BLM21AG601SN1

Manufacturer Part NumberBLM21AG601SN1
ManufacturerMurata
BLM21AG601SN1 datasheet
 


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Page 141/163:

BLM, BLA NFM, NFL, NFR

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!Note
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
EMIFILr (Soldering and Mounting)
Continued from the preceding page.
(3) Soldering Conditions
(4) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating
Soldering iron power output
Temperature of soldering iron tip / Soldering time : 280 C
max./10s max. or 300 C max./3s max.*
*NFE31PT152Z1E9/VFM : 280 C max./10 s max. only
BLM : 350 C max./3 s max.
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with to soldering iron,
please contact Murata engineering.
4. Cleaning
Following conditions should be observed when cleaning
chip EMI filter.
(1) Cleaning Temperature : 60 C max. (40 C max. for
alcohol type cleaner)
(2) Ultrasonic
Output
: 20W/liter max.
6
Duration
: 5 minutes max.
Frequency : 28kHz to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
Do not clean DLW21S/31S/5AH/5BS series.
In case of cleaning, please contact Murata engineering.
a) Alcohol cleaning agent
Isopropyl alcohol (IPA)
140
oFlow Solder
BLM(Except BLM03/15), BLA31
NFM3DC/P, NFM41C/P,
NFW31S, NFE61P/H*,
DLM2HG, DLP31D/31S
VFM
*
Except NFE61HT332
oReflow Solder
: 150 C 60 s min.
: 30W max.
NFE31/61
BLM, BLA
NFM, NFL, NFR
NFW, NFA, DLM/P/W
VFM
b) Aqueous cleaning agent
Surface active agent (Clean Thru 750H)
Hydrocarbon (Cold Cleaner 375)
High grade alcohol (Pine Alpha ST-100S)
*VFM41R series cannot be cleaned with high grade
alcohol type aqueous cleaning agent.
Alkaline saponifier (Aqua Cleaner 210SEI-cleaner
should be diluted within 15% using deionized water.)
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
(5) Some products may become slightly whitened.
However, product performance or usage is not affected.
For additional cleaning methods, please contact Murata
engineering.
C31E9.pdf 03.3.12
Gradual cooling
Pre-heating
Soldering
(in air)
300
Max. Temp. 250 C
250
200
150
100
50
0
60s Min.
T
Pre-heating
Soldering
Soldering
Series
(150 C)
Time(T)
Temp.(C)
10s max.
60s min.
5s max.
Gradual cooling
Pre-heating
Soldering
(in air)
300
250
Max. Temp. 230 C
230 C
200
183 C
150
100
50
0
T2
60s Min.
T1
Soldering Time
Pre-heating
Series
(150 C)
T1(183 C)
T2(230 C)
250 C,20s max.
20s max.
60s min.
60s max.
10s max.
250