BFP410 Infineon Technologies, BFP410 Datasheet
BFP410
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BFP410 Summary of contents
Page 1
... measured on the emitter lead at the soldering point to the pcb Thermal Resistance Parameter 1) Junction - soldering point Pin Configuration 1=B 2=E 3=C 4=E Symbol V CEO V CES V CBO V EBO tot Stg Symbol R thJS 1 BFP410 Package - - SOT343 Value Unit V 4 150 mW 150 °C -55 ... 150 -55 ... 150 Value Unit 335 K/W 2010-04-09 ...
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... C DC current gain mA pulse measured For calculation of R please refer to Application Note Thermal Resistance thJA = 25°C, unless otherwise specified A Symbol V (BR)CEO I CES I CBO I EBO BFP410 Values Unit min. typ. max. 4 0.001 0.6 µA 60 ...
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... Termination used for this measurement is 50 Ω from 0.1 MHz to 6 GHz = 25°C, unless otherwise specified A Symbol Sopt Sopt -1dB = 50 Ω BFP410 Values Unit min. typ. max GHz - 0. 23.5 - ...
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... Power gain 0. BFP410 = ƒ 0.5 1 1 ƒ ( Gms |S21|² Gma GHz f 2010-04- ...
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... I C Noise figure F = ƒ GHz 2.5 2 1.5 f= 10.0 GHz 1 f= 5.5 GHz f= 2.4 GHz f= 1.8 GHz 0.5 f= 0.9 GHz f= 0.45 GHz BFP410 = ƒ 0.15GHz 0.45GHz 0.9GHz 1.5GHz 1.9GHz 2.4GHz 3.5GHz 5.5GHz 10GHz ZS=50Ohm ZS=ZSopt ...
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... Collector current I Parameter 1 Base current reverse µ BFP410 = ƒ 160µA 90µA 20µ ƒ 0 2010-04- ...
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... Package Outline +0.1 0.3 -0.05 4x 0.1 M Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT343 0.9 ±0.1 2 ±0.2 0.1 MAX. 1 0.15 +0.1 0.6 -0.05 0 0.6 1.15 0.9 Manufacturer 2005, June Date code (YM) BGA420 Pin 1 Type code 0.2 4 2.15 1.1 7 BFP410 A +0.1 -0.05 2010-04-09 ...
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... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. 8 BFP410 2010-04-09 ...