74AHC1G00GW Philips Semiconductors, 74AHC1G00GW Datasheet

no-image

74AHC1G00GW

Manufacturer Part Number
74AHC1G00GW
Description
Manufacturer
Philips Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74AHC1G00GW
Manufacturer:
ZARLINK
Quantity:
2
Part Number:
74AHC1G00GW
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
74AHC1G00GW
Manufacturer:
NXP
Quantity:
13 043
Part Number:
74AHC1G00GW
Manufacturer:
NXP
Quantity:
13 599
Part Number:
74AHC1G00GW
Quantity:
9 000
Part Number:
74AHC1G00GW,125
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
74AHC1G00GW-G
Manufacturer:
IDT
Quantity:
540
Part Number:
74AHC1G00GWЈ¬125
Manufacturer:
NXP
Quantity:
252 000
Product specification
Supersedes data of 2002 Feb 27
DATA SHEET
74AHC1G00; 74AHCT1G00
2-input NAND gate
INTEGRATED CIRCUITS
2002 May 27

Related parts for 74AHC1G00GW

74AHC1G00GW Summary of contents

Page 1

DATA SHEET 74AHC1G00; 74AHCT1G00 2-input NAND gate Product specification Supersedes data of 2002 Feb 27 INTEGRATED CIRCUITS 2002 May 27 ...

Page 2

... Philips Semiconductors 2-input NAND gate FEATURES Symmetrical output impedance High noise immunity ESD protection: – HBM EIA/JESD22-A114-A exceeds 2000 V – MM EIA/JESD22-A115-A exceeds 200 V – CDM EIA/JESD22-C101 exceeds 1000 V. Low power dissipation Balanced propagation delays Very small 5-pin package Output capability: standard Specified from 40 to +125 C ...

Page 3

... NAND gate FUNCTION TABLE See note Note HIGH voltage level LOW voltage level. ORDERING INFORMATION TYPE NUMBER TEMPERATURE RANGE 74AHC1G00GW 40 to +125 C 74AHCT1G00GW 40 to +125 C 74AHC1G00GV 40 to +125 C 74AHCT1G00GV 40 to +125 C PINNING PIN SYMBOL ...

Page 4

... Philips Semiconductors 2-input NAND gate handbook, halfpage GND MNA096 Fig.1 Pin configuration. 1 handbook, halfpage & 2 MNA098 Fig.3 IEC logic symbol. 2002 May handbook, halfpage Y 4 handbook, halfpage 4 4 Product specification 74AHC1G00; 74AHCT1G00 MNA097 Fig ...

Page 5

... Philips Semiconductors 2-input NAND gate RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER V supply voltage CC V input voltage I V output voltage O T operating ambient amb temperature input rise and fall times LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). ...

Page 6

... Philips Semiconductors 2-input NAND gate DC CHARACTERISTICS Family 74AHC1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER V HIGH-level input IH voltage V LOW-level input IL voltage V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage LI current I quiescent supply CC current C input capacitance I 2002 May 27 ...

Page 7

... Philips Semiconductors 2-input NAND gate Family 74AHCT1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER V HIGH-level input IH voltage LOW-level input V IL voltage V HIGH-level output V OH voltage LOW-level output V OL voltage input leakage V LI current ...

Page 8

... Philips Semiconductors 2-input NAND gate AC CHARACTERISTICS Type 74AHC1G00 GND = 3.0 ns SYMBOL PARAMETER V = 3.0 to 3.6 V; note propagation delay PHL PLH A and 4.5 to 5.5 V; note propagation delay PHL PLH A and Notes 1. Typical values 3 Typical values ...

Page 9

... Philips Semiconductors 2-input NAND gate AC WAVEFORMS handbook, halfpage V INPUT I FAMILY REQUIREMENTS AHC1G GND AHCT1G GND to 3.0 V Fig.5 The inputs (A and B) to output (Y) propagation delays. handbook, halfpage Definitions for test circuit Load capacitance including jig and probe capacitance (see Chapter “AC characteristics”). ...

Page 10

... Philips Semiconductors 2-input NAND gate PACKAGE OUTLINES Plastic surface mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT max 0.30 0.25 1.1 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT353 2002 May scale ( ...

Page 11

... Philips Semiconductors 2-input NAND gate Plastic surface mounted package; 5 leads DIMENSIONS (mm are the original dimensions) UNIT 0.100 0.40 0.26 1.1 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC SOT753 2002 May scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2.5 0.2 REFERENCES JEDEC ...

Page 12

... Philips Semiconductors 2-input NAND gate SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). ...

Page 13

... Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “ ...

Page 14

... May 27 (2) This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specifi ...

Page 15

... Philips Semiconductors 2-input NAND gate 2002 May 27 74AHC1G00; 74AHCT1G00 NOTES 15 Product specification ...

Page 16

... Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. ...

Related keywords