BAS16U Infineon Technologies, BAS16U Datasheet
BAS16U
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BAS16U Summary of contents
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... BAS16-03W Type BAS16 BAS16-02L* BAS16-02V BAS16-02W BAS16-03W BAS16-07L4* BAS16S BAS16U BAS16W * Preliminary Data 1 Pb-containing package may be available upon special request 1) BAS16S BAS16U Package Configuration SOT23 single TSLP-2-1 single, leadless SC79 single SCD80 single SOD323 single TSLP-4-4 parallel pair, leadless SOT363 parallel triple ...
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... BAS16 ≤ 130 °C BAS16-02L, -07L4 ≤ 120 °C BAS16-02V, -02W ≤ 116 °C BAS16-03W ≤ 85 °C BAS16S ≤ 113 °C BAS16U ≤ 119 °C BAS16W Junction temperature Storage temperature Symbol Value ...
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... Thermal Resistance Parameter 1) Junction - soldering point BAS16, BAS16S BAS16-02L, -07L4 BAS16-02V, -02W BAS16-03W BAS16U BAS16W Electrical Characteristics at T Parameter DC Characteristics Breakdown voltage I = 100 µA (BR) Reverse current 150 ° 150 ° Forward voltage ...
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Electrical Characteristics at T Parameter AC Characteristics Diode capacitance MHz R Reverse recovery time mA mA, measured 100 Ω Test ...
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Reverse current Parameter ƒ (V Forward current 25°C A BAS ...
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Forward current BAS16-02L, -07L4 250 mA 150 100 ƒ (T Forward current BAS16-03W 300 mA 200 150 100 ...
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... Forward current BAS16U 250 mA 200 175 150 125 100 Permissible Puls Load R thJS BAS16 0.2 0.1 0.05 0.02 0. 0.005 Forward current I BAS16W 300 mA 200 150 100 50 90 105 120 °C ...
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Permissible Puls Load R thJS BAS16-02L, -07L4 2 10 K/W 0.5 1 0.2 10 0.1 0.05 0.02 0.01 0.005 Permissible Puls Load R thJS BAS16-02V, -02W ...
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Permissible Puls Load R thJS BAS16-03W D=0.5 0.2 1 0.1 10 0.05 0.02 0.01 0.005 Permissible Puls Load R thJS BAS16S 3 10 K/W ...
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... Permissible Puls Load R thJS BAS16W 0.5 0.2 0 0.05 0.02 0.01 0.005 ƒ Permissible Pulse Load Fmax FDC BAS16U ƒ Permissible Pulse Load Fmax FDC BAS16W ...
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Package Outline 2.9 (2.25 Pin 1 marking Foot Print Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 0.4 Cathode marking 0.93 Package SC79 0.2 M ...
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Package Outline Cathode marking Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Cathode marking Package SCD80 0.2 A ...
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Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 Month ...
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Package SOD323 15 BAS16... 2009-09-28 ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT23 2.9 ±0 +0.1 0.4 -0.05 C 0.95 1.9 0.25 B ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT323 2 ±0.2 0.1 MAX. +0.1 3x 0.3 -0.05 0 0.65 0.65 0.2 0.6 ...
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Package Outline Pin 1 marking Foot Print Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = ...
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Package Outline Top view 2 1 Cathode marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" Copper Marking Layout (Example) Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 ...
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Package TSLP-4-4 20 BAS16... 2009-09-28 ...
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... For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...