NSDW570GS-K1 Nichia, NSDW570GS-K1 Datasheet - Page 14

• Manufacturer Part Number: NSDW570GS-K1
• Manufacturer: Nichia

Specifications of NSDW570GS-K1

• Size Lxwxh (mm): Round 5.0
• Lumi-nous Flux Typ(lm)): 28.0
• Forward Voltage Vf(v) Typ: 3.40
• Forward Voltage Vf(v) Max: 3.70
• Directivity (degree): 140
• If (ma): 70
• Mounting Style: Through Hole

CAUTIONS
(1) Lead Forming
(2) Storage
(3) Directions for Use
(4) Handling Precautions
(5) Design Consideration
● When forming leads, the leads should be bent at a point at lease 3mm from the base of the epoxy bulb.
● Lead forming should be done before soldering.
● Do not apply any bending stress to the base of the lead.
● When mounting the product onto a printed circuit board, the via-holes on the board should be exactly aligned
● Shelf life of the products in unopened bag is 3 months(max.) at <30°C and 70% RH from the delivery date.
● Nichia LED leadframe are silver plated copper alloy. This silver surface may be affected by environments
● To avoid condensation, the products must not be stored in the areas where temperature and humidity fluctuate greatly.
● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating.
● LEDs should be operated in forward bias. Driving circuits must not subject LEDs to either forward or reverse voltage while off.
● For stabilizing the LED characteristics, it is recommended to operate at greater than 10% nominal current.
● Care must be taken to ensure that the reverse voltage will not exceed the Absolute Maximum Rating
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
● Do not handle LEDs with bare hands, it may contaminate the LED surface and affect optical characteristics.
● Dropping the product may cause damage.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
● PCB warpage after mounting the products onto a PCB can cause the package to break.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
● Board separation must be performed using special jigs, not using hands.
Do not use the base of the leadframe as a fulcrum during lead forming.
The stress to the base may damage the LED's characteristics or it may break the LEDs.
with the lead pitch of the product. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin
and this will degrade the LEDs.
If the shelf life exceeds 3 months or more, the LEDs need to be stored in a sealed container
with silica gel desiccants to ensure their shelf life will not exceed 1 year.
which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor.
This corrosion or discoloration may cause difficulty during soldering operation.
It is recommended that the LEDs be used as soon as possible.
Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended.
If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation
in Forward Voltage characteristics of the LEDs.
Continuous reverse voltage can cause migration and LED damage.
when using the LEDs with matrix drive.
In the worst case, catastrophic failure from excess pressure through wire-bond breaks and package damage may result.
delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures.
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
(A)
(B)
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