NSSM038A

Manufacturer Part NumberNSSM038A
ManufacturerNichia
NSSM038A datasheet
 


Specifications of NSSM038A

Size Lxwxh (mm)4.7x1.5x1.2Lumi-nous Inten-sity Typ(cd)240
Forward Voltage Vf(v) Typ3.20Forward Voltage Vf(v) Max3.50
Directivity (degree)110If (ma)20
Mounting StyleThrough Hole  
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CAUTIONS
(1) Storage
Conditions
Before Opening Aluminum Bag
Storage
After Opening Aluminum Bag
Baking
● Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details.
● Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination
and result in optical performance degradation. Products are packed in moisture-proof aluminum bags
to minimize moisture absorption during transportation and storage.
Included silica gel desiccants change from blue to red if moisture had penetrated bags.
● After opening the moisture-proof aluminum bag, the products should go through the soldering process
within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants
in a hermetically sealed container, preferably the original moisture-proof bags for storage.
● After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue,
the products should be baked. Baking should only be done once.
● Customer is advised to keep the LEDs in an airtight container when not in use. Exposure to a corrosive environment
may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristics.
It is also recommended to return the LEDs to the original moisture proof bags and reseal.
● After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials
in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere.
The above should be taken into consideration when designing.
Resin materials, in particular, may contain substances which can affect silver plating, such as halogen.
● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur.
The extremely corroded or contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended
as a material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts
inside the products, caused by low molecular weight volatile siloxane.
● To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions.
(2) Directions for Use
● In designing a circuit, the current through each LED die must not exceed the Absolute Maximum Rating current
specified for each die.
It is recommended that each LED die is driven at a constant current.
● When having the two or more dice within this product on at the same time, the total power dissipation for the LED package
must be within the absolute maximum value specified in this specification.
● LEDs should be operated in forward bias. Driving circuits must not subject LEDs to either forward or reverse voltage while off.
Continuous reverse voltage can cause migration and LED damage.
● For stabilizing the LED characteristics, it is recommended to operate at greater than 10% nominal current.
● Care must be taken to ensure that the reverse voltage will not exceed the Absolute Maximum Rating
when using the LEDs with matrix drive.
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
(3) Handling Precautions
● Do not handle LEDs with bare hands, it may contaminate the LED surface and affect optical characteristics.
In the worst case, catastrophic failure from excess pressure through wire-bond breaks and package damage may result.
● When handling the product with tweezers, be careful not to apply excessive force to the resin.
Otherwise, The resin can be cut, chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures.
● Dropping the product may cause damage.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures.
Temperature
Humidity
≤30°C
≤90%RH
≤30°C
≤70%RH
65±5°C
-
Time
Within 1 Year from Delivery Date
≤168hours
≥24hours
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