BLM21AG601SN1

Manufacturer Part NumberBLM21AG601SN1
ManufacturerMurata
BLM21AG601SN1 datasheet
 


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!Note
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
EMIFILr (Soldering and Mounting)
Continued from the preceding page.
o Reflow Soldering
NFE61P
NFE61H
Chip mounting side
2.0
4.8
8.8
oReflow and Flow
DLM2HG
DLP31S
DLP31D
DLP11S
DLW21S
DLW21H
DLW31S
DLW5AH
DLW5BS
oReflow Soldering
6
136
Back side
Small diameter thru hole
Connect to ground pattern
ø0.4-ø0.6
of mounting side
Ground pattern
DLM2HG
DLP31S
1.0
4.0
1.0 0.6 1.0
DLP11S
0.55
1.95
DLW5AH/5BS
0.9
2.9
5.5
C31E9.pdf 03.3.12
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
o Flow Soldering (Except NFE61H3321)
Back side
Chip mounting side
Small diameter thru hole
Connect to ground pattern
ø0.4-ø0.6
of mounting side
Ground pattern
1.5
3.8
4.8
9.0
DLP31D
2.8
0.8 pitch
DLW21/DLW31S
3
a
b
Series
a
b
c
DLW21S/H
0.8
2.6
0.4
DLW31S
1.6
3.7
0.4
1 : If the pattern is made with wider than 1.2mm (DLW21) /
1.6mm (DLW31S) it may result in components turning
around, because melting speed is different. In the worst
case, short circuit between lines may occur.
2 : If the pattern is made with less than 0.4mm, in the worst
case, short circuit between lines may occur due to spread
of soldering paste or mount placing accuracy.
3 : If the pattern is made with wider than 0.8mm (DLW21) /
1.6mm (DLW31S), the bending strength will be reduced.
With gild pattern, excess soldering heat may disolve metal of a
copper wire.
Continued on the following page.
(in mm)
0.4
d
1.2
1.6