BLM21AG601SN1

Manufacturer Part NumberBLM21AG601SN1
ManufacturerMurata
BLM21AG601SN1 datasheet
 


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Page 138/163:

Solder Paste Printing and Adhesive Application

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!Note
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
Continued from the preceding page.
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack. In contrast, if too little solder is applied,
there is the potential that the termination strength will be
insufficient, creating the potential for detachment.
Standard land dimensions should be used for resist and
Series
oEnsure that solder is applied smoothly to a
BLM
BLA
minimum height of 0.2mm to 0.3mm at the end
surface of the part.
oCoat the solder paste a thickness:
100-150 m: BLM03
100-200 m: BLM15/18/21/31/41, BLA
oUse H60A solder for pattern printing.
NFM
NFR
oCoat the solder paste a thickness:
NFL
100-150 m: NFM18/21/3D,NFR, NFL
VFM
100-200 m: NFM41,VFM
NFM18C/18P
NFL18ST
0.4
1.0
2.2
NFM3DC/3DP
1.0
2.5
3.9
o Use H60A solder for pattern printing.
NFA
oCoat the solder paste a thickness: 100-200 m
NFA31G/NFA31C
EMIFILr (Soldering and Mounting)
copper foil patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
Solder Paste Printing
NFL18SP
NFM21C/21P
NFR21G/NFL21S
0.6
0.4
1.4
1.0
2.6
2.0
NFM41C/41P/VFM
1.5
3.5
5.5
2.6
0.6
0.3
0.8pitch
C31E9.pdf 03.3.12
Adhesive Application
Coating amount is illustrated in the
following diagram.
m
a:20
70 m
m
b:30
35 m
m
c:50
105 m
Chip Solid Inductor
a
b
Bonding agent
PCB
Land
Apply 0.1mg for NFM41C/41P/VFM and
0.06mg for NFM3DC/3DP of bonding
agent at each chip. Do not cover
electrodes.
Bonding agent
Coating position of
bonding agent
Continued on the following page.
(in mm)
c
6
137