74AHCT04D Philips Semiconductors, 74AHCT04D Datasheet

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74AHCT04D

Manufacturer Part Number
74AHCT04D
Description
Manufacturer
Philips Semiconductors
Datasheet

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Part Number:
74AHCT04D
Manufacturer:
PHILIPS/飞利浦
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20 000
Part Number:
74AHCT04D
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NXP
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Product specification
Supersedes data of 1999 Feb 25
File under Integrated Circuits, IC06
DATA SHEET
74AHC04; 74AHCT04
Hex inverter
INTEGRATED CIRCUITS
1999 Sep 27

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74AHCT04D Summary of contents

Page 1

DATA SHEET 74AHC04; 74AHCT04 Hex inverter Product specification Supersedes data of 1999 Feb 25 File under Integrated Circuits, IC06 INTEGRATED CIRCUITS 1999 Sep 27 ...

Page 2

... Philips Semiconductors Hex inverter FEATURES ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V Balanced propagation delays Inputs accepts voltages higher than V CC For AHC only: operates with CMOS input levels For AHCT only: operates with TTL input levels Specified from 40 to +85 and +125 C ...

Page 3

... Philips Semiconductors Hex inverter ORDERING INFORMATION OUTSIDE NORTH NORTH AMERICA AMERICA 74AHC04D 74AHC04D 74AHC04PW 74AHC04PW DH 74AHCT04D 74AHCT04D 74AHCT04PW 74AHCT04PW DH handbook, halfpage GND MNA340 Fig.1 Pin configuration. handbook, halfpage ...

Page 4

... Philips Semiconductors Hex inverter RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER V DC supply voltage CC V input voltage I V output voltage O T operating ambient temperature amb range input rise and fall times except r f for Schmitt-trigger inputs LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). ...

Page 5

... Philips Semiconductors Hex inverter DC CHARACTERISTICS 74AHC family Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). SYMBOL PARAMETER V HIGH-level input IH voltage V LOW-level input IL voltage V HIGH-level output OH voltage; all outputs HIGH-level output voltage V LOW-level output OL voltage; all outputs LOW-level output voltage ...

Page 6

... Philips Semiconductors Hex inverter 74AHCT family Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). SYMBOL PARAMETER V HIGH-level input IH voltage LOW-level input V IL voltage V HIGH-level output V OH voltage; all I outputs HIGH-level output V voltage I V LOW-level output V OL voltage; all I outputs ...

Page 7

... Philips Semiconductors Hex inverter AC CHARACTERISTICS Type 74AHC04 GND = 3.0 ns SYMBOL PARAMETER V = 3.0 to 3.6 V; note propagation PHL PLH delay 4.5 to 5.5 V; note propagation PHL PLH delay Notes 1. Typical values 3 Typical values 5 Type 74AHCT04 GND = 0 V ...

Page 8

... Philips Semiconductors Hex inverter AC WAVEFORMS handbook, halfpage V INPUT I FAMILY REQUIREMENTS AHC GND AHCT GND to 3.0 V handbook, full pagewidth GENERATOR TEST open PLH PHL PLZ PZL GND PHZ PZH 1999 Sep ( INPUT GND t PHL ...

Page 9

... Philips Semiconductors Hex inverter PACKAGE OUTLINES SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...

Page 10

... Philips Semiconductors Hex inverter TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.10 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

Page 11

... Philips Semiconductors Hex inverter SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages ...

Page 12

... Philips Semiconductors Hex inverter Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE BGA, LFBGA, SQFP, TFBGA HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS (3) PLCC , SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect) ...

Page 13

... Philips Semiconductors Hex inverter 1999 Sep 27 74AHC04; 74AHCT04 NOTES 13 Product specification ...

Page 14

... Philips Semiconductors Hex inverter 1999 Sep 27 74AHC04; 74AHCT04 NOTES 14 Product specification ...

Page 15

... Philips Semiconductors Hex inverter 1999 Sep 27 74AHC04; 74AHCT04 NOTES 15 Product specification ...

Page 16

... Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel ...

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