-02W
Manufacturer:
INFINEON
Quantity:
14 000
Part Number:
BAS16-02W E6327
Manufacturer:
RENESAS
Quantity:
5 000
Silicon Switching Diode
• For high-speed switching applications
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
BAS16
BAS16W
Type
BAS16
BAS16-02L*
BAS16-02V
BAS16-02W
BAS16-03W
BAS16-07L4*
BAS16S
BAS16U
BAS16W
* Preliminary Data
1
Pb-containing package may be available upon special request
BAS16-02L
BAS16-02V
BAS16-02W
BAS16-03W
Package
SOT23
TSLP-2-1
SC79
SCD80
SOD323
TSLP-4-4
SOT363
SC74
SOT323
1)
BAS16S
BAS16U
1
Configuration
single
single, leadless
single
single
single
parallel pair, leadless
parallel triple
parallel triple
single
BAS16-07L4
Marking
A6s
A6
6
A6
white B
6A
A6s
A6s
A6s
2009-09-28
BAS16...

Related parts for BAS16-02W

BAS16-02W Summary of contents

Page 1

... For high-speed switching applications • Pb-free (RoHS compliant) package • Qualified according AEC Q101 BAS16 BAS16-02L BAS16W BAS16-02V BAS16-02W BAS16-03W Type BAS16 BAS16-02L* BAS16-02V BAS16-02W BAS16-03W BAS16-07L4* BAS16S BAS16U BAS16W * Preliminary Data 1 Pb-containing package may be available upon special request 1) BAS16S BAS16U Package ...

Page 2

... Peak reverse voltage Forward current BAS16 BAS16-02L, -07L4 BAS16-02V, -02W BAS16-03W BAS16S BAS16U BAS16W Non-repetitive peak surge forward current µs, BAS16 -03W µs, BAS16-02L/ -02V/ -02W/ -07L4 Total power dissipation ≤ 54 °C BAS16 ≤ 130 °C BAS16-02L, -07L4 ≤ ...

Page 3

... Thermal Resistance Parameter 1) Junction - soldering point BAS16, BAS16S BAS16-02L, -07L4 BAS16-02V, -02W BAS16-03W BAS16U BAS16W Electrical Characteristics at T Parameter DC Characteristics Breakdown voltage I = 100 µA (BR) Reverse current 150 ° 150 ° Forward voltage ...

Page 4

... R L Test circuit for reverse recovery time D.U.T. Ι 25°C, unless otherwise specified A Symbol 1mA , R Pulse generator: t Oscillograph Oscillograph 50Ω, t EHN00017 4 BAS16... Values Unit min. typ. max 100ns 0.05 0.6ns 50Ω 0.35ns 0.05pF ...

Page 5

... Forward current I BAS16 300 EHB00023 mA 200 150 max 100 50 0 1 ƒ BAS 16 Ι = 100 0 100 = ƒ 105 120 °C 2009-09-28 BAS16... EHB00025 C 150 T A 150 T S ...

Page 6

... Forward current BAS16-02L, -07L4 250 mA 150 100 ƒ (T Forward current BAS16-03W 300 mA 200 150 100 Forward current I BAS16-02V, -02W 250 mA 150 100 50 90 105 120 °C 150 Forward current I ...

Page 7

... ƒ Permissible Pulse Load Fmax BAS16 ƒ 105 120 ° ƒ FDC 0.005 0.01 0.02 0.05 0.1 1 0.2 0 2009-09-28 BAS16... 150 ...

Page 8

... Permissible Pulse Load Fmax BAS16-02L, -07L4 ƒ Permissible Pulse Load Fmax BAS16-02V, -02W 2 10 D=0 0.2 0.1 0.05 0.02 0.01 0.005 BAS16... = ƒ FDC 0.005 0.01 0.02 0.05 0.1 0.2 0 ...

Page 9

... FDC BAS16-03W ƒ Permissible Pulse Load Fmax FDC BAS16S BAS16... = ƒ D=0 0.005 0.01 0.02 0.05 0.1 0.2 0 ƒ 0.005 0.01 0.02 0.05 0.1 0.2 0 2009-09-28 ...

Page 10

... FDC BAS16U ƒ Permissible Pulse Load Fmax FDC BAS16W BAS16... = ƒ D=0 0.005 0.01 0.02 0.05 0.1 0.2 0 ƒ 0.005 0.01 0.02 0.05 0.1 0.2 0 2009-09-28 ...

Page 11

... Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. Package SC74 ±0.2 B (0.35 +0.1 0.35 -0.05 0 0.95 1.9 0.5 0.95 Manufacturer 2005, June Date code (Year/Month) BCW66H Type code 4 3.15 Pin 1 marking 11 BAS16... 1.1 MAX. +0.1 0.15 -0.06 A 0.1 MAX. 0 0.2 1.15 2009-09-28 ...

Page 12

... Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 0.4 Cathode marking 0.93 Package SC79 0.2 M 0.13 0.8 ±0 Cathode 0.3 marking ±0.05 0.55 ±0.04 0.35 Reel with 2 mm Pitch 2 Cathode marking 12 BAS16... A +0.05 -0.03 A 2005, June Date code BAR63-02V Type code Cathode marking Laser marking 0.2 0.66 2009-09-28 ...

Page 13

... Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Cathode marking Package SCD80 0 +0.05 0.13 0.8 ±0.1 -0. 0.3 ±0.05 0.7 ±0.1 0.35 Reel with 2 mm Pitch 2 0.4 Cathode marking 0.9 13 BAS16... A 2005, June Date code BAR63-02W Type code Cathode marking Laser marking 0.2 0.7 2009-09-28 ...

Page 14

... BAS16... ...

Page 15

... Package SOD323 15 BAS16... 2009-09-28 ...

Page 16

... Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT23 2.9 ±0 +0.1 0.4 -0.05 C 0.95 1.9 0. Lead width can be 0.6 max. in dambar area 0.8 0.8 1.2 Manufacturer s EH 2005, June Date code (YM) Pin 1 BCW66 Type code 4 0.9 3.15 16 BAS16... 1 ±0.1 0.1 MAX 0.2 1.15 2009-09-28 ...

Page 17

... Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT323 2 ±0.2 0.1 MAX. +0.1 3x 0.3 -0.05 0 0.65 0.65 0.2 0.6 0.65 0.65 Manufacturer 2005, June Date code (YM) BCR108W Pin 1 Type code 0.2 4 Pin 1 2.15 17 BAS16... 0.9 ±0.1 0.1 A +0.1 0.15 -0. 1.1 2009-09-28 ...

Page 18

... Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. ackage SOT363 P 2 ±0.2 +0.1 6x 0.2 0.1 MAX. -0.05 0 0.65 0.65 0 0.3 0.65 0.65 Manufacturer 2005, June Date code (Year/Month) BCR108S Type code 4 2.15 Pin 1 marking 18 BAS16... 0.9 ±0.1 A +0.1 0.15 -0.05 0.2 1.1 2009-09-28 ...

Page 19

... For board assembly information please refer to Infineon website "Packages" Copper Marking Layout (Example) Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) Cathode marking Package TSLP-2-1 +0.1 0.4 0.05 MAX. 0.5 ±0.035 0.6 0.45 Solder mask Stencil apertures BAS16-02L Type code Cathode marking Laser marking 0.5 4 0.76 19 BAS16... Bottom view 0.6 ±0. 2009-09-28 ...

Page 20

... Package TSLP-4-4 20 BAS16... 2009-09-28 ...

Page 21

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. 21 BAS16... 2009-09-28 ...

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